• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.12
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• pp.6967-6972
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• 2014

Assembly using a bolt and nut, and rivet or pin have been used widely for forming mechanical joints. The indent method is an easier process than other manufacturing techniques and the toughness of the material is excellent. On the other hand, there are many cases in which the cracks occur on the manufacturing process as the indent method. Therefore, two kinds of models, in which a pin goes into and out PCB plate in this study were developed using the CATIA program and finite element methods were performed using the ANSYS program. When a pin was passed through a PCB plate in cases 1 and 2, the maximum loads applied to the PCB plate were 79.708N and 90.277N, respectively. When the PCB plate came out of the pin in cases 1 and 2, the maximum loads were 63.783N and 33.75N, respectively. The damage prevention and durability can be improved by applying the study results to the design of real indentation.

• Journal of the Korean Society of Safety
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• v.13 no.2
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• pp.22-29
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• 1998

The natural convection cooling of simulated electronic chips located on a printed circuit board(PCB) has been studied by Computer Aided Engineering(CAE). In CAE, 3-dimensional finite element model of simulated electronic chip was made to accomplish heat transfer analysis at each design stage of a printed circuit boards for thermal optimization. The simulated electronic chips are installed protrudent from the plate about 3mm. The materials the plates are epoxy and aluminum. The results show that the chip with relatively high heat generation rates should not be close to each other. It is found, as well that cooling effect for the aluminum plate is superior to the epoxy plate and location of maximum temperature is significantly influenced by the structure variation of PCB. In developing PCB and electronic chips, it's recommended that CAE is very useful to estimate to the distribution of temperature.

• The Magazine of the IEIE
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• v.21 no.8
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• pp.39-47
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• 1994

전자제품의 소형화와 반도체 및 관련 Packaging 기술의 발달로 인해 PCB는 회로의 세선화 및 Via Hole의 소형화, 다양화 그리고 두께의 박판화의 추세로 사양이 변하고 있다. 이를 달성하기 위해 PCB 제조 Process에 변화가 있으며 또한 새로운 형태의 PCB 제조방법이 모색되고 있다. 원판에서도 박판화의 대응으로 내연성이 강조되고 있으며 고주파용으로는 저유전율, 특수 동박이 요구되고 있다. 신 PCB 제조공정 및 공법으로는 특수 Via Hole 사용, ?, ED, Direct Plate가 있다. 또한 PCB는 Packaging 기술의 하나로 이해되며 강조되고 있다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.10
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• pp.5974-5979
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• 2014

Lightweight parts with very uniform precision are manufactured by an indent method and the press technique has been improved. Upon assembly with an indent method, a deformation force due to the compressive force occurs between the pin and hole and the contact surface is affected by damage. Therefore, a 3 dimensional model was made using the CATIA program and the damage on the surface contacted with indent was estimated through the ANSYS program in this study. In the analysis result, the maximum load applied at the PCB plate was 21.3 N when the pin goes through the PCB plate. When PCB plate came out of the pin, the maximum load was 19.24 N. As the structural analysis result, the maximum equivalent stress of Pin 1 was 192.96MPa because the maximum stress occurs at Pin 1 among all parts of this study model. By examining the damage property of the contacted indent and applying this study result to the design of real indentation, the damage can be prevented and the durability can be estimated.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.05a
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• pp.78-81
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• 2002

Printed Circuit Boards for satellite are composed of multi-layered copper plate and glass epoxy. Each copper layer have the complicated and different pattern to operate correctly for its mission. Especially. copper layer give effect on the PCB stiffness seriously. But It can make more complicate to predict the exact stiffness of PCB. In KOMPSAT-2 program, too many type of PCB are used for each electronic unit, and they have different type of pattern of copper layer. Solar array regulator has two type of PCB and it will be considered for this study. In this study. we calculate the PCB board stiffness of KOMPSAT-2 SAR unit considering the concept of simplified representative volume element. It will be correlated with the test results under KOMPSAT-2 vibration environmental condition to increase the reliability of this study.

• Journal of the Semiconductor & Display Technology
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• v.20 no.3
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• pp.6-10
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• 2021

Recognition of characters printed or marked on the PCB components from images captured using cameras is an important task in PCB components inspection systems. Previous optical character recognition (OCR) of PCB components typically consists of two stages: character segmentation and classification of each segmented character. However, character segmentation often fails due to corrupted characters, low image contrast, etc. Thus, OCR without character segmentation is desirable and increasingly used via deep neural networks. Typical implementation based on deep neural nets without character segmentation includes convolutional neural network followed by recurrent neural network (RNN). However, one disadvantage of this approach is slow execution due to RNN layers. LPRNet is a segmentation-free character recognition network with excellent accuracy proved in license plate recognition. LPRNet uses a wide convolution instead of RNN, thus enabling fast inference. In this paper, LPRNet was adapted for recognizing characters printed on PCB components with fast execution and high accuracy. Initial training with synthetic images followed by fine-tuning on real text images yielded accurate recognition. This net can be further optimized on Intel CPU using OpenVINO tool kit. The optimized version of the network can be run in real-time faster than even GPU.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.34 no.6
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• pp.42-50
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• 2006

This paper addresses the optimized thermal modeling methodology for spacecraft board level thermal analysis. A direct thermal modeling of external and internal structure of active parts which have high power dissipation is newly proposed, based on conventional plate modeling for Printed Circuit Board(PCB). The parts thermal modeling results were compared with other generic methodologies and verified by thermal vacuum test. This parts thermal modeling was directly applied to thermal analysis of CS(Communication Subsystem) board of HAUSAT-2 small satellite. As a result, it was confirmed that the parts thermal modeling can complement other conventional modeling methodologies. A parts thermal modeling is very effective for thermal control design, since the existing thermal problems can be solved at the parts level in advance.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.8
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• pp.4736-4741
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• 2014

This study examined PCB component cleaning on a PCB component surface, which has defects of precipitation type washing (existing rinse method), sealant and foreign material formed in the adhesive process that could not be removed easily. The spin jig was developed for PCB component cleaning, in which the PCB component settled down, to solve the conventional problem of the removal of foreign material with the centrifugal force by high speed rotation. The results are as follows. With decreasing fraction defect in PCB component washing, the development and substrate damage decreased by more than 80% according to the abstergent in the rotary type using the centrifugal force in the existing precipitation type. When the base plate showed a large difference with the time to include the process after washing the design using the existing method, easy attachment and separation of the PCB component could be possible. The washing time was enhanced 90% compared to the existing time. The reliability of the security and washing collaboration of the design and stability of the cleaning process could be secured so that there was no phenomenon of secession, the PCB component fixed for a cleansing rotation jig could maintain a fixed force by the centrifugal force. The stability and reliability of the washing process and the defective rate could be improved to less than 1%.

• Proceedings of the KIEE Conference
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• 2008.10a
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• pp.111-112
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• 2008

Induced electromagnetic fields of printed circuit board are computed using method of moment. In this calculation PEC and dielectric boards are considered when exposed to the external fields. The volume and surface integral equations are presented for the electromagnetic wave scattering from plate structures composed of dielectric and conducting objects. To reduce the computing time a fast multipole technique is applied.

• Proceedings of the KIPE Conference
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• 2020.08a
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• pp.304-305
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• 2020

본 논문은 초소형 전기자동차용 Low voltage DC-DC Converter(LDC)의 고전력밀도화 기법을 제시한다. Sync-Buck 구조를 사용해 구조를 단순화하고, Planar 인덕터 적용, PCB와 방열 plate를 사용하여 PCB와 방열 기구물의 접촉면을 증대시킴으로써 전력밀도를 향상시킬 수 있음을 보인다. 500W(12V, 41.67A)급 시제품 제작 및 배터리 입력 조건인 58V~84V 영역에서 실험을 통해 제안한 기법의 타당성을 검증한다.