• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.31-39
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• 2021

In this paper, warpage analysis that separates PCB for PoP (Package on Package) into unit and substrate using FEM (Finite Element Method), analysis of the effect of layer thickness on warpage, and SN (Signal-to-Noise) ratio by Taguchi method was carried. According to the analysis result, the contribution of the circuit layer on warpage was very high in the unit PCB, and the contribution of the outer layer was particularly high. On the other hand, the substrate PCB had a high influence of the circuit layer on warpage, but it was relatively low compared to the unit PCB, and the influence of the solder resist was rather increased. Therefore, considering the unit PCB and the substrate PCB at the same time, it is desirable to design the PCB for PoP layer-by-layer structure so that the outer and inner circuit layers are thick, the top solder resist is thin, and the thickness of the bottom solder resist is between 5 ㎛ and 25 ㎛.

• Journal of Applied Reliability
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• v.11 no.3
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• pp.245-249
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• 2011

Through the test of ESD(Electro Static Discharge) for PCB circuit, we are able to research on the ESD effect. This paper also studys on the ESD test method for measurement. In the measurement of the discharge current, we used current probe(TC-1). The applied voltage to the PCB metal is -3 kV HBM mode. In conclusion ESD influences exponentially greater impact in nearer PCB circuit.

• Journal of Industrial Technology
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• v.21 no.B
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• pp.67-74
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• 2001

According as the patterns of PCB (Printed Circuit Board) become denser and complicated, quality and accuracy of PCB influence the performance of final product. It's attempted to obtain trust of 100% about all of parts. Because human inspection in mass-production manufacturing facilities are both time-consuming and very expensive, the automation of visual inspection has been attempted for many years. Thus, automatic visual inspection of PCB is required. In this paper, we used an algorithm which compares the reference PCB patterns and the input PCB patterns are separated an object and a scene by filtering and edge detection. And than compare two image using pattern matching algorithm. We suggest an defect inspection algorithm in PCB pattern, to be satisfied low cost, high speed, high performance and flexibility on the basis of $640{\times}480$ binary pattern.

• Korean Journal of Materials Research
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• v.13 no.4
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• pp.239-245
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• 2003

In order to explore the possibility to extract precious metals from PCB(Printed Circuit Board) scrap by gravity separation, a high temperature melting process was adopted, from the recycling view point, to investigate the influence of viscosity on A1$_2$$O_3$-CaO$-SiO_2$ slag system composed of PCB scrap. For optimizing the pre-treatment process of PCB scrap, an experimental condition for the complete calcination and oxidation of organic materials in PCB scrap was established and a quantitative analysis of oxidized PCB scrap was also carrie out. It was found that 6 hours were enough for the complete oxidation of PCB scrap at 1273 K in an atmosphere condition. A slag, l5wt%$A1_2$$O_3$-45wt%CaO-40wt%SiO$_2$, was chosen as a basic slag composition which is determined based on the quantitative analysis of PCB scrap. Viscosities were measured in slag systems both made from pure fluxes and from PCB scrap with additional fluxes. Slag viscosities composed of pure fluxes were measured to be 5.29 poise and 30.52 poise at temperatures of 1773 and 1573 K, whereas that of PCB scrap with additional fluxes were 3.37 poise and 69.89 poise, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.4
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• pp.298-302
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• 2010

We investigated the resistance change behavior of SABiT (Samsung Advanced Bump interconnection Technology) technology-applied PCB (Printed Circuit Board) with the various bump sizes and fabrication conditions. Many testing samples with different bump size, prepreg thickness, number of print on the formation of Ag paste bump, were made. The resistance of Ag paste bump itself was calculated from the Ag paste resistivity and bump size, measured by using 4-point probe method and FE-SEM (Field Emission Scanning Electron Microscope), respectively. The contact resistance between Ag paste bump and conducting Cu line were obtained by subtracting the Cu line and bump resistances from the measured total resistance. It was found that the contact resistance drastically changed with the variation of Ag paste bump size and the contact resistance had the largest influence on total resistance. We found that the bump size and contact resistance obeyed the power law relationship. The resistance of a circuit in PCB can be estimated from this kind of relationship as the bump size and fabrication technique vary.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.6
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• pp.3667-3671
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• 2015

Through experiment that does not cause wrinkles in the forming process for the primary purpose for install PCB(Printed circuit board) the thickness variation of the material was investigated. Experimental results was showed that the forming height of the first process had Influence Material thickness variation in the second process, in the first process, the Entrance corner of the die must have round of the product height of 50%, and The height of forming should be as high as the thickness of the material than the original forming. Also as do implement the forming shape in the first process, the thickness of the material is thinned to 85%, Restriking in the second process was that The thickness of the material is thinned to 80%. Therefore, In order to implement a precise shape, Thinking that the material thinning, The die was maintain the shape of the original product, and It was obtain the effect of the compression that the punch is to be longer, as the sum of more than 20% of the material thickness in the depth of the original product.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.6 no.4
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• pp.28-36
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• 1995

The use of image planes can reduce effectively the radiated emissions from a printed circuit board. This work deals with the influence of image planes on radiation from current trace. The configu- rations of one and two layers of image planes on both sides of current trace are proposed. The radiated emissions of those configurations have been calculated by solving a set of electric field integral equations by the method of moments. The induced current distributions on image planes and the radiation patterns are analyzed for different configurations of image planes, the distance between current trace and image planes, and the frequency of signal current.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.42 no.12
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• pp.159-164
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• 2005

Recently, it has demanded high-speed digital circuits as information increase. Therefore, electromagnetic characteristics of compact microwave circuit occurred importantly. And, the effect of the imperfect ground plane on the signal integrity and influence of coupling between two parallel lines for high-speed digital transmission line on the printed circuit board is investigated by FDTD simulations in 3-D electromagnetic analysis method. The results of FDTD simulation are compared with the ADS simulation in commercial software, analyzed lumped element of modeling and electromagnetic wave's radiation of slot as frequency. As a consequence, when the slot in the ground plane is under microstrip line, it has much effect on propagation of wave.

• Journal of the Institute of Electronics and Information Engineers
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• v.49 no.12
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• pp.277-284
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• 2012

In this paper, we analyzed various noise in the video stream system that have largely influence on EMI noise. We presented the remedy for these various noises and then designed the wireless video streaming system for a vehicle. To minimize EMI noise, we derived the improvement of noise characteristic from impedance matching, new design of the inner layer of the PCB line design and new design of high-speed data Interfaces. As a result, the final system showed 40[dBuV/m] and 47[dBuV/m] dB in the each regulation band.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.625-628
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• 1999

Recently. high-density printed circuit boards(PCB) become indispensable with the minaturization of components. Nickel is deposited on the copper patterns and followed by the gold deposition for improving connection reliability between the printed circuit boards and electronic components. Conventionally electrodeposition has been applied to metalization of copper patterns. However metalization by this method is not applicable for the isolated fine and concentrated patterns. Therefore, metalization technology of the fine patterns by electroless plating is required in place of electrodeposition. The application of electroless nickel plating for interconnection with solder strongly relies on the solderability and the interactions between nickel and solder. Factors such as phosphorus content of the deposit additive and bath temperature may influence solderability of the electroless nickel deposit. So solderability of electroless nickel/ gold deposits was investigated with substrates plated changing the condition of nickel solution.