• 한국가정과교육학회지
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• 제8권1호
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• pp.59-78
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• 1996

The purpose of this study were to investigate adolescents’level of stress, and coping behavior of stress as related to socio-demographic variables. The subjects were 270 first-grade middle school students and 258 first-grade high school students in Ansan. The data were analyzed by S.A.S. Program Package, the statistical methods of Frequency, Percentage, Mean, Standard deviation, T-test, One-way Anova, DMR(Duncan’s Multiple Range Test) The results of this study were as followed：1) The general tendency of adolescents’level of stress, and coping behavior of stress were that high school students experienced more stress than middle school students and both experienced more stress in school life than in family life. 2) According to personal variable, there were differences in the grade and scholarly attainment in the low-level stress group. According to parents variables, the level of stress differed significantly according to mother’s school career and father’s occupation in the low-level-stress group. There was significant difference in accordance with mother’s occupation in the high-level-stress group. 3) The coping behavior of stress according to adolescent variables differed significantly according to grades, the monthly income of the household, mother’s level of education and the father’s occupation.

• 경영과정보연구
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• 제2권
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• pp.237-266
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• 1998

The purpose of this study was to analyze the differences of application level the computer programming languages in major. The method of this study is the empirical method based on theoretical one with the previous bibliographical suduies. The sample consists of 268 listed university disclosing over the period of Dec. 1. 1997 to Du. 15. 1997. The samples were 10 university in university of Seoul, Pusan, Masan City, Korea. The data were collected by questionnaire research through interview with each person. The analysis data was carried to 268 samples by using SPSS/PC for Windows Version 7.5 statistical package. Statistical methods such as frequency analysis, chi-square test, ANOVA test, correlation analysis were used to test the research questions. This paper focuses on the design of the hypothesis test show that the 2 type are significantly different in major of university students. Before the test of research questions performed it frequency analysis by using the factor score that bring each items. The research type of 2 guoups, that is, BA Group(business administration group) and NBA Group(non-business administration guoup). To summarize the result of this study is as follows ; (1) Hypothesis 1 : Concerning about computer programming language in major, the significant difference is application the present condition. (2) Hypothesis 2 : Concerning about computer programming language in major, the significant difference is application level. (3) Hypothesis 3 : Concerning about each application software in major, the significant difference is application level. According to the results of this study, it is found that (1) Hypothesis 1 related In application the present condition of computer programming language was accepted its all at 0.05 % significance level. (2) Hypothesis 2 related to application level of computer programming language was accepted its all at 0.05 % significance level. (3) Hypothesis 3 related to application level of each application software was rejected its all. at 0.05 % significance level.

• 전자공학회논문지
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• 제50권9호
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• pp.60-67
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• 2013

다양한 Intellectual Property(IP)로 이루어진 복잡한 SoC 테스트에 있어 테스트 비용 절감은 필수적이다. 본 논문에서는 IEEE Std. 1500과 IEEE Std. 1149.7 인터페이스를 사용하여 적은 수의 핀 수로 IP 기반의 System-on-a-Chip(SoC) 테스트를 가능케 하는 테스트 구조를 제안한다. IEEE Std. 1500은 IP 기반의 SoC 테스트에 있어 각 IP를 테스트할 수 있는 독립된 접근 경로를 제공한다. 본 논문에서는 이러한 독립된 테스트 경로를 IEEE Std. 1149.7로 제어 가능하도록 구성함으로서 SoC의 테스트 핀 수를 2 핀으로 줄일 수 있게 한다. 본 기술은 Wafer 및 Package 수준 테스트에 요구되는 테스트 핀 수를 줄임으로서 동시에 테스트 가능한 대상회로의 수를 늘릴 수 있고, 결과적으로 전체적인 양산 테스트 비용을 크게 절감할 수 있게 한다.

• 한국정밀공학회지
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• 제9권4호
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• pp.13-21
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• 1992

Standards concerning the determination of positioning accuracy and repeatability of numerically controlled(NC) machine tools have been published relentlessly over the last 20 years. Since the publication in 1988 of the International Standard 230-2 there has been a pronounced move, both at national and international standards level, to embrace further test procedures for a complete machine tool performance assessment. For example, measurements of angular (pitch, roll, and yaw) and straightness errors along linear axes are now commonplace and complement the existing positioning accuracy and repeatablity tests. More recently the subject of circularity evalutaion has also gained considerable interest. Here dynamic tests, using a kinematic ballbar or circular masterpiece, give an instant overview of the contouring ability of the machine in two axes at specific feedrates. This information is extremely important in optimising machining accuracy. This paper describes moves to complete the machine calibration package in national and international standardis- ation for the assessment of machine tool performance.

• 농촌지도와개발
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• 제5권1호
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• pp.113-122
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• 1998

Community Attachment variables(specially, system model variables : gender, age, education, income, number of children, marital status, length of residence, and job) have been tested. The data for this study were collected from 295 residents of Yesan in Chungnam. The SPSSWIN package was utilized for data analysis. Frequency, percent, t-test, and ANOVA were utilized for statistical analysis. Each hypothesis was tested at .01, .05, and 01 level. The major findings of this study were: 1) the range of community attachment score was $17{\sim}56$. The mean score of community attachment was 29.8 with a standard deviation of 5.34. 2) t-test showed that job was statistically significant at .05 level among gender, marital status, and job. 3) length of residence, age, and numbers of children were statistically significant at .05, .10, and .01, respectively.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.53-58
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• 2003

The Wafer Level Packaging is one of the most important technologies in the semiconductor industry today. Its primary advantages are its small form factor and low cost potential for manufacturing including test procedure. The CASIO's WLP samples, application example and the structure are shown in Fig.1, 2&3. There are dielectric layer , under bump metal, re-distribution layer, copper post , encapsulation material and terminal solder .The key technologies are 'Electroplating thick copper process' and 'Unique wafer encapsulation process'. These are very effective in getting electrical and mechanical advantages of package. (Fig. 4). CASIO and CMK are developing a new System Packaging technology called the Embedded Wafer Level Package (EWLP) together. The active components (semiconductor chip) in the WLP structure are embedded into the Printed Wiring Board during their manufacturing process. This new technical approach has many advantages that can respond to requirements for future mobile products. The unique feature of this EWLP technology is that it doesn't contain any solder interconnection inside. In addition to improved electrical performance, EWLP can enable the improvement of module reliability. (Fig.5) The CASIO's WLP Technology will become the effective solution of 'KGD problem in System Packaging'. (Fig. 6) The EWLP sample shown in Fig.7 including three chips in the WLP form has almost same structure wi_th SoC's. Also, this module technology are suitable for RF and Analog system applications. (Fig. 8)

• 한국전자파학회지:전자파기술
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• 제24권2호
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• pp.51-57
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• 2013

The current expanding mobile markets incessantly demands small form factor, low power consumption and high aggregate throughput for silicon-level integration such as memory to logic system. One of emerging solution for meeting this high market demand is 3D through silicon stacking (TSS) technology. Main challenges to bring 3D TSS technology to the volume production level are establishing a cost effective supply chain and building a reliable manufacturing processes. In addition, this technology inherently help increase number of IOs and shorten interconnect length. With those benefits, however, potential signal and power integrity risks are also elevated; increase in PDN inductance, channel loss on substrate, crosstalk and parasitic capacitance. This paper will report recent progress of wide IO memory to high count TSV logic device assembly development work. 28 nm node TSV test vehicles were fabricated by the foundry and assembled. Successful integration of memory wide IO chip with less than a millimeter package thickness form factor was achieved. For this successful integration, we discussed potential signal and power integrity challenges. This report demonstrated functional wide IO memory to 28 nm logic device assembly using 3D package architecture with such a thin form factor.

• 방사성폐기물학회지
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• 제5권3호
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• pp.199-212
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• 2007

IP-2형 운반용기는 정상운반조건에서의 자유낙하시험 및 적층시험을 수행한 후에 운반내용물의 분산 및 유실이 없어야 하며 외부표면에서의 방사선량률이 20%이상 증가할 수 있는 차폐능력의 상실이 없어야 한다. 본 연구에서는 두꺼운 철판을 구조재로 사용하며 볼트체결방식의 뚜껑을 가진 IP-2형 운반용기에 대한 구조 안전성을 평가하기 위한 해석적인 방안을 제안하였다. 해석적인 방법을 통하여 원자력발전소에서 발생된 방사성폐기물 드럼을 폐기물 처리시설에서 임시저장고까지 운반하기 위한 두 종류의 IP-2형 방사성폐기물 운반용기에 대하여 자유낙하조건에서 운반내용물의 분산 및 유실과 차폐손실이 없음을 확인하였다. 자유낙하조건에서 운반내용물의 분산 및 유실을 평가하기 위하여 최대 볼트단면 평균응력값과 최대 뚜껑열림량을 볼트의 인장강도와 뚜껑부에 존재하는 단차와 비교 평가하였다. 또한 최대 차폐두께 감소량을 이용하여 차폐손실을 평가하였다. 자유낙하조건에 대한 동적충돌해석을 검증하고 구조 안전성을 시험적으로 평가하기 위하여 자유낙하시험을 다양한 방향으로 실시하였다. 자유낙하시험에서는 운반내용물의 분산 및 유실은 볼트체결방식의 뚜껑에서 볼트의 파손 및 플랜지의 변형 등을 검사하여 평가하였으며, 차폐손실은 초음파 두께 측정기를 이용한 차폐두께를 측정하여 평가하였다. 해석에 대한 검증을 위하여 시험에서 취득한 변형률과 가속도를 동일한 위치에서 얻어진 해석결과와 비교하였다. 해석결과는 시험결과에 비하여 보수적인 결과를 보여주므로 해석에서 입증한 IP-2형 방사성폐기물 운반용기의 안전성은 보수적인 결과이다. 마지막으로 유한요소해석을 통하여 적층조건에 대한 IP-2형 방사성폐기물 운반용기는 안전함을 입증하였다.

• International Journal of Human Ecology
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• 제7권1호
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• pp.85-95
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• 2006

The purpose of this study was to examine differences in clothing shopping orientation among female adults according to their level of self-esteem and body cathexis. The subjects included 460 women ranging in age from 20 to 69, living in the Daegu area. The data was analyzed by frequency, factor-analysis, mean calculation, ANOVA and the Duncan-test using the SPSS-package. The overall results are as follows: First, clothing shopping orientation fell into five categories: 'hedonic', 'trend conscious', 'store-patronizing', 'economic', and 'independent' shopping orientation. Second, there were measurable differences in clothing shopping orientation related to one's level of self-esteem. Third, there was a significant difference in clothing shopping orientation according to the one's level of body cathexis. It appears that high levels of body cathexis do predict a tendency towards a more 'independent' clothing shopping orientation.

• 한국보건간호학회지
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• 제10권1호
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• pp.23-30
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• 1996

The purpose of study is to find out common factors and variables that affect common factors in level of right knowledge. attitude behavior with respect to AIDS. During the period form Apr.1. 1995 to Jun. 30. guestionnaires, written both in Korean and English. were distributed to Korean Malaysion employees woring at a certain Korean Video companies. and results of replies. given by 80 workers by country. were used as the research matrials. The gathered marials were analyzed through the SPSS package t-test. ANOVA. factor analysis. and the following results were obtained. The 4 extracted common factors could be named 'general publicity', 'transmissive knowledge', 'diagnosis. prevention'. and 'limitted publicity'. The means of trasimssive knowledge. diagnosos. prevention. limtted publicity factors showed higher means in groups who had beyond university level of education than in showed higher means in groups who beyond university level of education than in groups who had below high school level of education. There was a significant relationship between general publicity factor and econmic state. and between limitted publicity factor and preventive education