• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.17-25
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• 2006

Thermo-mechanical behavior of flip-chip plastic ball grid array (FC-PBGA) packages are characterized by high sensitive $moir\'{e}$ interferometry. $Moir\'{e}$ fringe patterns are recorded and analyzed for several temperatures. Deformation analysis of bending displacements of the packages and average strains in the solder balls for both single and double-sided package assemblies are presented. The bending displacement of the double-sided package assembly is smaller than that of the single-sided one because of its symmetric structure. The largest effective strain occurred at the solder ball located on the edge of the chip and its magnitude of the double-sided package assembly is greater than that of single-sided one by 50%.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.10 no.1
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• pp.31-45
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• 2006

Recently advanced device and sophisticated manufacture process by high-density, high-integration require critical inspection criteria in SMT(surface mounting technologies). Especially for solder paste which come out over 60% of inferior goods of all product, 3-dimensional inspection replaces 2-D inspection as a effectiveness substitute of this trend. Therefore this paper proposes a fast 3-D inspection system and measurement algorithm automatically inspecting 3-D solder paste of PCB in SMT assembly line. The proposed method generates 3-D surface of data using B-spline algorithm and then extracts to inspect the pad.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.5 s.182
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• pp.155-161
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• 2006

This paper introduces a new type of mechanical tape feeder for chip mounter. The mechanical feeder is composed of a pneumatic linear actuator and a linear feeding module with the application of a cam-slider. As semiconductor chips are getting smaller, PCB assembly makers require the feeder to position the chip with high accuracy. The linear feeding system improves the positioning accuracy of the chip by getting rid of the index error, which brings into existence on the sprocket rotating feeder. It also can make greatly reduce the dumping rate. The dumping error is caused by the impact occurred as the pawl to interrupt ratchet wheel rotation. The paper discusses its mechanism and mechanical performance. The positioning accuracy and the dynamic characteristic were measured for long time operation and analyzed. As a result, the feeder showed very good performance. However, the feeding system was dynamically unstable due to the cover film eliminator that is required to be modified

• Journal of the Semiconductor & Display Technology
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• v.5 no.3 s.16
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• pp.29-32
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• 2006

Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(Printed Circuit Boards), Thermal control of the reflow process is required in order to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD(Computational Fluid Dynamics) tool for predicting flow and temperature distributions. Porous plate was installed to prevent leakage flow which was one of the major problem of temperature uniformity in the reflow process. There is a separation region where the flow is turned. Outside wall made of porous plate is to prevent and minimize separation region for acquiring uniform temperature during operation. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.1-12
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• 2021

3D printing, which designs product in three dimensions, draws attention as a technology that will lead the future for it dramatically shortens time for production without assembly, no matter how complex the structure is. The paper studies the latest researches of 3D-printed electronics and introduces papers studied electronics components, power supply, circuit interconnection and 3D-printed PCBs' applications. 3D-printed electronics showed possibility to simplify facilities and personalize electric devices by providing one-stop printing process of electronic components, soldering, stacking, and even encapsulation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.2
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• pp.1-8
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• 2016

Generally, electrical circuits are fabricated as Printed Circuit Boards (PCBs) and mounted on the casing of the product. Additionally, this requires many other parts and some labor for assembly. Recently, molding technology has increasingly been applied to embed simple circuits in plastic casing. The technology is called a Molded Interconnected Device (MID). By using this technology, PCB fabrication can be replaced by molding, and much of the corresponding assembly process for PCBs can be eliminated if the circuit is simple enough for molding. Furthermore, as the improvement of conductive materials and printing technologies of simple electric circuits can be printed directly on the casing part, this also reduces the complexity of the product design and production cost. Therefore, this paper introduces a new MID fabrication process using direct 3D printing technology. Additionally, it is applied to an automotive part of a cruise control switch. The methodology and design are shown.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.35 no.11
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• pp.1036-1042
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• 2007

It is rather difficult to improve flight control computer(FLCC) hardware(H/W) development schedule due to lack of commercial off-the-self(COTS) tools or target specific tools. Thus, it is suggested to develop an enhanced process utilizing modeling, simulation and virtual reality tools. This paper presents H/W design process enhancement tool(PET) for FLCC design requirements such as FLCC input/output(I/O) signal flow, I/O fault detection, failure management algorithm, circuit logic, PCB assembly configuration and installation utilizing simulation and visualization in virtual space. New tool will provide simulation capability of various FLCC design configuration including shop replaceable unit(SRU) level assembly/dis-assembly utilizing open flight format 3-D modeling data.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.2
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• pp.70-77
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• 2010

This study proposed an auto focusing method for a multi-focus image in assembling lens modules in digital camera phones. A camera module in a camera phone is composed of a lens barrel, an IR glass, a lens mount, a PCB board and aspheric lenses. Alignment among the components is one of the important factors in product quality. Auto-focus is essential to adjust image quality of an IR glass in a lens holder, but there are two focal points in the captured image due to thickness of IR glass. So, sharpness, probability and a scale factor are defined to find desired focus from a multi-focus image. The sharpness is defined as clarity of an image. Probability and a scale factors are calculated using pattern matching with a registered image. The presented algorithm was applied to a lens assembly machine which has 5 axes, two vacuum chucks and an inspection system. The desired focus can be determined on the local maximum of the sharpness, the probability and the scale factor in the experiment.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.77-86
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• 2008

The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.390-395
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• 2001

Cooling characteristics using convection and conduction heat transfer in a parallel channel with extruding heat sources are studied numerically. A two-dimensional model has been developed for numerical prediction of transient, compressible, viscous, laminar flow, and conjugate heat transfer between parallel plates with uniform block heat sources. The finite volume method is used to solve this problem. The considered assembly consists of two channels formed by two covers and one PCB which has three uniform heat source blocks. Five different cooling methods are considered to find efficient cooling method in a given geometry and heat source. The velocity and temperature fields, local temperature distribution along surface of blocks, and the maximum temperature in each block are obtained.