• Journal of Korean Society of Industrial and Systems Engineering
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• v.16 no.28
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• pp.1-8
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• 1993

Electrical or electronic products have been becoming smaller and high integrated recently, with printed circuit boards(PCB's) being the key components for these products. The introduction of new technology of surface mounted devices(SMD) opens new ways towards high integration on the PCB. Many plants in eletronical industry which produce high variety of PCB's to meet the demands of customer orders require flexibility in PCB's production lines. This survey paper describes the related optimization problems and solution methods to the automated surface mount technology(SMT) assembly lines, and provides with the research direction for improving flexibility.

• Journal of the Semiconductor & Display Technology
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• v.10 no.1
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• pp.113-118
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• 2011

This paper proposes computer visual inspection algorithms for PCB defects which are found in a manufacturing process. The proposed method can detect open circuit and short circuit on bare PCB without using any reference images. It performs adaptive threshold processing for the ROI (Region of Interest) of a target image, median filtering to remove noises, and then analyzes connected components of the binary image. In this paper, the connected components of circuit pattern are defined as 6 types. The proposed method classifies the connected components of the target image into 6 types, and determines an unclassified component as a defect of the circuit. The analysis of the original target image detects open circuits, while the analysis of the complement image finds short circuits. The machine vision inspection system is implemented using C language in an embedded Linux system for a high-speed real-time image processing. Experiment results show that the proposed algorithms are quite successful.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.548-549
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• 2007

과거 PCB 제조의 주된 화제는 다양한 산업분야의 발전을 위해 한정된 시간 안에 좀 더 많은 PCB를 양산하는 기술 개발에 집중되어 있었지만, 현재는 비정상적인 공정 상태를 파악함으로써 제조 공정 환경에서의 오류를 줄여 전체 수률을 높이는 방법에 시선을 돌리고 있다. PCB 에칭의 경우 에칭 용액의 상태를 실시간으로 모니터링 하는 것이 중요하다. 본 논문에서는 기존 애칭용액의 상태를 판단할 때 사용되는 ORP 센서 대신, RGB 센서를 이용하여 실시간으로 용액의 상태를 모니터링 할 수 있는 시스템을 개발 하였다. 개발된 시스템을 이용하여 기존 ORP 시스템과의 비교 분석을 및 RGB 센서률 이용한 모니터링 방법이 ORP 센서를 이용한 방법 보다 좀 더 쉽고 정확하게 에칭 액의 상태를 모니터링할 수 있다는 것을 확인 하였다.

• Journal of Practical Engineering Education
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• v.16 no.2
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• pp.179-184
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• 2024

Printed circuit boards (PCBs) are a key component widely used in the production of electronic products, and not only quantitative growth but also qualitative developments such as integration cannot be ignored. Wave soldering equipment is commonly used equipment at manufacturing sites, but it is impossible to configure a dedicated equipment environment suitable for each PCB specification during the preliminary research and prototype development stage. It is neither suitable for development within limited time line nor manufacturing various product groups because only equipment setting conditions can be changed within a given time. In this study, we introduce a case of introducing a PCB pallet to enable selection of optimal process conditions within the limited environment described above. In addition, by presenting a discriminant that can determine in advance whether production is possible with current general-purpose equipment, it is expected that problems that may arise due to limitations in the general-purpose wave soldering equipment environment can be identified and resolved in advance. Ultimately, this palette makes it possible to shorten the development period and improve productivity.

• International Journal of Precision Engineering and Manufacturing
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• v.4 no.1
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• pp.23-29
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• 2003

Stencil is used normally as a mask for solder pasting on pad of a printed circuit board (PCB). The objective of this study is to develop a stencil cutting system and determine the optimal conditions to make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse duration on the cut edge quality were investigated. In order to analyze the cut surface characteristics (roughness, kerfwidth, dross) optical microscopy, SEM microscopy and roughness measurements were used. As a result, the optimal conditions of cutting process parameters were determined, and the practical feasibility of the proposed system was also examined by using a commercial Gerber file for PCB stencil manufacturing.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.66 no.10
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• pp.1508-1515
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• 2017

This paper proposes the defect detection method for automatic inspection machines in printed circuit boards (PCBs) manufacturing system. The defects of PCB such as open, short, pin hole and scratch can be detected by comparing the standard image and the target image. The standard image is obtained from CAD file such as ODB++ format, and the target image is obtained by arranging, filtering and binarization of captured PCB image. Since the PCB size is too large and image resolution is too high, the image processing requires a lot of memory and computational time. The wavelet transform is applied to compress the standard and target images, which results in reducing the memory and computational time. To increase the inspection accuracy, we utilize the he HH-domain as well as LL-domain of the transformed images. Experimental results are finally presented to show the performance improvement of the proposed method.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.8
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• pp.772-777
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• 2009

The geometric distortion of image is one of the most important parameters that take effect on the accuracy of optical inspection systems. We propose a new correction method of the image distortion to increase the accuracy of PCB inspection systems. The model-free method is applied to correct the randomly distorted image that cannot be represented by mathematical model. To reduce the correction time of inspection system, we newly propose a grid reduction algorithm that minimize the number of grids by the quad-tree approach. We apply the proposed method to a PCB inspection system, and verify its usefulness through experiments using actual inspection images.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.05a
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• pp.342-345
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• 2004

We design a new actuator in order to achieve 3-axes motion for high performance optical device. The actuator makes it possible to control the tilting motion by using moving magnet and PCB-coil, which have benefits in terms of prices and manufacturing. To predict the features of actuator, especially the effect of moving magnet, finite element method and electro-magnetic analysis are used From comparing simulated data with experimental results, we verified the accuracy of the simulation and the superiority of the present actuator.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.15 no.2 s.95
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• pp.156-160
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• 2005

We design a new actuator of 3-axis motion for high performance optical devices. The actuator makes it possible to control the tilting motion by using moving magnet and PCB-coil, which have benefits in price and manufacturing. To predict the characteristics of the actuator, especially the effect of moving magnet, finite element method and electro-magnetic analysis were used. By comparing simulation data with experimental results, we verified the accuracy of the simulation and the superiority of the present.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.4
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• pp.132-137
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• 2018

Although the number of chemical accidents has been declining since the Chemical Control Act of 2015, there have been repeated occurrences of similar types of accidents at printed circuit board (PCB) manufacturing facilities. These accidents were caused by the overflow of hydrochloric acid and hydrogen peroxide, which are toxic chemicals used in the printed circuit board manufacturing process. An analysis of the $Cl^-$ content to identify the cause of the accident showed that in the mixed route of hydrochloric acid and hydrogen peroxide, which are accidental substances, the $Cl^-$ concentration was 66.85 ppm in the hydrogen peroxide sample. Through reaction experiments, it was confirmed that the deformation of a PVC storage tank and generation of chlorine gas, which is a toxic gas, occurred due to reaction heat occurring up to $50.5^{\circ}C$. This paper proposes a facility safety management plan, including overcharge, overflow prevention, leak detection device, and separation tank design for mixing prevention in printed circuit board manufacturing facility etch process. To prevent the recurrence of accidents of the same type, the necessity of a periodic facility safety inspection and strengthening of the safety education of workers was discussed.