• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 1997년도 춘계학술대회 논문집
• /
• pp.285-288
• /
• 1997

Generally the high dielectric films, such as PZT(Pb(Z $r^{1-x}$ $Ti_{x}$ ) $O_3$) and BST(B $a_{l-x}$S $r_{x}$ Ti $O_3$) have been formed on the Pt thin films. However it is generally known that the dry etching of Pt is difficult because of its chemical stability. So, the dry etching of Pt remains at the preliminary work. Therefore, in this study, Pt etching mechanism was investigated with Ar/C $l_2$gas plasma by using XPS(X-ray photoelectron spectroscopy) and QMS(Quadrupole mass spectrometry). Ion current density was measured with Ar/C $l_2$gas plasma by using single Langmuir probe. XPS results shoved that the atomic % of Cl element on the etched Pt sample increased with increasing Ar/(Ar+C $l_2$). And QMS results showed that the increase of Ar partial pressure in the plasma resulted in the improvement of C $l_2$dissociation and Cl redical formation and simultaniously the increase of ion bombardment effects.s.s.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
• /
• pp.734-737
• /
• 2004

The metal-ferroelectric-semiconductor (MFS) structure is widely studied for nondestructive readout (NDRO) memory devices, but conventional MFS structure has a critical problem. It is difficult to obtain ferroelectric films like PZT on Si substrate without interdiffusion of impurities such as Pb, Ti and other elements. In order to solve these problems, the metal-ferroelectric-insulator-semiconductor (MFIS) structure has been proposed with a buffer layer of high dielectric constant such as MgO, $Y_2O_3$, and $CeO_2$. In this study, the etching characteristics (etch rate, selectivity) of MgO thin films were etched using $Cl_2/Ar$ plasma. The maximum etch rate of 85 nm/min for MgO thin films was obtained at $Cl_2$(30%)/Ar(70%) gas mixing ratio. Also, the etch rate was measured by varying the etching parameters such as ICP rf power, dc-bias voltage, and chamber pressure. Plasma diagnostics was performed by Langmuir probe (LP) and optical emission spectroscopy (OES).

• 한국전기전자재료학회논문지
• /
• 제15권12호
• /
• pp.1054-1059
• /
• 2002

A great deal of research has been done in the field of characterization for piezoelectric thin films after the first report on the measurement for the piezoelectric coefficient of thin films in 1990. The main idea of this research is to provide a distinctive solution for the measurement and standardization of both the longitudinal and the transverse piezoelectric d-coefficients, d33 and d31, of ferroelectric thin films. In general, to get these two coefficients of thin films, two different measuring systems are required. Here, we propose the improved method for the evaluation of these two coefficients with single equipment and with the relatively convenient procedure. The two-step loading process of applying the both positive and the negative pressure has been introduced to acquire the piezoelectric coefficients. These results have been calibrated for both the longitudinal and 4he transverse piezoelectric d-coefficients, d33 and 431, of thin films by comparison with the virtual standard created from FEM. In this experiments, we have obtained d33 of 331pC/N and 031 of -92.2pC/N for the PZT thin films.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
• /
• pp.302-302
• /
• 2007

The $SrRuO_3$/Si thin film electrodes are grown with (00l) preferred orientations on SrO buffered-Si (001) substrates by pulsed laser deposition. The optimum conditions of SrO buffer layers for $SrRuO_3$ preferred orientations are the deposition temperature of $700^{\circ}C$, deposition pressure of $1\;{\times}\;10^{-6}\;Torr$, and the thickness of 6 nm. The 100nm thick-$SrRuO_3$ bottom electrodes deposited above $650^{\circ}C$ on SrO buffered-Si (001) substrates have a rms roughness of approximately $5.0\;{\AA}$ and a resistivity of 1700 -cm, exhibiting a (00l) relationship. The 100nm thick-$Pb(Zr_{0.2}Ti_{0.8})O_3$ thin films deposited at $575^{\circ}C$ have a (00l) preferred orientation and exhibit $2P_r$ of $40\;C/cm^2$, $E_c$ of 100 kV/cm, and leakage current of about $1\;{\times}\;10^{-7}\;A/cm^2$ at 1V.

• 한국표면공학회지
• /
• 제54권6호
• /
• pp.324-330
• /
• 2021

As energy harvesting technology becomes important in relation to environmental issues, piezoelectric materials that convert mechanical energy into electrical energy are attracting attention. However, PZT, a representative material for piezoelectricity, is becoming difficult to use due to the problem that its components can cause environmental pollution. For this reason, recent research suggests a triboelectric nanogenerator (TENG) that generates energy through the combined effect of triboelectricity and electric induction for alternative piezoelectric devices. In TENG, electrical power is determined by the dielectric constant, thickness, and grain generation of the charged material. Therefore, in this study, a Rutile phase TiO₂ thin film with high dielectric constant was formed using the spin-coating process and the effect of annealing was investigated. For electrical analysis, a TENG device was fabricated using PTFE as a material with an opposite charge, and electrical output according to film thickness and grain formation was comparatively analyzed.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
• /
• pp.116-116
• /
• 2007

21 세기에 접어들면서 인터넷을 통한 정보 통신의 발달과 개인 휴대용 이동 통신기기의 활발한 보급에 따라 휴대형 전자기기들의 소형화와 고성능화로 나아가고 있다. 이러한 전자기기에 사용될 IC의 내장 메모리 또한 집적화 및 고속화, 저 전력화가 이루어져야 한다. 이러한 전자기기들에 필수적인 압전 세라믹스 부품 중 압전 부저 및 기타 음향 부품등을 각종 전자기기와 무선 전화기에 채택함으로써 압전 부품에 대한 수요와 생산이 계속 증가할 것으로 전망된다. 이처럼 압전 세라믹스를 이용한 그 응용 범위는 대단히 방대하며, 현재 모든 압전 부품들은 PZT 계열 재료로 만들어지고 있고, 차후 모두 비납계열 재료로 대체될 것이 확실시된다. Pb의 환경오염은 이미 오래전부터 큰 문제점으로 인식되고 있었으며 그 일례로 미국의 캘리포니아 주에서는 1986년부터 약 800종의 유해물질, 그 중에서도 Pb 사용을 300ppm 이하로 규제하는 Proposition 65를 제정하여 실행하고 있다. 그리고 2003년 2월에 EU (European Union) 에서 발표한 전자산업에 관한 규제 사항중 하나인 위험물질 사용에 관한 지칭 (Restriction of Hazardous Substance, RoHS) 에 의하면, 2006 년 7월부터 전기 전자 제품에 있어서 위험 물질인 Pb을 포함한 중금속 물질(카드늄, 수은, 6가 크롬, 브롬계 난연재)의 사용을 금지한다고 발표하였다. 비록 전자세라믹 부품에 함유된 Pb는 예외 사항으로 두었지만 대체 가능한 물질이 개발되면 전자세라믹 부품에서도 Pb의 사용을 금지한다고 규정하였다. 더욱이 일본은 2005 년부터 Pb 사용을 금지시켰다. 이와 같이 Pb가 환경에 미치는 영향 때문에 비납계 강유전 물질 및 압전 세라믹스 재료에 대한 연구가 전 세계적으로 활발히 진행되고 있다. 본 연구에서는 비납계 강유전체의 patterning을 위해서, NKN 박막을 고밀도 플라즈마원인 ICP를 이용하여 식각 mechanism을 연구하고, 식각변수에 따른 식각 공정을 최적화에 대하여 연구하였다. 가스 혼합비에 따라 식각 할때 700 W의 RF 전력과 - 150 V의 직류 바이어스 전압을 인가하였고, 공정 압력은 2 Pa, 기판 온도는 $23^{\circ}C$로 고정하였다. 식각 속도는 Tencor사의 Alpha-step 500을 이용하여 측정되었으며 식각 시 NKN 박막 표면과 라디칼과의 화학적인 반응을 분석하고 식각 메커니즘을 규명하기 위하여 XPS(x-ray photoelectron spectroscopy)를 사용하였다.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1999년도 하계학술대회 논문집 D
• /
• pp.1553-1555
• /
• 1999

Recently, $SrBi_2Ta_2O_9$(SBT) and $Pb(ZrTi)O_3$(PZT) were much attracted as materials of capacitor for ferroelectric random access memory(FRAM) showing higher read/write speed, lower power consumption and nonvolartility. Bi-layered SBT thin film has appeared as the most prominent fatigue free and low operation voltage for use in nonvolatile memory. To highly integrate FRAM, SBT thin film should be etched. A lot of papers on SBT thin film and its characteristics have been studied. However, there are few reports about SBT thin film due to difficulty of etching. In order to investigate properties of etching of SBT thin film, SBT thin film was etched in $CF_4$/Ar gas plasma using magnetically enhanced inductively coupled plasma (MEICP) system. When $CF_4/(CF_4+Ar)$ is 0.1, etch rate of SBT thin film was $3300{\AA}/min$, and etch rate of Pt was $2495{\AA}/min$. Selectivities of SBT to Pt. $SiO_2$ and photoresist(PR) were 1.35, 0.6 and 0.89, respectively. With increasing $CF_4$ gas, etch rate of SBT thin film and $P_t$ decreased.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 하계학술대회 논문집
• /
• pp.478-480
• /
• 2001

Fe-base amorphous films exhibit large saturation magnetostriction and soft magnetic Properties, which make them suitable for strain sensor applications. Most important material properties for the performance of these elements are the superior soft magnetic properties, such as high permeability and small coercive force, as well as magnetoelastic properties. It is well known that the strain generated in film deposition and/or post-heat treatment processes is one of important material properties, which effects on the soft magnetic properties of the film via magnetoelastic coupling. In this study, the effect of an isotropic strain in plane of magnetic films have been performed experimently. Amorphous films with the composition of (F $e_{90}$ $Co_{10}$)$_{78}$S $i_{l2}$ $B_{10}$ were employed in this study. The film with 5${\mu}{\textrm}{m}$ thick was deposed onto the polyimide substrate with 50${\mu}{\textrm}{m}$ thick by virtue of RF sputtering. The film was subject to post annealing with a static magnetic field with 500Oe magnetic field intensity at 35$0^{\circ}C$ for 1 hour. The polyimide substrate with the film was bonded with an adhesive on PZT piezoelectric substrate with 600${\mu}{\textrm}{m}$ thick in applying voltage of 500V. The change in MH loops of films due to the isotropic strain was measured by using VSM. The coercive force was evaluated from MH loops. It has shown in the results that M-H loops of films are subject to change considerably with a dc voltage, resulting of the magnetization rotation from normal to plane direction as the applied voltage is changed from 500V to 250V.50V.V.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
• /
• pp.469-472
• /
• 1999

CeO$_2$ thin films have used in wide applications such as SOI, buffer layer, antirflection coating, and gate dielectric layer. CeO$_2$takes one of the cubic system of fluorite structure and shows similar lattice constant (a=0.541nm) to silicon (a=0.543nm). We investigated CeO$_2$films as buffer layer material for nonvolatile memory device application of a single transistor. Aiming at the single transistor FRAM device with a gate region configuration of PZT/CeO$_2$ /P-Si , this paper focused on CeO$_2$-Si interface properties. CeO$_2$ films were grown on P-type Si(100) substrates by 13.56MHz RF magnetron sputtering system using a 2 inch Ce metal target. To characterize the CeO$_2$ films, we employed an XRD, AFM, C-V, and I-V for structural, surface morphological, and electrical property investigations, respectively. This paper demonstrates the best lattice mismatch as low as 0.2 % and average surface roughness down to 6.8 $\AA$. MIS structure of CeO$_2$ shows that breakdown electric field of 1.2 MV/cm, dielectric constant around 13.6 at growth temperature of 200 $^{\circ}C$, and interface state densities as low as 1.84$\times$10$^{11}$ cm $^{-1}$ eV$^{-1}$ . We probes the material properties of CeO$_2$ films for a buffer layer of FRAM applications.

• 한국소음진동공학회논문집
• /
• 제26권3호
• /
• pp.270-280
• /
• 2016

노치가 있는 보에 부착된 압전소자의 전기역학적 어드미턴스 전이과정을 파전달 관점에서 규명한다. 유한요소 해석을 통해 노치가 있는 보에서 잔향하는 램파에 대한 수치해를 구한다. 보에 병치된 압전소자의 분극을 이용하여 노치에 의해 발생하는 모드변환된 램파 신호를 추출한다. 전기역학적 어드미턴스의 전이과정을 보여줄 수 있는 일련의 템포럴 스펙트럼은 모드변환된 램파 신호들을 시간영역에서 순차적으로 절단한 후, 고속 푸리에 변환을 적용하여 계산한다. 절단 시간이 상대적으로 작을 때 이에 대응되는 템포럴 스펙트럼은 입력 주파수 대역의 특성이 지배적이다. 그러나, 절단 시간이 증가함에 따라 입력 주파수 대역 내에 존재하는 보의 모달 특성이 템포럴 스펙트럼에 중대한 영향을 준다. 이는 보에서 잔향하는 모드변환램파가 보의 공진에 기여함을 의미한다. 각 공진주파수 부근에서 템포럴 스펙트럼에 대한 제곱평균제곱근을 계산한다. 모든 공진주파수 부근에서 절단시간에 따라 제곱평균제곱근은 증가한다. 마지막으로, 보의 손상 진단 측면에서 수치해석 결과의 시사점에 대해 논의한다.