• Proceedings of the KIEE Conference
• /
• 1993.11a
• /
• pp.264-267
• /
• 1993

A high plasma density of $10^{12}cm^{-3}$ can be produced at the pressure of few mTorr with R. F input power of 300-400W. A radially uniform plasma to a radius of 7cm at the substrate was produced at the pressure of 1 mTorr. The electron density and temperature were confirmed with double Langmuir probe, $\mu$-wave interferometer. It has bee found that the dispersion relation N/B=constant not be applied at the low R.F input power(<600W) but can be applied at high R.F input power(>600W).

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.32 no.2
• /
• pp.143-147
• /
• 2008

Super-hydrophobic surfaces showed that contact angle of water was higher than 140 degrees. That surface could be made several methods such as Carbon nano tubes grown vertically, PDMS asperities arrays, hydrophobic fractal surfaces, and self assembled monolayers coated by CVD and so on. However, we fabricated super-hydrophobic surfaces with plasma treatments which were very cost efficient processes. Their surfaces were characterized by static contact angles, advancing, receding, and stability against UV irradiation. Optimal surfaces showed static contact angles were higher than 150 degrees. Super-hydrophobic property was remained after UV irradiation for one week.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2009.05a
• /
• pp.202-203
• /
• 2009

Plasma etching was studied to obtain high-efficiency Si solar cells. SiN nanoparticles were observed upon the plasma treatment using SF6 gas. The mechanism of the nanoparticles formation has been studied. A net increase in the current density (Jsc) of the cells of $1.7mA/cm^2$ and in the conversion efficiency ($\eta$) of 2.1% is obtained after the plasma treatment for 10s, thanks to the significant decrease of reflection in the shorter wavelength range.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.9 no.2
• /
• pp.327-332
• /
• 2008

New RF matcher module has been proposed in this paper for improvement of RF matcher in plasma etcher system using in semiconductor and display panel manufacturing process. New designed warm gear was used instead of bevel gear in new driving module, and control system was re-arranged with one-chip micro-process technique. The matching performance of new match module was improved in various process condition with reduction of backlash and matching time, and flexible motion of motor compared commercial match module. However this new type RF match module will improve the productivity in etching process of the mass production line.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.02a
• /
• pp.328-328
• /
• 2011

Wetting phenomena have been heavily studied for industrial and academic researches especially tuning the wettability between hydrophilicity and hydrophobicity. Wicking through the surface texture is shown on superhydrophilic surface while rolling (or dewetting) on the patterns of superhydrophobic surface. These wetting phenomena are known to be affected by surface wettability determined with physical surface patterns as well as chemical composition of surface layer. In this research, we introduce a method to control the wettability of a thin C-SiOx film from hydrophobic to hydrophilic using a mixture gas of HMDSO/$O_2$ by plasma polymerization with rf-CVD (radio frequency-Chemical Vapor Deposition). Wettability was finely controlled by changing the ratio of HMDSO/$O_2$. Hydrophilicity increased as the ratio decreased, while hydrophobicity was enhanced by the ratio. Moreover, fine control from superhydrophilicity to superhydrophobicity was achieved by C-SiOx coating on the Si wafer with prepatterns of submicron-sized pillar array formed by $CF_4$ plasma etching.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.725-727
• /
• 2009

Lowering the dielectric constant is one of the important issues for the efficiency and the power consumption in the plasma display panel (PDP) industry. This study examined the effect of the addition of ceramic filler (up to 10% of crystalline and amorphous silica, respectively) to a $B_2O_3$-ZnO- $P_2O_5$ glass matrix on the dielectric, coefficient of thermal expansion, etching behaviors and residual stress for the barrier ribs in plasma display panels. The dielectric constant of barrier ribs is affected by containing two types of $SiO_2$ filler for the barrier rib composition in PDP.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1999.05a
• /
• pp.99-102
• /
• 1999

A mixture which was made from organic gel, glass powder and ceramic powder was masklessly etched for fabrication of barrier rib of PDP(Plasma Display Panel) by focused Ar$^{+}$ laser( λ =514 nm) and Nd:YAG(λ =532, 266 nm) laser irradiation at the atmosphere. The depth of the etched grooves increases with increasing a laser fluence and decreasing a scan speed. Using second harmonic of Nd:YAG laser, the threshold laser fluence was 6.5 mJ/$\textrm{cm}^2$ for the sample of PDP barrier rib softened at 12$0^{\circ}C$. The thickness of 130 ${\mu}{\textrm}{m}$ of the sample on the glass was clearly removed without any damage on the glass substrate by fluence of 19.5 J/$\textrm{cm}^2$....

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1994.05a
• /
• pp.138-140
• /
• 1994

Plasma polymerized thin film was prepared using an interelectrod inductively coupled gas-flow-type reactor. Styrene was chosen as the monomer to be used. This thin films were also delineated by the electron-beam apparatus with an acceleration voltage 30kV, and the pattern in the resist was developed with RIE 80 with argon gas mixture ratio, pressure and RF power. The effect of charge of discharge power on growth rate and etching rate of the thin films were studied. The molecular structure of thin films were investigated by FIR and then was discussed in relation to its quality as a resist. In the case of Plasma polymerization, thickness of resist could be controlled by discharge duration and power. Also etch rate is increased as to growing argon gas and RF power with RIE 80.

• Proceedings of the KIEE Conference
• /
• 1994.11a
• /
• pp.278-280
• /
• 1994

The purpose of this paper is to describe an application of plasma polymerized thin film as an electron beam resist. Plasma polymerized thin film was prepared using an interelectrod inductively coupled gas-flow-type reactor. Styrene was chosen as the monomer to be used. This thin films were also delineated by the electron-beam apparatus and the pattern in the resist was developed with RIE and plasma polymerized apparatus. The effect of charge of pressure on growth rate and etching rate of the thin films were studied. The molecular structure of thin film was investigated by FT-IR and then was discussed in relation to its quality as a resist.

• Applied Science and Convergence Technology
• /
• v.26 no.6
• /
• pp.189-194
• /
• 2017

Effects of gas injection scheme and rf driving current configuration in a dual turn inductively coupled plasma (ICP) system were analyzed by 3D numerical simulation using CFD-ACE+. Injected gases from a tunable gas nozzle system (TGN) having 12 horizontal and 12 vertical nozzles showed different paths to the pumping surface. The maximum velocity from the nozzle reached Mach 2.2 with 2.2 Pa of Ar. More than half of the injected gases from the right side of the TGN were found to go to the pump without touching the wafer surface by massless particle tracing method. Gases from the vertical nozzle with 45 degree slanted angle soared up to the hottest region beneath the ceramic lid between the inner and the outer rf turn of the antenna. Under reversed driving current configuration, the highest rf power absorption region were separated into the two inner islands and the four peaked donut region.