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http://dx.doi.org/10.7736/KSPE.2014.31.12.1077

3-Dimensional Circuit Device Fabrication for Improved Design Freedom based on the Additive Manufacturing  

Oh, Sung Taek (Department of Precision Mechanical Engineering, Chungbuk National University)
Jang, Sung Hyun (Gumi Electronics and Information Technology Research Institute)
Lee, In Hwan (School of Mechanical Engineering, Chungbuk National University)
Kim, Ho Chan (Department of Mechanical & Automotive Engineering, Andong National University)
Cho, Hae Yong (School of Mechanical Engineering, Chungbuk National University)
Publication Information
Journal of the Korean Society for Precision Engineering / v.31, no.12, 2014 , pp. 1077-1083 More about this Journal
Abstract
Multi-material Additive Manufacturing (AM) is being focused to apply for direct manufacturing of a product. In this paper, a three-dimensional circuit device (3DCD) fabrication technology based on the multi-material AM technology was proposed. In contrast with conventional two-dimensional Printed Circuit Board (PCB), circuit elements and conducting wires of 3DCD are placed in threedimensional configuration at multiple layers of the structure. Therefore, 3DCD technology can improve design freedom of an electronic product. In this paper, 3DCD technology is proposed based on AM technology. Two types of 3DCD fabrication systems were developed based on the Stereolithography and the Fused Deposition Modeling technologies. And the 3DCD samples which have same function were fabricated, successfully.
Keywords
3-Dimensional Circuit Device; Additive Manufacturing; Fused Deposition Modeling; Sterolithography; Direct Writing;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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