• 제목/요약/키워드: PCB instrument

검색결과 8건 처리시간 0.022초

PCB 기구와 이종골을 이용한 경추체간 전방 유합술 (PCB Instrumentation with Lubboe Bone in Anterior Cervical Interbody Fusion)

  • 박정현;오성훈;이형중;김주헌;김영수;고용;김광명;오석전
    • Journal of Korean Neurosurgical Society
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    • 제30권11호
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    • pp.1284-1290
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    • 2001
  • Objective : PCB cervical instrument is a newly introduced fusion device which comprises cervical plate, cage (spacer) and screw system. It is developed to enhance fusion rate and stability, as well as to reduce complications related to hardware failure. We investigated the efficacy of clinical and radiological results of PCB instrument and Lubboc bone. Methods : From August, 1998 to October, 1999, authors performed 54 cases of anterior cervical interbody fusion with PCB instrument and Lubboc bone. Retrospective analysis was undertaken based on clinical and radiological findings. Clinical improvement was evaluated according to Odom's criteria. Cervical plain films and tomography were taken every 2 months to evaluate the degree of interbody fusion and disc height changes. Results : Bone fusion was observed in 36 cases(90%) over 6 months after operation, and during which time there was no significant interval change. There were 3 cases of hardware dislodgement. Disc height was increased significantly and preserved in all cases. Clinical outcome over good degree was seen more than 94% of patients. Conclusion : Longer follow-up period and comparative studies to similar instrument appear to be necessary, but this instrumentation system has shown high fusion rate and fewer adverse effects in our series. We believe this system might be indicated for the treatment of cervical trauma and degenerative disease in selective cases.

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A study of guaranteeing reliability for IC of electronic instruments according temperature

  • Yoon, Geon;Park, Yong-Oon;Kwon, Soon-Chang
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2005년도 ICCAS
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    • pp.320-323
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    • 2005
  • This paper discusses heat problem of IC, which composes the electronic instruments, to guarantee reliability of electronic instruments. And also proposes the unified equivalent model for various electronic instrument products to guarantee reliability and life of its parts. Because electronic instruments are down sizing and operated with high frequency, the internal temperature of electronic instruments is rising steadily. The internal temperature of the electronic instruments gives a big effect to electronic instrument's reliability and life. The semiconductor parts are the representative heat generation parts because of its complicated function, high frequency and high density. Consequently, guaranteeing reliability and life of electronic semiconductor is the important start point in securing the reliability and life of the electronic instrument product. Unfortunately, there are many factors, which affect heat dissipation efficiency. The heat dissipation efficiency follows the environment where the electronic instrument products are used. Therefore it is very difficult to define reliability and life of the electronic manufactures. Electronic instrument products are composed of printed circuit board (PCB), integrated circuit (IC), resistance, and capacitor and so on. And there are superposed thermal resistances, because the parts are arrayed on the printed circuit board (PCB), Therefore the total thermal resistance is variable. Consequently it cannot have same thermal model for each electronic instrument products. In the next part, we propose the unified equivalent model for various electronic instruments. And using the proposed equivalent model proofs the method for analysis reliability of electronic parts.

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반복복원 기법을 이용한 전자회로기판의 납땜부 형상 복원 (Shape Reconstruction of Solder Joints on PCB using Iterative Reconstruction Technique)

  • 조영빈;권대갑
    • 제어로봇시스템학회논문지
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    • 제5권3호
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    • pp.353-362
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    • 1999
  • This paper presents a shape reconstruction method for automatic inspection of the solder joints on PCBs using X-ray. Shape reconstruction from X-ray radiographic image has been very important since X-ray equipment was used for improving the reliability of inspection result. For this purpose there have been lots of previous works using tomography, which reconstructs the correct shape, laminography or tomosynthesis, which are very fast algorithm. Latter two methods show outstanding performance in cross-sectional image reconstruction of lead type component, but they are also known to show some fatal limitations to some kinds of components such as BGA, because of shadow effect. Although conventional tomography does not have any shadow effect, the shape of PCB prohibits it from being applied to shape reconstruction of solder joints on PCB. This paper shows that tomography using Iterative Reconstruction Technique(IRT) can be applied to this difficult problem without any limitations. This makes conventional radiographic instrument used for shape reconstruction without shadow effect. This means that the new method makes cost down and shadow-free shape reconstruction. To verify the effectiveness of IRT, we develop three dimensional model of BGA solder ball, make projection model to obtain X-ray projection data. and perform a simulation study of shape reconstruction. To compare the performance of IRT with that of conventional laminography or tomosynthesis, reconstruction data are reorganized and error analysis between the original model are also performed.

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몰드변압기의 보이드 결함 크기 판별 (Identification of Void Diameters for Cast-Resin Transformers)

  • 정기우;김성욱
    • 한국정보통신학회:학술대회논문집
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    • 한국정보통신학회 2022년도 추계학술대회
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    • pp.570-573
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    • 2022
  • 본 논문에서는 신경망 모델을 적용한 몰드변압기의 보이드 결함 크기 판별에 관한 연구를 수행하였다. PCB 기반의 로고우스키 코일형 부분방전 센서를 제작하여 부분방전 신호를 측정하였고, 보이드에 의한 부분방전 결함을 모의하기 위한 PD 전극계를 제작하였다. 또한 보이드는 원통형 모양의 알루미늄 틀을 제작하여 에폭시가 경화되는 과정에서 실린지를 삽입하고 공기를 주입하여 서로다른 직경을 가지는 4개의 시편을 제작하였다. 보이드 결함 크기 판별을 위해 부분방전 전하량, 방전 펄스 수, 위상 분포의 부분방전 특성 파라미터를 추출하여 Labview 기반의 VI (Virtual Instrument)로 역전파 알고리즘을 설계하였다. 실험 결과로부터 제작된 알고리즘은 90%이상의 판별률로 결함의 직경크기를 구분할 수 있었다. 본 연구의 결과는 현장에서 PD 측정 시 몰드변압기의 유지보수 및 절연물 교체의 근거 자료로 활용될 수 있을 것으로 판단된다.

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선박용 LED Chamber Light의 열 및 광학 특성에 관한 연구 (A Study on the Thermal and Optical Properties of a LED Chamber Light for Vessels)

  • 김상현;이도엽;김우성;장낙원
    • 한국전기전자재료학회논문지
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    • 제28권1호
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    • pp.57-63
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    • 2015
  • Recently, LED is widely used in the kinds of display devices or lighting. In this paper, we fabricated LED chamber light for naval vessels to replace to conventional chamber light using incandescent lamp. The LED package of chamber light was designed with luminous intensity of 5.5 cd, color temperature of $6,000{\pm}500K$, forward voltage of 3~3.2 V and input current of 60 mA. A LED module was composed of 36 LED packages and metal PCB. The VF and luminous intensity of LED package were getting down when temperature increased. The temperature of LED chamber light was measured by changing the number of LED package and applied current for one hour when an electric current flow. The heat transfer capability have been improved by using metal PCB. The power consumption of LED chamber light reduced by 86% compared to the conventional chamber light using incandescent lamp.

스마트 컨트롤 밸브 개발에 관한 연구 (A Study on the Development of Smart Control Valve)

  • 최영규
    • 한국정보전자통신기술학회논문지
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    • 제12권6호
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    • pp.582-590
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    • 2019
  • 우리나라는 저출산·고령화가 진행함에 따라 전체 인구의 14%를 웃도는 고령사회에 진입함으로써 1인 세대의 증가라는 사회변화에 직면해 있다. 고령사회에서 1인 세대 증가로 인한 가스화재 사고를 예방할 수 있는 효과적인 방법은 컨트롤 밸브를 설치하여 설정시간이 지나면 강제적으로 가스를 차단하는 방법이다. 본 연구에서는 밸브 핸들을 돌리지 않고 택트 스위치를 눌러 모터를 이용하여 웜기어와 헬리컬 기어로 동력을 전달하여 밸브를 좌우 회전하여 개폐 할 수 있게 개발하였고, 컨트롤러와 탈부착이 쉽게 전용 밸브를 개발함으로써 조립 및 검사가 용이하고, 부품 수 및 제품 사이즈를 줄여 원가 절감을 통해 경쟁력을 강화할 수 있도록 개발하였다. 또한 내구성 시험을 통해 12초에 한 번씩 ON/OFF 반복하여 34시간 동안 10,000번을 수행하는 동안 안정적으로 동작 할 수 있도록하여 9년 이상을 사용할 수 있도록 개발하였다. 개발 방법은 Solid works와 Altium Designer 툴을 활용하여 기구 및 PCB 설계를 진행하였고, Firmware 개발은 IAR Embedded Workbench 환경에서 개발하였다.

감마프로브용 전단증폭기와 주증폭기의 개발과 성능 평가 (Development and Performance Test of Preamplifier and Amplifier for Gamma Probe)

  • 봉정균;김희중;이종두;권수일
    • 대한핵의학회지
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    • 제33권1호
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    • pp.100-109
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    • 1999
  • 목적: 핵의학장비를 구성하는 신호처리단의 전단증 폭기와 주증폭기는 방사선의 에너지 정보를 주는 펄스를 분석하는데 중요한 부분이다. 이러한 신호처리부분들은 대부분 크기가 표준화된 상용의 Nuclear Instrument Module (NIM)을 사용한파. 그러나, NIM은 이동형 감마프로브에 사용하기에는 너무 부피가 커서 부적합한 편이다. 이를 위해 본 연구는 이동형 감마프로브에 적합한 소형화된 전단증폭기와 주증폭기를 자체 제작하여 성능평가를 하였다. 대상 및 방법: 본 연구에서 제작된 전단증폭기는 전하민감형 전단증폭기였으며, 주증폭기는 capacitor resistor-resistor capcitor (CR-RC) 회로를 이용하여 제작되었다. 제작 후 성능평가를 위해 $2"{\times}2"$ NaI(T1) 섬광체가 부착된 EP-047 (Bicron Saint-Gobain/Norton Industrial Ceramics Co., Ohio, U.S.A) 검출기와 $1"{\times}1"$ NaI(T1) 섬광체가 부착된 R1535 (Ha-mamatsu Photonics K.K., Electron Tube Center, Shizuoka-ken, Japan) 검출기를 다중채널분석기인 AccuSpec/A (Canberra Industries Inc., Meriden Conneticut, U.S.A)를 이용 에너지 스펙트럼을 얻었다. NIM은 TC 145 (Oxford Instruments Inc., Oak Ridge, U.S.A)와 TC241 (Oxford Instruments Inc., Oak Ridge, U.S.A)을 이용하였다. 에너지 스펙트럼은 37 kBq ($1{\mu}Ci$) Cs-137과 2.96 MBq ($80{\mu}Ci$) Tc-99m의 방사선원을 이용하여 250초씩 얻었다. 결과: 자체 제작한 진단증폭기와 주증폭기를 EP-047 검출기와 연결하여 얻은 Tc-99m (140 keV)과 Cs-137 (662 keV)의 에너지 분해능은 각각 12.92%, 5.01%이었으며, R1535 검출기를 연결하여 얻은 Tc-99m과 Cs-137의 에너지 분해능은 각각 13.75%, 5.19%이었다. 그리고 NIM을 EP-047 검출기와 연결하여 얻은 Tc-99m과 Cs-137의 에너지 분해능은 14.6%, 718%이었으나, R1535 검출기를 연결하여 얻은 Cs-137 에너지 스펙트럼은 광봉우리 위치가 변화되어 안정되지 못하였고, Tc-99m의 에너지 스펙트럼은 쉽게 얻을 수 없었다. 결론: 본 연구에서 자체 제작한 전단증폭기와 주증폭기는 광증배관의 종류에 관계없이 우수한 성능을 보여주었다. 결론적으로, 본 연구에서 제작한 전단증폭기와 주증폭기는 소형화된 계수용 감마프로브와 영상용 감마프로브에 활용하는데 유용할 것이라고 사료된다.

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Development of a smart rain gauge system for continuous and accurate observations of light and heavy rainfall

  • Han, Byungjoo;Oh, Yeontaek;Nguyen, Hoang Hai;Jung, Woosung;Shin, Daeyun
    • 한국수자원학회:학술대회논문집
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    • 한국수자원학회 2022년도 학술발표회
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    • pp.334-334
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    • 2022
  • Improvement of old-fashioned rain gauge systems for automatic, timely, continuous, and accurate precipitation observation is highly essential for weather/climate prediction and natural hazards early warning, since the occurrence frequency and intensity of heavy and extreme precipitation events (especially floods) are recently getting more increase and severe worldwide due to climate change. Although rain gauge accuracy of 0.1 mm is recommended by the World Meteorological Organization (WMO), the traditional rain gauges in both weighting and tipping bucket types are often unable to meet that demand due to several existing technical limitations together with higher production and maintenance costs. Therefore, we aim to introduce a newly developed and cost-effective hybrid rain gauge system at 0.1 mm accuracy that combines advantages of weighting and tipping bucket types for continuous, automatic, and accurate precipitation observation, where the errors from long-term load cells and external environmental sources (e.g., winds) can be removed via an automatic drainage system and artificial intelligence-based data quality control procedure. Our rain gauge system consists of an instrument unit for measuring precipitation, a communication unit for transmitting and receiving measured precipitation signals, and a database unit for storing, processing, and analyzing precipitation data. This newly developed rain gauge was designed according to the weather instrument criteria, where precipitation amounts filled into the tipping bucket are measured considering the receiver's diameter, the maximum measurement of precipitation, drainage time, and the conductivity marking. Moreover, it is also designed to transmit the measured precipitation data stored in the PCB through RS232, RS485, and TCP/IP, together with connecting to the data logger to enable data collection and analysis based on user needs. Preliminary results from a comparison with an existing 1.0-mm tipping bucket rain gauge indicated that our developed rain gauge has an excellent performance in continuous precipitation observation with higher measurement accuracy, more correct precipitation days observed (120 days), and a lower error of roughly 27 mm occurred during the measurement period.

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