• Journal of the Korean Geosynthetics Society
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• v.8 no.1
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• pp.19-24
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• 2009

In this paper, a series of numerical analyses on soft clay ground improved by PVD were carried out, in order to investigate the consolidation promotion effect considering PVD width and surcharge pressure. In the numerical analyses, an elasto-viscoplastic three-dimensional consolidation finite element method was applied, in which the applicability of numerical analyses could be confirmed comparing with consolidation behavior simulated at the laboratory. And, through the results of the numerical analyses, consolidation behaviors of soft clay ground with elapsed time was elucidated, together with the effects of PVD width and surcharge pressure.

• Journal of Ocean Engineering and Technology
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• v.32 no.6
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• pp.502-510
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• 2018

In order to accumulate data to lower the friction coefficient of a press mold, tribological tests were performed before and after coating SM45C with a PVC/PO film and plasma coating (CrN, concept). The ultrasonic nanocrystal surface modification (UNSM)-treated material had a nano-size surface texture, high surface hardness, and large and deep compressive residual stress formation. Even when the load was doubled, the small amount of abrasion, small weight of the abrasion, and width and depth of the abrasion did not increase as much as those of untreated materials. A comparison of the weight change before and after the tribological test with the CrN and the concept coating material and that of the untreated material showed that the wear loss of the concept coating material and P-UNSM treated material (that is, the UNSM treated material treated with the concept coating) showed a tendency to decrease by approximately 55-75%. Concept 100N had a lower friction coefficient of about 0.6, and P-UNSM-30-100N showed almost the same curve as concept 100N and had a low coefficient of friction of about 0.6. The concept multilayer coating had a thickness of $5.32{\mu}m$. In the beginning, the coefficient of friction decreased because of the plasma coating, but it started to increase from about 250-300 s. After about 350 s, the coefficient of friction tended to approach the friction coefficient of the SM45C base metal. The SGV-280F film-attached test specimen was slightly pushed back and forth, but the SM45C base material was not exposed due to abrasion. The friction coefficient was 0.22, which was the lowest, and the tribological property was the best in this study.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.22.2-22.2
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• 2009

Currently, metal silicides become increasingly more essential part as a contact material in complimentary metal-oxide-semiconductor (CMOS). Among various silicides, NiSi has several advantages such as low resistivity against narrow line width and low Si consumption. Generally, metal silicides are formed through physical vapor deposition (PVD) of metal film, followed by annealing. Nanoscale devices require formation of contact in the inside of deep contact holes, especially for memory device. However, PVD may suffer from poor conformality in deep contact holes. Therefore, Atomic layer deposition (ALD) can be a promising method since it can produce thin films with excellent conformality and atomic scale thickness controllability through the self-saturated surface reaction. In this study, Ni thin films were deposited by thermal ALD using bis(dimethylamino-2-methyl-2-butoxo)nickel [Ni(dmamb)2] as a precursor and NH3 gas as a reactant. The Ni ALD produced pure metallic Ni films with low resistivity of 25 $\mu{\Omega}cm$. In addition, it showed the excellent conformality in nanoscale contact holes as well as on Si nanowires. Meanwhile, the Ni ALD was applied to area-selective ALD using octadecyltrichlorosilane (OTS) self-assembled monolayer as a blocking layer. Due to the differences of the nucleation on OTS modified surfaces toward ALD reaction, ALD Ni films were selectively deposited on un-coated OTS region, producing 3 ${\mu}m$-width Ni line patterns without expensive patterning process.

• Journal of the Korean Ceramic Society
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• v.53 no.1
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• pp.81-86
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• 2016

The effect of substrate rotation speed on the phase forming behavior and microstructural variation of 8 wt% yttria ($Y_2O_3$) stabilized $ZrO_2$ (8YSZ) coatings as a thermal barrier coating has been investigated. 8YSZ coatings with $100{\sim}200{\mu}m$ thickness were deposited by electron beam-physical vapor deposition onto a super alloy (Ni-Cr-Co-Al) substrate with a bond coating (NiCo-CrAlY). The width of the columnar grains of the 8YSZ coatings increased with increasing substrate rotation speed from 1 to 30 rpm at a substrate temperature range of $900{\sim}950^{\circ}C$. In spite of the different growth behaviors of coatings with different substrate rotation speeds, the phases of each coating were not changed remarkably. Even after post heat treatments with various conditions of the coated specimens fabricated at 20 rpm, only a change of color was noticeable, without any remarkable change in the phase or microstructure.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.94.2-94.2
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• 2010

Indium tin oxide (ITO) Thin films were grown on Non-alkarai glass Substrates by PVD method and Subsequently Subjected to ($100^{\circ}C-350^{\circ}C$) Thermal Annealing (TA) In Nitr Oxygen ambinent. Most of all, The effect of TA treatment on the structural properties were studied by using X-Ray diffraction and atomic force microscopy, while optical properties were studied by UV-Transmittance measurements. After TA treatment, the XRD spectra have shown an effective relaxation of the residual compressive stress, As a result, XRD peaks increase of the intensity and narrowing of full width at half-maximun (FWHM). In addtion The microstructure, The surface morphology, the optical transmittance changed and improved, and we investigated The effects of temperature, Time and atmosphere during the TA on the structural and electrical properties of the ITO/glass on TA at $300^{\circ}C$. As a results, the films are highly transparent (80%～89%) in visible region. AFM analysis shows that the films are very smooth with root mean square surface roughness 0.58nm -2.75nm thickness film. It is observed that resistivity of the films drcreases T0 $1.05{\times}10^{-4}{\Omega}cmt$ $6.06{\times}10^{-4}{\Omega}cm$, while mobility increases from $152cm^2/vs$ to $275cm^2/vs$.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.8
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• pp.33-38
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• 1998

TiYN coated high speed steel tools have been developed and their tool lifes were assessed. First yttrium alloyed titanium target was manufactured, then using the arc ion plating(AIP) technique TiYN coating was deposited onto high speed steel substrate. Three kinds of varying thickness of TiYN coated tools were prepared. Cutting tests were carried out with theses tools and for comparison with the commercially available uncoated, TiN, TiCN and TiAlN coated tools. During the cutting tests flank wear width vs. cutting time was measured. It has been revealed that the newly developed TiYN coated tools show superior tool life characteristics to others.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.178-178
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• 2010

With the scaling down of ULSI(Ultra Large Scale Integration) circuit of CMOS(Complementary Metal Oxide Semiconductor)based electronic devices, the electronic devices become more faster and smaller size that are promising field of semiconductor market. However, very narrow line width has some disadvantages. For example, because of narrow line width, deposition of conformal and thin barrier is difficult. Besides, proportion of barrier width is large, thus resistance is high. Conventional PVD(Physical Vapor Deposition) thin films are not able to gain a good quality and conformal layer. Hence, in order to get over these side effects, deposition of thin layer used of ALD(Atomic Layer Deposition) is important factor. Furthermore, it is essential that copper atomic diffusion into dielectric layer such as silicon oxide and hafnium oxide. If copper line is not surrounded by diffusion barrier, it cause the leakage current and devices degradation. There are some possible methods for improving the these secondary effects. In this study, TaNx, is used of Tertiarybutylimido tris (ethylamethlamino) tantalum (TBITEMAT), was deposited on the 24nm sized trench silicon oxide/silicon bi-layer substrate with good step coverage and high quality film using plasma enhanced atomic layer deposition (PEALD). And then copper was deposited on TaNx barrier using same deposition method. The thickness of TaNx was 4~5 nm. TaNx film was deposited the condition of under $300^{\circ}C$ and copper deposition temperature was under $120^{\circ}C$, and feeding time of TaNx and copper were 5 seconds and 5 seconds, relatively. Purge time of TaNx and copper films were 10 seconds and 6 seconds, relatively. XRD, TEM, AFM, I-V measurement(for testing leakage current and stability) were used to analyze this work. With this work, thin barrier layer(4~5nm) with deposited PEALD has good step coverage and good thermal stability. So the barrier properties of PEALD TaNx film are desirable for copper interconnection.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2004.03a
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• pp.611-616
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• 2004

In this study, microfabrication of a micro-arcjet nozzle with Fifth-harmonic generation Nd：YAG pulses (wavelength 213 nm) and its thrust performance tests were conducted. A micro-arcjet nozzle was machined in a 1.2 mm thick quartz plate. Sizes of the nozzle were 0.44 mm in width of the nozzle exit and constrictor diameter of 0.1 mm. For an anode, a thin film of Au (~100 nm thick) was deposited by DC discharge PVD in vacuum on divergent part of the nozzle. As for a cathode, an Au film was also coated on inner wall surface. In operational tests, a stable discharge was observed for mass flow of 1.0mg/sec, discharge current of 6 ㎃, discharge voltage of 600 V, or 3.6 W input power (specific power of 3.6 MW/kg). In this case, plenum pressure of the discharge chamber was 80 ㎪. With 3.6 W input power, thrust obtained was 1.4 mN giving specific impulse of 138 sec with thrust efficiency of 24 %.

• Advances in Energy Research
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• v.5 no.3
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• pp.219-226
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• 2017

Electrochemical double layer capacitors (EDLCs) have received a tremendous interest due to their suitability for diverse applications. They have been fabricated using different carbon based electrodes including activated carbons, single walled/multi walled carbon nano tubes. But, graphite which is one of the natural resources in Sri Lanka has not been given a considerable attention towards using for EDLCs though it is a famous carbon material. On the other hand, EDLCs are well reported with various liquid electrolytes which are associated with numerous drawbacks. Gel polymer electrolytes (GPE) are well known alternative for liquid electrolytes. In this paper, it is reported about an EDLC fabricated with a nano composite polyethylene oxide based GPE and two Sri Lankan graphite based electrodes. The composition of the GPE was [{(10PEO: $NaClO_4$) molar ratio}: 75wt.% PC] : 5 wt.% $TiO_2$. GPE was prepared using the solvent casting method. Two graphite electrodes were prepared by mixing 85% graphite and 15% polyvinylidenefluoride (PVdF) in acetone and casting n fluorine doped tin oxide glass plates. GPE film was sandwiched in between the two graphite electrodes. A non faradaic charge discharge mechanism was observed from the Cyclic Voltammetry study. GPE was stable in the potential windows from (-0.8 V-0.8 V) to (-1.5 V-1.5 V). By increasing the width of the potential window, single electrode specific capacity increased. Impedance plots confirmed the capacitive behavior at low frequency region. Galvanostatic charge discharge test yielded an average discharge capacity of $0.60Fg^{-1}$.