• Journal of the Korea Convergence Society
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• v.13 no.4
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• pp.271-278
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• 2022

Carbonated drinks are a kind of drink that is popular in our daily lives and are sold mainly among young people. There are many brands of carbonated drinks currently on sale, and most of them emphasize the distinction of texture, and brand images and packages have further commercialized package design as a whole. It is necessary to increase the emotional experience of soda package design, which can increase the added value of the brand. Sensibility is the most common psychological experience in humans and is the subjective experience and feeling of things. By combining the emotional experience with the package design of carbonated drinks, it provides more emotional user experience while purchasing carbonated drinks, realizing diversification of product package designs and satisfying consumers' emotional needs. This paper first examines the package design of carbonated drinks, I hope it will be an implication if you increase the emotional experience of soda package design.

• Journal of Mechanical Science and Technology
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• v.18 no.3
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• pp.357-369
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• 2004

The purposes of the paper are to analyze the fracture phenomenon by delamination and cracking when the encapsulant of plastic IC package with polyimide coating shows viscoelastic behavior under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by the approaches of stress analysis and fracture mechanics. The model is the plastic SOJ package with the polyimide coating surrounding chip and dimpled diepad. On the package without cracks, the optimum position and thickness of polyimide coating to decrease the maximum differences of strains at the bonding surfaces of parts of the package are studied. For the model delaminated fully between the chip and the dimpled diepad, C(t)-integral values are calculated for the various design variables. Finally, the optimal values of design variables to depress the delamination and crack growth in the plastic IC package are obtained.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.1141-1144
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• 1998

A new design methodology for the shortchannel CMOS IC-package is presented. It is developed by representing the package inductance with an effective lumpedinductance. The worst case maximum-simultaneous-switching noise (SSN) and gate propagation delay due to the package are modeled in terms of driver geometry, the maximum number of simultaneous switching drivers, and the effective inductance. The SSN variations according to load capacitances are investigated with this model. The package design techniques based on the proposed guidelines are verified by performing HSPICE simulations with the $0.35\mu\textrm{m}$ CMOS model parameters.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.05a
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• pp.177-182
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• 2004

Electronic products are subjected to many different types of shock environment. As the Optical Disc Drive (ODD) market grows, the number of failures related to shock increases. Therefore, it is necessary to improve the performance of cushion package as well as the product design. Cushion materials such as expanded polystyrene are often used to protect electronic products from shock environment. In this paper, the drop analysis of the cushion package f3r optical disc drives was carried out with the explicit method of LS-DYNA and verified by the drop test. For the optimization of package, response surface approximation model was created using central composite design. As a result, cushioning performance was improved under the critical condition and practical design guidelines of cushion package were suggested.

• Proceedings of the Korea Society of Design Studies Conference
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• 1998.04a
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• pp.16-17
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• 1998

• Cartoon and Animation Studies
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• s.45
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• pp.283-298
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• 2016

Design is a fatal factor to differentiate and survive one product from the other in fierce competition of the market, when other conditions such as price or quality makes no much difference. Among many marketing tools, package design is known as a direct communication that visualizes and forms the very initial brand image of a product. Package design is not only for packing, transporting, storing and loading but for engraving the brand image in a consumers' mind and lead them to purchasing. One of recent package design trands is various ways of using character, not just as a printed image on the surface but as a part of three dimensional structure of package. If it succeed, the package design could give out the secondary fun and impact to the consumers. The package design with an effective character is itself a great marketing tool and valuable design asset, which can bring a further profit to the company. Especially, character-package can be a powerful and effective marketing method for various local products, in needs of further publication and sales with limited cost. It should motivate the sales of the products by grabbing their attention and taken as a souvenir. This research takes a character package as a useful marketing method for a local brand in Jeonju, South Korea, and tries to design a three dimensional package using its own character. Through the process, the research aims to propose an important design strategy for repositioning or enhancing an existing brand.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.11
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• pp.55-63
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• 1999

A new CMOS If Package design methodology is presented, analyzing the electrical characteristics of a package and its effects on the CMOS digital circuits. An analytical investigation of the package noise effects due to the simultaneous switching of the gates within a chip, i.e., simultaneous switching noise (SSN) is performed. Then not only are novel design formula to meet electrical constraints of the Package derived, but also package design methodology based on the formula is proposed. Further, in order to demonstrate the Proposed design methodology, the design results are compared with HSPICE (a general purpose circuit simulator) simulation for $0.3\mu\textrm{m}$-based CMOS circuits. According to the proposed design procedures, it is shown that the results have excellent agreements with those of HSPICE simulation.

• The Journal of the Korea Contents Association
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• v.12 no.1
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• pp.185-196
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• 2012

This study of the emotional image of the package design of Tea drink. Above all, Collects the packages of tea drink in the Chinese market. Investigate the taste adjectives with about the package design of Tea drink. And 'Sweet. Bitter, refreshing, sour 'four major taste adjectives were deduced. Next, Investigate the level with the taste adjectives of the package design of tea drink and the affinity of package design of tea drink. Finally, Analyzed the distinction of visual elements with the taste adjectives of the package design of tea drink. And, Analyzed the distinction of visual elements according to impact of preference of the package design of tea drink.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.3 s.96
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• pp.25-29
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• 1999

The lead frame manufactured by press stamping process, is an important part of semiconductor. The recent technical trend of semiconductor, chip sized and high performance package technology, requires the lead frame to be of more multi-leads and of fine ILP (Inner Lead Pitch). As the ILP is getting finer, its corresponding punch of the stamping die is getting narrower. The punch narrower than its stamping limit has been broken due to local buckling. This paper analyzed the phenomena of punch breakdown. Moreover, the punch design was modified to increase the critical limit of buckling force. This paper, also, suggested new design rules of the punch, which asks the modification of its lead frame design that has to be considered in the stage of semiconductor package design. The new design rules of lead frame design yields a good reliability of semiconductor package as well as a good quality of lead frame.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.1
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• pp.51-59
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• 1998

The purposes of the paper are to consider the failure phenomenon based on delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process is on elastic and viscoelastic behavior due to the temperature and to show the optimum design using fracture mechanics. The model for analysis is the plastic SOJ package with a dimpled diepad. The package model with the perfect delamination between chip and diepad is chosen to estimate the resistance to fracture by calculating J-integrals in low temperature and C(t)-integrals in high temperature with the change of the design under hygrothermal loading. The optimum design to depress the delamination and crack in the plastic IC package is presented.