• Science of Emotion and Sensibility
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• v.25 no.4
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• pp.53-62
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• 2022

This study was conducted to investigate the effects of the gloss of a product's packaging on purchase intention and the mediating role of perceived corporate eco-friendliness and perceived quality in food area. The participants were randomly assigned to product package condition (glossy vs. matte) and after observing ketchup and potato chips, they responded to questions on about perceived corporate eco-friendliness, perceived quality, and purchase intention. The participants reported their opinion that companies that manufactured matte package products would likely use more organic ingredients and would be more eco-friendly than companies that manufactured glossy package products. The more the participants perceived a company to be eco-friendly, the better they evaluated the company's product quality and the higher their purchase intention. This study has theoretical and practical implications, in that it extends the study of the product package in relation to its effect on corporate image, and it proposes a practical use of matte product package for improving the eco-friendly image of the company. Limitations and further research were also discussed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.67-73
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• 2006

A system in package (SiP) generally contains a variety of systems such as analog, digital, optical and micro-electro-mechanical systems, integrated in a system-level package connected through a substrate. However, there are many electrical and mechanical reliability issues including the reliability issue for embedded structures. A mismatch of thermal coefficients of expansion among packaging materials and devices can lead to warping or delamination in the package. In this study, the effect of material properties of underfill, such as Young's modulus and CTE, are investigated through FEM simulation. Experimental investigation on the warpage of the package is also carried out to verify the simulation results. The results show that the reliability of the system in package is closely related to the material properties of underfill. The results of this study provide a good guidance for the material selection when designing the system in package.

• The Journal of the Korea Contents Association
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• v.7 no.4
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• pp.259-267
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• 2007

The visual activity comes first in the commodities marketing, which emphasizes the importance of the external appearance of package. Package expresses all the visual characters including colors, logos, phrases, and specific features and other design qualities. Package gives the first impression of these features strongly to the viewers. I surveyed and analyzed the objective factors of visual phenomena in seeing and recognizing goods. Especially I tried to deal with the theoretical background and purchase behavior of consumers. I also tried to find out what the first and largest stimuli are when consumers buy goods. In addition to this, I analyzed the priority order of those elements to give reference to others who would design package.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.11
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• pp.18-28
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• 1999

A new equivalent circuit model of package (SOP, Small Outline Package) is presented for designing radio frequency integrated circuits (RFIC). In the RF region, the paddle of a package does not work as an ideal ground. Further parasitics due to both coupling and loss have a substantial effect on MMIC. The equivalent circuit model and parameter extraction methodology for the electrical characteristics of the package are described by illustrating the SOP type packages. The accuracy of the model is evaluated by comparing the s-parameters of the commercial full-wave solver and those of HSPICE simulation with the circuit model. The proposed model shows an excellent agreement with full-wave analysis up to about 8GHz.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.6
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• pp.951-960
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• 1997

Package crack caused by the soldering process in the surface mounting plastic package is evaluated by applying the maximum energy release rate criterion. It could be shown that the crack propagation from the lower edge of the ie pad is easily occurred at the maximum temperature during the soldering process, where the pressure acting on the crack surface is assumed by the saturated vapor pressure at maximum temperature. The package crack formation depends on various parameters such as chip size, relative thickness, material properties, the moisture content and soldering temperature etc. The quantitative measure of the effects of the parameters could be easily obtained by using the taguchi's method which requires only a few kinds of combinations with such parameters. From the results, it could be obtained that the more significant parameters to effect the package reliability are the orders of Young's modulus, die pad size, down set, chip thickness and maximum soldering temperature.

• Journal of the Korean Society of Food Science and Nutrition
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• v.27 no.6
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• pp.1086-1093
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• 1998

The antimicrobial effect of mixed solutions of grapefruit seed extract(250ppm) and ascorbic acid(1%) on the spoilage microorganisms such as Staphylococcus epidermis, Escherichia coli, Pseudomonas syringae, Candida albicans and Corynebacterium xerosis isolated from the spoiled soybean sprouts were investigated. Cell wall and membrane were partially destroyed and the contents of the destroyed cell were exuded after treatment. Packages with 30 m cast polypropylene(CPP), 16 m polyolefin(RD 106) and 10 m high density polyethylene(HDPE) were applied for soybean sprouts dipped in mixed solutions respectively. Oxygen and carbon dioxide concentration inside packages were dependent on the kind of films during storage at 5oC. The antimicrobial activity of mixed solutions was maintained for 5 days at CPP package. Package with HDPE showed a severe browning than the others after 5 days. Ascorbic acid content of mixed solution treatment was higher than that of control for each package.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.54 no.7
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• pp.315-318
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• 2005

The effect of plasma cleaning was examined on package delamination phenomena in the integrated circuit (IC) packaging process. Without plasma cleaning, delamination was observed for all three experimental treatments applied after the packaging step, which include bake of If, reflow, and bake of If followed by reflow However, no delamination was observed when the plasma cleaning was performed before and after the wire bonding step. Plasma cleaning was found to be a critical step to improve the reliability of the package by reducing the possibility of contact failure between die pad and bonding wire.

• Land and Housing Review
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• v.11 no.1
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• pp.95-101
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• 2020

In the past few decades, the global population growth and rapid economic development have resulted in significant increases in building energy consumption. To reduce greenhouse-gas emissions and building energy consumption, building materials and energy technologies must be optimized. Building retrofitting is a more efficient method than reconstruction to improve the building energy performance. In order to improve the energy performance of existing buildings, this study proposed energy-efficiency retrofit plans and derived cost-effective retrofit plan. The energy efficient retrofit method is achieved through the packaging of energy technology and the energy and cost reduction effect of the energy efficiency retrofit package are analyzed. As a result of the study, the energy-efficiency retrofit package showed an energy reduction effect of up to 60% or more and a construction cost reduction of about 30%. This study argues that optimal energy and construction cost reduction of existing buildings are possible through the packaging of energy efficiency technology.

• Journal of the Korean Graphic Arts Communication Society
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• v.29 no.3
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• pp.31-40
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• 2011

Using of QR(Quick Response) code is dramatically extended to various marketing area; not only substitute of bar code but also new tool of PR and marketing. This research attempts to analyze brand communication effect using QR code printed on product package especially in snack product category. Findings are 1) communication effect are different according to the type of book-trailers; 2) cinematic production and animation are the most effective type of book-trailers; 3) for memory and confirmation(sharing), a)stills and straplines, Analysis result of hypothesis I showed that characters of QR code influence on brand attitude. Among dependent variables, only reliability is significant. That means reliability of company and brand using QR code influence on brand attitude. The higher reliability of QR code, the better brand attitude of the brand. Analysis result of hypothesis II found that only reliability is significant on purchasing intention. Reliability of company and product using QR code influences on purchasing intention. The higher reliability of QR code, the higher possibility of purchasing products. Therefore, company can enhance reliability of both company and its products by using QR code. Using QR code will bring high reliability and high brand attitude and purchasing intention.

• Knowledge Management Research
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• v.20 no.2
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• pp.1-24
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• 2019

This tutorial introduces procedures and methods for performing structural equation modeling using R. To do this, we present advanced analysis methods based on structural equation model such as mediation effect analysis, moderation effect analysis, moderated mediation effect analysis, and multiple-group analysis with R program code using R lavaan package that supports structural equation modeling. R is flexible and scalable, unlike traditional commercial statistical packages. Therefore, new analytical techniques are likely to be implemented ahead of any other statistical package. From this point of view, R will be a very appropriate choice for applying new analytical techniques or advanced techniques that researchers need. Considering that various studies in the social sciences are applying structural equations modeling techniques and increasing interest in open source R, this tutorial is expected to be useful for researchers who are looking for alternatives to existing commercial statistical packages.