• Title/Summary/Keyword: PLASMA SURFACE TREATMENT

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An analysis on the impurities generated by discharge in AC plasma display panel (교류 플라즈마 표시기 방전 시 발생하는 불순물 종의 분석)

  • 김광남;김중균;양진호;황기웅;이석현
    • Journal of the Korean Vacuum Society
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    • v.8 no.4A
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    • pp.482-489
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    • 1999
  • AC PDP(P1asma Display Pane1)s use the mixture of inert gases to generate a discharge inside the display pixels. Impurities such as CO, $CO_2$ and OH inside discharge region may deteriorate the characteristics of PDP operation during long life time of PDP. Electro-negative gas such as CO can cause the sustain pulse amplitude to rise by attaching electrons which will play an important role in the earlier stage of the discharge. MgO film is used to protect the dielectric layer in AC PDP, and is in contact with the free space of display pixel where it is filled with the inert gas mixture. So, MgO film can be a main source of impurities. In this experiment, we observed the change of impurity generation of various MgO films which were deposited by different methods, by using QMS. (quadropole mass spectrometer) The main impurites were $H_2$, CO and $CO_2$. And with the comparison of the TPD (temperature programmed desorption) result, it can be understood that impurity gases are generated by sputtering of MgO surface not by outgassing. Deposition method had effects on the characteristics of the impurity generation. The MgO film manufactured by e-beam evaporation generated more amount of impurity gases than the MgO films manufactured by sputtering or ion-plating. And also heat treatment of MgO film after deposition decreased the magnitude of impurity gas generation.

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YBa$_2$Cu$_3$O$_{7-{\delta}}$/SrTiO$_3$/YBa$_2$Cu$_3$O$_{7-{\delta}}$ multilayer structures for ground planes for ramp-edge junction devices

  • Kim, C.H.;Kim, Y.H.;Jung, K.R.;Hahn, T.S.;Park, J.H.;Choi, S.S.
    • 한국초전도학회:학술대회논문집
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    • v.10
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    • pp.179-183
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    • 2000
  • For a ground plane in high-temperature superconducting ramp-edge junction devices, YBa$_2$Cu$_3$O$_{7-{\delta}}$/SrTiO$_3$/YBa$_2$Cu$_3$O$_{7-{\delta}}$ multilayer structures were fabricated using pulsed laser deposition and ECR ion milling. Various process parameters were adjusted to enhance the device characteristics. By etching the STO layer to form a tapered edge of about 15$^{\circ}$ and in-situ RF plasma treatment of bottom YBCO surface prior to deposition of top YBCO, the top-to-bottom YBCO showed T$_c$ of 75${\sim}$80 K and I$_c$ of about 40 mA through holes. It was found that the deposition of bottom YBCO at a reduced laser repetition rate of 1Hz increased the T$_c$ of top YBCO to 79.9 K. The resistivity of 570 layer was about 10$^6$ ${\Omega}$cm at 60 K, which ensures good electrical isolation between successive YBCO layers.

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The Annealing Effect of Diamond-like Carbon Films for RF MEMS Switch

  • Hwang, Hyun-Suk;Choi, Won-Seok;Cha, Jae-Sang
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.35 no.11A
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    • pp.1091-1096
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    • 2010
  • Stiction in microelectromechanical systems (MEMS) has been a major failure mechanism. Especially, in RF MEMS switches, moving parts often suffered in-use and release related stiction problems. Some materials and methods have been used to prevent this problem. Diamond-like carbon (DLC) has not only been used as a protective material owing to its good mechanical properties but also has been used as a hydrophobic material. Its properties could be controlled by post annealing treatment in various conditions. We synthesized DLC films using a radio frequency plasma enhanced chemical vapor deposition (RF PECVD) method on silicon substrates using methane ($CH_4$) and hydrogen ($H_2$) gas. Then, the change of the hydrophobic property of the films was investigated undervarious annealing temperatures in nitrogen and in oxygen ambient. The films, that were annealed above $700^{\circ}C$ in nitrogen ambient, showed a high contact angle of water (> $90^{\circ}$) even though their mechanical property was sacrificed to some degree. The structural variation and the changes of the hydrophobic and mechanical properties of the DLC films were analyzed by Raman spectrum, contact angle measurement, surface profiler, and a nanoindentation test.

The Proliferative and Apoptotic Properties of Nile Tilapia (Oreochromis niloticus) sIg+ Lymphocytes by Cortisol Treatment

  • Park, Kwan-Ha;Choi, Sang-Hoon
    • Journal of Animal Science and Technology
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    • v.53 no.6
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    • pp.563-569
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    • 2011
  • The effects of cortisol on proliferation and apoptosis of tilapia surface immunoglobulin positive ($sIg^+$) lymphocytes isolated from different tissues were investigated. $sIg^+$ lymphocytes from the tilapia head kidney (HK) and spleen showed a higher proliferation and lower intracellular calcium ($Ca^{2+}{_i}$) level to Ig-crosslinking compared with peripheral blood $sIg^+$ lymphocytes. Peripheral blood $sIg^+$ lymphocytes stimulated with lipopolysaccharide (LPS) showed high levels of apoptosis in the presence of cortisol. HK and to a lesser extent spleen $sIg^+$ lymphocytes, although less sensitive than their equivalent in peripheral blood, showed cortisol-induced apoptosis irrespective of LPS stimulation of control levels. Compared to plasma values measured during stress conditions, proliferation regardless of LPS stimulation was apparently suppressed by cortisol that is effective in inducing a significant increase in apoptosis in all three different cell populations of $sIg^+$ cells, suggesting the immunoregulatory effect of cortisol in both LPS stimulated and non-stimulated conditions. Different sensitivity of $sIg^+$ cells to the cortisol, in regard to developmental stage and activity, could be related in inhibiting excessive and continuing depletion of $sIg^+$ lymphocytes.

반도체 산업용 나노기공 함유 유기실리카 박막

  • 차국헌;윤도영;이진규;이희우
    • Proceedings of the Korea Crystallographic Association Conference
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    • 2002.11a
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    • pp.48-48
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    • 2002
  • It is generally accepted that ultra low dielectric interlayer dielectric materials (k < 2.2) will be necessary for ULSI advanced microelectronic devices after 2003, according to the International Technology Roadmap for Semiconductors (ITRS) 2000. A continuous reduction of dielectric constant is believed to be possible only by incorporating nanopores filled with air (k = 1.0) into electrically insulating matrices such as poly(methyl silsesquioxane) (PMSSQ). The nanopo.ous low dielectric films should have excellent material properties to survive severe mechanical stress conditions imposed during the advanced semiconductor processes such as chemical mechanical planarization process and multilayer fabrication. When air is incorporated into the films for lowering k, their mechanical strength has inevitably to be sacrificed. To minimize this effect, the nanopores are controlled to exist in the film as closed cells. The micromechanical properties of the nanoporous thin films are considered more seriously than ever, particularly for ultra low dielectric applications. In this study, three approaches were made to design and develop nanoporous low dielectric films with improved micromechanical properties: 1) wall density increase of nanoporous organosilicate film by copolymerization of carbon bridged comonomers; 2) incorporation of sacrificial phases with good miscibility; 3) selective surface modification by plasma treatment. Nanoporous low-k films were prepared with copolymerized PMSSQ and star-shaped sacrificial organic molecules, both of which were synthesized to control molecular weight and functionality. The nanoporous structures of the films were observed using field emission scanning electron microscopy, cross-sectional transmission electron microscopy, atomic force microscopy, and positronium annihilation lifetime spectroscopy(PALS). Micromechanical characterization was performed using a nanoindentor to measure hardness and modulus of the films.

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Effect of Thermal Annealing on Nanoscale Thickness and Roughness Control of Gravure Printed Organic Light Emitting for OLED with PVK and $Ir(ppy)_3$

  • Lee, Hye-Mi;Kim, A-Ran;Kim, Dae-Kyoung;Cho, Sung-Min;Chae, Hee-Yeop
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.1511-1514
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    • 2009
  • Organic light emitting layer in OLED device was formed by gravure printing process in this work. Organic surface coated by gravure printing typically showed relatively bad uniformity. Thickness and roughness control was characterized by applying various mixed solvents in this work. Poly (N-vinyl carbazole) (PVK) and fact-tris(2-phenylpyridine)iridium($Ir(ppy)_3$) are host dopant system materials. PVK was used as a host and Ir(ppy)3 as green-emitting dopant. To luminance efficiency of the plasma treatment on etched ITO glass and then PEDOT:PSS spin coated. The device layer structure of OLED devices is as follow Glass/ITO/PEDOT:PSS/PVK+Ir(ppy)3-Active layer /LiF/Al. It was printed by gravure printing technology for polymer light emitting diode (PLED). To control the thickness multi-printing technique was applied. As the number of the printing was increased the thickness enhancement was increased. To control the roughness of organic layer film, thermal annealing process was applied. The annealing temperature was varied from room temperature, $40^{\circ}C$, $80^{\circ}C$, to $120^{\circ}C$.

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Development of cube textured Ni-W alloy substrates for YBCO coated conductor (YBCO Coated Conductor를 위한 Cube texture Ni-W 합금 기판의 제작 및 특성평가)

  • 김규태;임준형;장석헌;김정호;주진호;김호진;지봉기;전병혁;김찬중
    • Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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    • 2003.10a
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    • pp.106-108
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    • 2003
  • We fabricated Ni and Ni-W alloys for use as a substrate in YBCO coated conductor applications and evaluated the effect of W in Ni on texture, microstructure and surface morphology, and hardness of substrate. Pure Ni, Ni-2 at.%W, and Ni-5at.%W alloy substrates were prepared by plasma arc melting, cold rolling, and the recrystallization heat treatment at various temperature (700- 130$0^{\circ}C$). It was observed that Ni-W alloy substrates had stronger cube texture and maintained it at higher annealing temperature, compared to pure Ni substrate : The full-width at half- maximums of in-plane texture was 13.40$^{\circ}$ for Ni substrate and 4.42$^{\circ}$-5.57$^{\circ}$ for Ni-W substrate annealed at 100$0^{\circ}C$. In addition, it was observed that the Ni-W substrate had smaller grain size, shallower boundary depth, and higher hardness, compared to those of pure Ni substrate.

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A Study on an Operating Conditions for the Direct Ethanol Fuel Cell (직접에탄올 연료전지의 운전조건에 관한 연구)

  • Kim, Young-Chun;Koo, Bon-Kook;Jang, Mun-Gug;Ji, Hag-Bae;Han, Sang-Bo;Park, Jae-Youn
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.60 no.11
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    • pp.2076-2082
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    • 2011
  • The goal of this paper is to find an operating conditions of the single direct ethanol fuel cell such as the cell temperature, and flow rates of ethanol and oxygen. To investigate the output characteristics, the electrical current increased from 0[A] with interval of 0.001[A] every 2[s], and the cell voltage was increased until the voltage became 0.05[V]. Related to the effect of the cell temperature, the output characteristics both voltage and power were increased upto 80[$^{\circ}C$] according to the increase of the current density, but those were decreased over that temperature. In addition, the optimal flow rate of ethanol in anode was identified as of 2[mL/min] due to the dependence of generation rate such as the hydrogen ion and electron. And the flow rate of oxygen in cathode was desirable to about 300[sccm/min], it might be affected by the chemical reaction rate of the water formation among hydrogen ion, electron, and oxygen. Consequently, the fundamental conditions were identified in this work, and it will be carried out to find the best conditions of membrane by the effect of the plasma surface treatment, and the effect of other catalysts except for a platinum.

Surface Treatment of Vertically Aligned CNTs Using Atmospheric Pressure Plasma Torch System

  • Lee, Byeong-Ju;Jeong, Gu-Hwan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.293.1-293.1
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    • 2013
  • 탄소나노튜브(carbon nanotubes; CNTs)는 우수한 물성으로 인하여 전자소자, 에너지 저장매체, 투명전도막, 복합재료 등 매우 다양한 분야에 응용이 가능할 것으로 예측되고 있으며, 더욱이 이러한 특성은 구조변형, 화학적 도핑뿐만 아니라 표면처리를 통해서 제어가 가능하다고 알려져 있다. 이를 위해 기존에는 열처리를 통하여 CNTs를 표면처리한 결과들이 보고되었으나, 고온에서 장시간의 공정이 요구되는 열처리 공정의 단점을 보완하기 위하여 플라즈마 처리를 통해 상온에서 단시간의 공정으로 CNTs를 표면처리하는 방법이 제시되었다. 특히 최근에는, 향후 산업적 응용을 목적으로 종래의 진공 환경에서 벗어나 대기압 연속공정 개발을 위한 대기압 플라즈마 기반의 표면처리 공정에 대하여 관심이 집중되고 있는 상황이다. 본 연구에서는 대기압에서 플라즈마를 안정적으로 방전 및 유지 할 수 있는 플라즈마 토치 시스템을 구축하였고, 이를 이용하여 수직배향 CNTs를 표면 처리함으로써 그 영향을 살펴보았다. CNTs는 $SiO_2$ 웨이퍼 위에 증착한 철 촉매를 이용하여 $750^{\circ}C$에서 수직배향 합성하였으며, 원료가스로는 아세틸렌을 사용하였다. 대기압 플라즈마 장치의 경우 고전압 교류 전원장치를 이용하여 토치타입으로 제작하였다. 플라즈마는 아르곤과 질소가스를 시용하여 방전하고, 기판과의 거리 및 처리시간을 변수로 CNTs를 표면처리하였다. 플라즈마 처리 전후 접촉각 측정을 통하여 소수성이었던 CNTs 표면이 친수성으로 변화하는 것을 확인하였다. 또한 Raman 분석을 통하여 대기압 플라즈마의 처리조건에 따른 CNTs 의 구조적 결함 발생 정도를 정량화 시킬 수 있었다. 이를 통하여 대기압 플라즈마를 이용할 경우, CNTs의 구조적 손상을 최소화 하면서 효율적으로 표면특성을 변화시킬 수 있는 처리조건을 도출하였다.

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Texturing Multi-crystalline Silicon for Solar Cell (태양전지용 다결정실리콘 웨이퍼의 표면 처리용 텍스쳐링제)

  • Ihm, DaeWoo;Lee, Chang Joon;Suh, SangHyuk
    • Applied Chemistry for Engineering
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    • v.24 no.1
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    • pp.31-37
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    • 2013
  • Lowering surface reflectance of Si wafers by texturization is one of the most important processes for improving the efficiency of Si solar cells. This paper presents the results on the effect of texturing using acidic solution mixtures containing the catalytic agents to moderate etching rates on the surface morphology of mc-Si wafer as well as on the performance parameters of solar cell. It was found that the treatment of contaminated crystalline silicon wafer with $HNO_3-H_2O_2-H_2O$ solution before the texturing helps the removal of organic contaminants due to its oxidizing properties and thereby allows the formation of nucleation centers for texturing. This treatment combined with the use of a catalytic agent such as phosphoric acid improved the effects of the texturing effects. This reduced the reflectance of the surface, thereby increased the short circuit current and the conversion efficiency of the solar cell. Employing this technique, we were able to fabricate mc-Si solar cell of 16.4% conversion efficiency with anti-reflective (AR) coating of silicon nitride film using plasma-enhanced chemical vapor deposition (PECVD) and Si wafers can be texturized in a short time.