• 한국정밀공학회지
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• 제31권12호
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• pp.1077-1083
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• 2014

Multi-material Additive Manufacturing (AM) is being focused to apply for direct manufacturing of a product. In this paper, a three-dimensional circuit device (3DCD) fabrication technology based on the multi-material AM technology was proposed. In contrast with conventional two-dimensional Printed Circuit Board (PCB), circuit elements and conducting wires of 3DCD are placed in threedimensional configuration at multiple layers of the structure. Therefore, 3DCD technology can improve design freedom of an electronic product. In this paper, 3DCD technology is proposed based on AM technology. Two types of 3DCD fabrication systems were developed based on the Stereolithography and the Fused Deposition Modeling technologies. And the 3DCD samples which have same function were fabricated, successfully.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.989-992
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• 1997

The objective of this study is to develop stencil cutting process and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width on the cut edge quality were investigated. In order to analyze the cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. A a results, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial gerber file for PCB stencil manufacturing.

• 한국공작기계학회논문집
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• 제16권5호
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• pp.183-190
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• 2007

It is well known that abrasive waterjet(AWJ) was developed as a kind of high-density energy processing technologies. AWJ is used to obtain the better cutting quality of various materials such as metals, ceramics, glass and composite materials within a short manufacturing time because of the characteristics of heatless and noncontact processing. However, AWJ device still has some problems to obtain the high quality of thin workpiece. In this paper, we investigated the optimal microcutting conditions of AWJ, such as maximum pressure, cutting speed and standoff distance of thin multi-layered materials. The experimental results show that AWJ has possibilities and potential to apply to the microcutting of thin multi-layered materials for IT industrial applications.

• 한국기계가공학회지
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• 제4권3호
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• pp.20-31
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• 2005

The contents of mobile phones are rapidly appended and the structures are being changed substantially. Most of the problems with mobile phones are related with the vibrations and the displacements of PCB boards. In this study, the vibration magnitudes of the boards by impulses on the case are analyzed with the variations of the selected design parameters. The result shows that the extensive suppression of the vibrations are feasible by the proper selection of the design parameters. Also the suggested relationships between the parameter selections and the magnitudes of vibrations can be applied to establish a database for improved stability of the mobile phone structure which is a critical concern considering the short life span of the mobile phone models.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1987년도 정기총회 및 창립40주년기념 학술대회 학회본부
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• pp.430-434
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• 1987

This paper describes implementation of a robot programming system for automation of manufacturing products, which is embedded in the C programming language. World representation and motion primitives necessary to describe a manipulator task are provided by a set of procedure calls and user defined data structures. Off-line programming is implemented with graphic simulation as a debugging tool. PUMA 560 manipulators are used as a model for one task which inserts a nonstandard power IC Iota PCB. Communication facilities are provided for collision avoidance or two manipulators.

• 한국기계가공학회지
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• 제14권4호
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• pp.151-159
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• 2015

In this study, we developed an automated contact-type thickness measurement machine that continuously and precisely measures the thickness of a PCB module product using multi-LVDT sensors. The system contains a measurement part to automatically measure the thickness in real time according to the set conditions with an alignment supply unit and unloading unit to separate OK and NG products. The sensors were calibrated before assembly in the measuring machine, and precision and accuracy performance tests were also performed to reduce uncertainty errors in the measurement machine. In the calibration test, the precision errors of the LVDT sensor were determined to be $1-3{\mu}m$ as 0.1% at the measuring range. A measurement error of 0.8 mm and 1.0 mm thickness test standards were found to be $1{\mu}m$ and $4{\mu}m$, and the standard deviations of two 1.0 mm products were measured as $14{\mu}m$ and $8{\mu}m$, respectively. In the measurement system analysis, the accuracies of test PCB standards were found to be $2{\mu}m$ and $3{\mu}m$, respectively. From the results of gage repeatability and reproducibility (R & R) crossed, we found that the machine is suitable for the measurement and process control in the mass production line as 7.92% of total gage R & R and in seven distinct categories. The maximum operating speed was limited at 13 pcs/min, showing a value good enough to measure.

• Korean Chemical Engineering Research
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• 제52권2호
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• pp.272-277
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• 2014

본 연구는 인쇄회로기판(PCB) 제조 시 에칭공정에서 발생되는 구리이온($Cu^{+2}$)을 고농도로 함유한 황산 폐에칭액을 NF 막분리법을 사용하여 에칭액 회수와 구리이온 처리를 효율적으로 수행하기 위한 NF 막여과 공정의 운전조건을 설정하기 위한 기본 자료를 확보하는데 있다. 이를 위해 미국 Koch사의 SelRO MPS-34 4040 NF 막을 대상으로 구리이온을 고농도(5~30 g/L)로 함유한 모의 황산 폐에칭액의 cross-flow 나노여과 실험을 수행하여 투과 플럭스와 구리이온의 총괄 배제도를 측정하였다. 이 결과 투과 플럭스는 황산 폐에칭액 내 구리이온의 농도가 증가할수록, 황산 폐에칭액의 pH가 낮을수록 작아졌으며, 그 값은 최소 $4.5L/m^2{\cdot}h$에서 최대 $23L/m^2{\cdot}h$이었다. 황산 폐에칭액 내 구리이온의 총 배제도는 구리이온의 농도가 클수록, 용액의 pH가 낮을수록 그리고 폐에칭액의 순환유량이 작을수록 낮아졌으며, 황산 폐에칭액의 pH가 1 이상인 상태에서 70% 이상의 구리이온 배제가 가능하였다. NF 막을 12개월 동안 황산용액 내에 보관하여도 투과 플러스 와 구리이온 배제도의 유의한 변화가 없어 SelRO MPS-34 막모듈을 강산 조건에서 1년이상 막모듈의 교체 없이 산성 폐에칭액 처리에의 사용이 가능하였다.

• 대한기계학회논문집A
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• 제21권1호
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• pp.1-11
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• 1997

Austomated visual inspection(AVI) capability has become an important key component in the automated manufacturing system. In such a visual inspection system an intensity(or color) image of a scene is quickly affected by optical property of objects, condition and roughness of surface, lens and filters, image sensor property and lighting system. In particular, the lighting system disign is the most important factor, since it affects overall performance of the visual system. For fast and cheap automated visual inspection system it is important to obtain the good image quality which results from careful attention to the design of the lighting system. In this paper, the lighting subsystem of AVI system is analysed for the inspection of printed circuit board(PCB) patterns. The spectral reflectance of materials, which are composed of PCB, is measured for choosing the light source. The reflection property is theoretically obtained by a reflection model and also obtained by experiments which measure intensity with varying the viewing direction of image sensor and the lighting direction of illuminator. The illumination uniformity of a ring-type illuminator. The lighting system is designed based upon the experimental results and theoretial analysis.

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.31-36
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• 2012

본 연구에서는 고 융점을 지니는 Sn-3.5Ag, Sn-0.7Cu 솔더의 복합 진동 신뢰성을 고찰하였다. 테스트 샘플은 ENIG (Electroless Nikel Immersion Gold) 표면처리 된 BGA (Ball Grid Array)칩에 Sn-3.5Ag, Sn-0.7Cu 솔더볼을 접합 후, 솔더볼이 장착된 BGA부품을 OSP (Organic Solderability Preservative) 표면처리 된 PCB에 리플로우 공정을 통하여 실장 하였다. 복합 진동 신뢰성 시험 중에 부품의 저항 변화를 측정하기 위하여 BGA칩과 PCB는 데이지 체인을 구성하여 제작하였다. 이를 통한 저항의 변화와 시험 전후의 부품에 대한 전단 강도 시험을 통하여 두 종류의 솔더에 대한 복합환경에서의 신뢰성을 비교, 평가하였다. 120시간 복합 진동 동안 전기저항 증가와 접합강도 저하를 고려할 때 Sn-0.7Cu 솔더가 복합 환경에서 높은 안정성을 나타내었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.391-392
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• 2008

최근 나노 금속의 대량 생산에 대한 기술이 확보됨에 따라, 메탈젯을 이용한 연구가 활발히 진행되고 있다. 메탈젯의 연구 범위는 RFID, PCB, MLCC 전극, 태양전지전극, PDP 전극, EMC용재료 등 그 응용 범위를 넓혀 가고 있다. 이러한 응용 기술 대표적인 배선형성 기술인 PCB 제조에 대한 연구는 40um 이하의 고해상도 기판 개발을 요구하고 있다. 선폭은 40um 이하를 유지하면서, 두께는 10um 이상으로 CCL을 대체 하기 위한 기판 형성 기술은 응용기술은 가장 어려운 난이도의 기술이다. 메탈젯 기술은 매우 복합적인 연구분야로 나노 재료의 개발, 인쇄공정의 개발, 기재 표면처리 기술, 헤드 기술의 개발을 동시에 만족할 때 가능하다. 배선 형성을 위하여 나노 잉크를 이용하여 직접 인쇄를 진행하고, 소결하여 전도성을 얻게 된다. 본 연구에서는 미세노즐에 토출 가능한 잉크젯용 잉크 조성을 결정하고, 기판과의 신뢰성을 확보하기 위하여 접착력의 평가, 전도도의 평가, 건조 시간 조절을 통한 Crack 문제 해결, 미세 선폭의 균일성 조절에 관한 실험을 진행하였다.