• 대한산업공학회지
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• 제20권4호
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• pp.23-35
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• 1994

Efficient operation of a component placement machine with a multi-head in a PCB assembly process is considered. The problem consists of two subproblems, which are the optimal allocation of the component tape reels in the rack and the optimal mounting sequence of the components on a printed circuit board. We analyze the problem and propose a heuristic algorithm to solve it. The heuristic can be used for the one head case too. Computational experiences on some real world problems show the effectiveness of the heuristic in terms of speed and solution quality.

• 기술사
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• 제16권3호
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• pp.33-40
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• 1983

This paper is one of the case studies to improve the labor productivity of PCB assembly through Work Factor motion-time analysis and the application of the motion economy principles and the human factors engineering theory. In result, we can improve 129％ of the labor productivity by using a rotary table for the parts delivery. Therefore, it is expected that this result can be used for a lot of the manual works of the small and medium-sized industries especially.

• 한국산학기술학회논문지
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• 제15권12호
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• pp.6967-6972
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• 2014

기계적 체결 방식으로 볼트와 너트를 이용한 결합 방식과 리벳이나 핀이 널리 사용되고 있다. 압입 방식은 다른 생산방법에 비하여 쉽게 가공 가능하며 재료의 인성이 우수하다. 하지만 실제적으로 압입방식으로 생산하는 과정에서 균열이 발생될 수 있는 경우가 많다. 따라서 본 연구에서는 CATIA 프로그램을 이용하여 핀이 PCB 판으로 들어가고 나가는 두 가지 경우의 모델을 만들고 ANSYS 프로그램을 이용하여 유한요소 해석을 수행하였다. Case 1 및 2의 경우에 핀이 PCB판에 들어갈 때, PCB판에서 작용되는 최대 하중은 각각 79.708N과 90.277N이다. 그리고 Case 1 및 2의 경우에, PCB판이 Pin에서 빠져나올 때의 최대 하중은 각각 63.783N과 33. 75N으로 각각 나타났다. 본 연구의 결과를 실제 압입 공정의 설계에 응용한다면 그 파손방지 및 내구성을 평가하는 데에 활용이 클 것으로 사료된다.

• 산업공학
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• 제23권1호
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• pp.58-67
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• 2010

The purpose of this paper is to present the development processes of the assembly line tester of power transmission for lift truck. Because power transmission is most important part of lift truck, all assembled powertrain parts must be inspected for operational defects, pressures and RPM. Developed assembly line tester is designed to take about 25 minutes for inspecting each assembled power transmission and located it at the end of assembled line. The assembly line no-load tester consists of three parts: (1) the driving hardware part; for installing and operating the transmission. (2) control PCB part; send data from sensors to a computer and control driving part, (3) operation software of no-load tester; for an automatic inspection or manual inspection, for database management and printing transcripts.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 D
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• pp.2450-2452
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• 2003

We present a method to increase the productivity of multihead-gantry chip mounters for PCB assembly lines. To minimize the assembly time, we generate the mount sequence using the genetic algorithm. The chromosome, fitness function, and operators are newly defined to apply the algorithm. Simulation results are presented to verified the usefulness of the method.

• 한국해양공학회지
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• 제14권4호
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• pp.79-85
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• 2000

Press-fit pin connection is the solderless interference-fit between pins and plated through holes(PTH) in the printed curcuit board(PCB). Because of not only its simple assembly and absence of problems associated with soldering, but also its good mechanical and electrical characteristics, the press-fit pin connection technology has quickly gained wide acceptance in the telecommunications and computer industries. In this paper, the contact stress characteristics of the domestic CPF pin when inserted into the friction coefficients were compared and the stress variations of the compliant part of the pin, which have an influence on the performance, were displayed with the time and arc length after complete connected. It is supposed that the results will provide useful data to improve the performance of the pin-PCB interconnection mechanism.

• 제어로봇시스템학회논문지
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• 제21권3호
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• pp.276-282
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• 2015

This paper proposes a SMD (surface mounting device) classification method for the PCB assembly inspection machines. The package types of SMD components should be classified to create the job program of the inspection machine. In order to reduce the creation time of job program, we developed the automatic classification algorithm for the SMD packages. We identified the chip-type packages by color and edge distribution of the images. The input images are transformed into the HSI color model, and the binarized histroms are extracted for H and S spaces. Also the edges are extracted from the binarized image, and quantized histograms are obtained for horizontal and vertical direction. The neural network is then applied to classify the package types from the histogram inputs. The experimental results are presented to verify the usefulness of the proposed method.

• 제어로봇시스템학회논문지
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• 제6권8호
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• pp.697-702
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• 2000

The paper considers the problem of improving the productivity of surface mounting in the printed circuit board(PCB) assembly line. This problem is generally divided into two problems ; real assignment problem and pick-and -place sequencing problem which are known to have no polynomial time algorithms. In the last ten years algorithm designers have been trying to solve them separately. However they need to be solved jointly because they are highly interrelated. This paper proposes an evolutionary algorithm which can consider the two problems jointly and thus yield a better solution. In order to evaluate the proposed algorithm computer simulation is performed on real-life surface mounting machines. The proposed algorithm is expected to reduce the assembly time of surface mounting machines and thus improve the productivity.

• 제어로봇시스템학회논문지
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• 제15권2호
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• pp.225-230
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• 2009

We propose a template matching method for component inspection of SMD assembly system. To discriminate wrong assembled components, the input image of component is matched with its standard image by template matching algorithm. For a fast inspection system, the calculation time of matching algorithm should be reduced. Since the standard images of all components located in a PCB are stored in computer, it is desirable to reduce the memory size of standard image. We apply the discrete wavelet transformation to reduce the image size as well as the calculation time. Only 7% memory of the BMP image is used to discriminate goodness or badness of components assembly. Comparative results are presented to verify the usefulness of the proposed method.

• Transactions on Electrical and Electronic Materials
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• 제13권3호
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• pp.129-135
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• 2012

A number of surface mount technology (SMT) process variables including land design are considered for minimizing tombstone defect in flexible printed circuit assembly in high volume manufacturing. As SMT chip components have been reduced over the past years with their weights in milligrams, the torque that once helped self-centering of chips, gears to tombstone defects. In this paper, we have investigated the correlation of the assembly process variables with respect to the tombstone defect by employing statistically designed experiment. After the statistical analysis is performed, we have setup hypotheses for the root causes of tombstone defect and derived main effects and interactions of the process parameters affecting the hypothesis. Based on the designed experiments, statistical analysis was performed to investigate significant process variable for the purpose of process control in flexible printed circuit manufacturing area. Finally, we provide beneficial suggestions for find-pitch PCB design, screen printing process, chip-mounting process, and reflow process to minimize the tombstone defects.