• 한국표면공학회지
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• 제54권3호
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• pp.158-163
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• 2021

Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process, essential considerations how to overcome the fundamental problems, such as the sizing, process sequence and PCB process design have been described.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2004년도 춘계학술대회논문집
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• pp.362-365
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• 2004

'Coil' occupies a much important position in delivering driving force of optical pick-up actuators. Up to now the main stream has been a winding coil type actuator, but actuators using FP-Coil(Fine Pattern Coil) have been considered for the more compacted and simple manufacturing process and have variously spreaded the application fields by product. We have tried to design actuators using PCB-Coil(Printed Circuit Board Coil) which has benefits in terms of price and manufacturing process. Especially this research has two main things those are to reduce the vibration of sub-resonance and to assure the do sensitivity in the performance of asymmetric optical pick-up actuator with PCB-Coil.

• 산업공학
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• 제13권3호
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• pp.503-511
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• 2000

The main theme of this research is a case of e-Business implementation in part manufacturing industry, especially in a PCB manufacturing company. The characteristics of part manufacturing industry are as follows. First, an ERP system runs as a legacy system that is ready to be combined with e-Business system. Secondly, the number of customers is very small. The customers are not many individuals but only a few big electronic enterprises that are strategically affiliated with the part manufacturing company. This means that the e-Business of the part manufacturing industry needs to focus on sharing pertinent information throughout the transactions with the customers, not on data-warehousing or data-mining customers' potential needs or requests. In this paper, we extracted e-Business opportunity domains from a PCB manufacturing company, a typical part manufacturing industry. We are intended to enhance information sharing between customers and the company, and provide functions of transactions necessary in the whole value chain from order to shipment. Implementing the e-Business system on the Web can increase the visibility of customers, and further, the company can be transformed into an extended enterprise where the relationship with the customers becomes very close and interleaved. Also, the Cyber Office functionality of the e-Business system can support the salespersons effectively, so that they can spend more time on customer satisfaction. Such efforts, in the future, can be a basis for active adaptation to the industry transformations such as forming e-community and participating in the marketplace.

• 한국산학기술학회논문지
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• 제15권12호
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• pp.6967-6972
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• 2014

기계적 체결 방식으로 볼트와 너트를 이용한 결합 방식과 리벳이나 핀이 널리 사용되고 있다. 압입 방식은 다른 생산방법에 비하여 쉽게 가공 가능하며 재료의 인성이 우수하다. 하지만 실제적으로 압입방식으로 생산하는 과정에서 균열이 발생될 수 있는 경우가 많다. 따라서 본 연구에서는 CATIA 프로그램을 이용하여 핀이 PCB 판으로 들어가고 나가는 두 가지 경우의 모델을 만들고 ANSYS 프로그램을 이용하여 유한요소 해석을 수행하였다. Case 1 및 2의 경우에 핀이 PCB판에 들어갈 때, PCB판에서 작용되는 최대 하중은 각각 79.708N과 90.277N이다. 그리고 Case 1 및 2의 경우에, PCB판이 Pin에서 빠져나올 때의 최대 하중은 각각 63.783N과 33. 75N으로 각각 나타났다. 본 연구의 결과를 실제 압입 공정의 설계에 응용한다면 그 파손방지 및 내구성을 평가하는 데에 활용이 클 것으로 사료된다.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2009년도 추계학술대회 논문집
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• pp.421-426
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• 2009

This paper presents vibration analysis of maskless exposure module in Printed Circuit Board (PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the Finite Element Analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

• 한국소음진동공학회논문집
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• 제19권12호
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• pp.1322-1328
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• 2009

This paper presents vibration analysis of maskless exposure module in printed circuit board(PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the finite element analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

• 산업기술연구
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• 제21권B호
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• pp.67-74
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• 2001

According as the patterns of PCB (Printed Circuit Board) become denser and complicated, quality and accuracy of PCB influence the performance of final product. It's attempted to obtain trust of 100% about all of parts. Because human inspection in mass-production manufacturing facilities are both time-consuming and very expensive, the automation of visual inspection has been attempted for many years. Thus, automatic visual inspection of PCB is required. In this paper, we used an algorithm which compares the reference PCB patterns and the input PCB patterns are separated an object and a scene by filtering and edge detection. And than compare two image using pattern matching algorithm. We suggest an defect inspection algorithm in PCB pattern, to be satisfied low cost, high speed, high performance and flexibility on the basis of $640{\times}480$ binary pattern.

• 한국대기환경학회지
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• 제17권1호
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• pp.67-74
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• 2001

In the manufacturing process of PCB , three kinds of VOCs such as aceton, methanol and 2-metoxyethanol are being used. In this study, adsorption characteristics of activated carbon fibers(ACFs) and active carbon were examined to temove these VOCs. The experimental results showed that ACF has better adsorption and regeneration efficiency than activated carbon. Phenolic-resin based ACF showed the highest adsorption capacity and the capacity was not decreased after repeated regeneration by steam. On the adsorption and desorption experiments for ternary components, preferential adsorption with roll-over phenomena was appeared. 2-Metoxyethanol was strong adsorbaste and it displaced adsorbed methanol and aceton.

• 한국안전학회지
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• 제37권4호
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• pp.120-128
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• 2022

Printed circuit boards (PCBs) are a basic component in the electronics industry and are widely used in nearly all electronic products, such as mobile phones, tablet computers, and digital cameras, as well as in electric equipment. PCB manufacturing involves the use of many chemicals and chemical processes and therefore has more risks than other manufacturing sectors. This study aims to identify the causes of possible accidents during PCB manufacturing through risk assessment, develop and implement safety measures, and evaluate the effectiveness of these measures. Note that the safety measures developed to mitigate the risks of a certain process were also implemented for other similar processes. The risk assessments conducted over seven years, from 2015 to 2021, at a PCB manufacturing company identified 361 hazardous processes. Between 2016 and 2019, 41-56 hazardous processes were identified per year; such processes decreased to fewer than 20 per year after 2020. Application of the risk assessment results to the improvement of the hazardous processes with the similar characteristics seems to be effective in decreasing the risks. Equipment-related factors such as lack of appropriate maintenance, low work standards, and defective protection devices were responsible for 59.8% of all possible accidents. Because PCB manufacturing involves many chemicals, skin contact with hazardous substances, electric shock, fire, and explosion were the most common types of possible accidents (81.7%). In total, 505 safety measures were implemented, including 157 related to purchase and improvement of equipment and devices for safety (31.1%), 147 related to the installation/modification of fire prevention facilities (29.1%), and 69 related to the use of standard electrical appliances (13.7%). Risk assessment conducted after implementing the safety measures showed that these measures significantly decreased risk; 247 processes (68.4%) had a risk level of 3, corresponding to "very low," and 114 processes (31.6%) showed a risk level of 4, corresponding to "low." In particular, risk assessment of 104 processes with risk scores of 12 and 10 other processes with risk score of 16 showed that the risk decreased to 4 after implementing the safety measures. Thus, implementing these measures in similar manufacturing sectors that involve chemical processes can mitigate risk.

• 한국경영과학회:학술대회논문집
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• 대한산업공학회/한국경영과학회 2006년도 춘계공동학술대회 논문집
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• pp.1240-1245
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• 2006

PCB는 수십개의 주공정과 보조공정으로 구성된 제품으로 동일한 생산라인에서 로트 단위로 다품종 혼류 생산되고 있다. 따라서 PCB 제조라인에서는 많은 공정수, 높은 불량률, 다양한 공정설비 및 빈번한 설비고장, 중소기업의 낮은 설계 및 생산기술력, 빈번한 수주 변경 및 다품종 혼류, 긴급 수주 등과 같이 제조원가를 증가시키는 다양한 교란요인들이 항상 발생하고 있다. 본 연구에서는 생산성, 품질 등을 고려하면서 리드 타임을 단축하기 위하여 TOC DBR 기법을 개선한 2개의 DBR 개념을 도입하여 성공적으로 리드타임을 개선한 사례를 소개하고자 한다.