• Corrosion Science and Technology
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• 제7권1호
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• pp.40-44
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• 2008

Passive metal forms an interfacial diffuse layer on the surface of passive film by its reaction with $H^+$ or $OH^-$ ions in solution depending on solution pH. There is a critical pH, called pH point of iso-selectivity ($pH_{pis}$) at which the nature of the diffuse layer is changed from the anion-permeable at pH<$pH_{pis}$ to the cation-permeable at pH>$pH_{pis}$. The $pH_{pis}$ for a passivated Fe was determined by examining the effects of pH on the thickness of passive film and on the dissolution reaction occurring on the passive film under a gavanostatic reduction in borate-phosphate buffer solutions at various pH of 7~11. The steady-state thickness of passive film formed on Fe showed the maximum at pH 8.5~9, and further the nature of film dissolution reaction was changed from a reaction producing $Fe^{3+}$ ion at $pH\leq8.5$ to that producing $FeO_2{^-}$ at $pH\geq9$, suggesting that the $pH_{pis}$ of Fe is about pH 8.5~9. In addition, the passive film formed at pH 8.5~9, $pH_{pis}$, was found to be the most protective with the lowest defect density as confirmed by the Mott-Schottky analysis. Pitting potential was decreased with increasing $Cl^-$ concentration at $pH\leq8.5$ due probably to the formation of anion permeable diffuse layer, but it was almost constant at $pH\geq9$ irrespective of $Cl^-$ concentration due primarily to the formation of cation permeable diffuse layer on the film, confirming again that $pH_{pis}$ of Fe is 8.5~9.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 추계학술대회 논문집 전기물성,응용부문
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• pp.145-147
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• 2005

In present, most of metallic structures(gas pipeline, oil pipeline, water pipeline, etc) are running parallel with subway and power line in seoul. Moreover subway system and power line make a stray current due to electrical corrosion on metallic structures. The owner of metallic structures has a burden of responsibility for the protection of corrosion and the prevention against big accident such as gas explosion or soil pollution and so on. So, they have to measure and analyze the data about P/S(Pipe to Soil) potential due to stray current of subway system. So, we have developed the Real-time Wireless Remote Monitoring System for Stray Current of Subway System. In this system, the permanent buried type reference electrode is necessary. In this paper, results of development of buried type reference electrode using porous ceramic$({\alpha}-Al_{2}O_{3})$ are presented.

• Nuclear Engineering and Technology
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• 제49권6호
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• pp.1125-1134
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• 2017

In this paper, we present a new multilevel in space and energy diffusion (MSED) method for solving multigroup diffusion eigenvalue problems. The MSED method can be described as a PI scheme with three additional features: (1) a grey (one-group) diffusion equation used to efficiently converge the fission source and eigenvalue, (2) a space-dependent Wielandt shift technique used to reduce the number of PIs required, and (3) a multigrid-in-space linear solver for the linear solves required by each PI step. In MSED, the convergence of the solution of the multigroup diffusion eigenvalue problem is accelerated by performing work on lower-order equations with only one group and/or coarser spatial grids. Results from several Fourier analyses and a one-dimensional test code are provided to verify the efficiency of the MSED method and to justify the incorporation of the grey diffusion equation and the multigrid linear solver. These results highlight the potential efficiency of the MSED method as a solver for multidimensional multigroup diffusion eigenvalue problems, and they serve as a proof of principle for future work. Our ultimate goal is to implement the MSED method as an efficient solver for the two-dimensional/three-dimensional coarse mesh finite difference diffusion system in the Michigan parallel characteristics transport code. The work in this paper represents a necessary step towards that goal.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 춘계학술대회 및 기술 세미나 논문집 디스플레이 광소자
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• pp.41-41
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• 2008

In general, polyimides (PIs) are used in alignment layers in liquid crystal displays (LCDs). The rubbing alignment technique has been widely used to align the LC molecules on the PI layer. Although this method is suitable for mass production of LCDs because of its simple process and high productivity, it has certain limitations. A rubbed PI surface includes debris left by the cloth, and the generation of electrostatic charges during the rubbing induces local defects, streaks, and a grating-like wavy surface due to nonuniform microgrooves that degrade the display resolution of computer displays and digital television. Additional washing and drying to remove the debris, and overwriting for multi-domain formation to improve the electro-optical characteristics such as the wide viewing angle, reduce the cost-effectiveness of the process. Therefore, an alternative to non-rubbing techniques without changing the LC alignment layer (i.e, PI) is proposed. The surface of LC alignment layers as a function of the ion beam (IE) energy was modified. Various pretilt angles were created on the IB-irradiated PI surfaces. After IB irradiation, the Ar ions did not change the morphology of the PI surface, indicating that the pretilt angle was not due to microgrooves. To verify the compositional behavior for the LC alignment, the chemical bonding states of the ill-irradiated PI surfaces were analyzed in detail by XPS. The chemical structure analysis showed that ability of LCs to align was due to the preferential orientation of the carbon network, which was caused by the breaking of C=O double bonds in the imide ring, parallel to the incident 18 direction. The potential of non-rubbing technology for fabricating display devices was further conformed by achieving the superior electro-optical characteristics, compared to rubbed PI.

• 폴리머
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• 제38권6호
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• pp.752-759
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• 2014

본 연구에서는 미세 전자 소자용 절연박막 및 차세대 플렉시블 디스플레이 기판으로서 사용이 기대되는 폴리이미드(PI)에 개환 복분해 중합(ring-opening metathesis polymerization)이 가능한 환형 말단 캡핑제(end-capping agent)인 cis-1,2,3,6-tetrahydrophthalic anhydride(CDBA)로 사슬 말단에 가교 반응이 된 가교형 폴리이미드를 합성하였다. 말단 캡핑제의 조성비에 따른 가교형 폴리이미드 박막의 잔류응력 거동은 thin film stress analyzer(TFSA)를 이용한 wafer bending mothod로 온도에 따라 연속적인 거동을 in-situ로 측정하였다. 열특성은 시차 주사 열량계(DSC), 열기계 분석기(TMA) 및 열 중량 분석기(TGA)를 이용하여 측정하였고, 광학 특성은 자외선/가시광선 분광광도계(UV-vis)와 색차계(spectrophotometer)를 이용하였으며, 네트워크 구조의 모폴로지(morphology) 변화를 통해 해석하였다. 말단 캡핑제의 조성비가 증가함에 따라 잔류응력은 27.9에서 -1.3 MPa로 초저응력 및 향상된 열 특성을 나타내었으나, 광학 특성은 감소됨을 보였다. 가교형 폴리이미드 박막의 우수한 특성 발현은 고집적도 다층 구조의 안정성 및 신뢰도가 요구되는 분야의 응용성이 확대될 것으로 기대된다.