• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.5
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• pp.1029-1034
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• 2012

This paper presents a cost-effective and high-performance film bulk acoustic resonator (FBAR) duplexer module for US-PCS handset applications. The FBAR device uses a glass wafer level packaging process, which is a more cost-effective alternative to the typical silicon capping process. The maximum insertion losses of the FBAR duplexer at the Tx and Rx bands are of 1.9 and 2.4 dB, respectively. The total thickness of the duplexer module is 1.2 mm, including the glass-wafer bonded Tx/Rx FBAR devices, PCB board, and transfer molding material.

• Proceedings of the KIEE Conference
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• 2008.10b
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• pp.211-212
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• 2008

본 논문에서는 LCD 구동 모들 PCB의 기능 검사를 위한 자동 검사시스템인 EVT(Emulated Vision Tester)를 제안하고 구현하였다. 기존의 대표적인 자동검사 방법으로는 전기적 검사나 영상기반 검사방식이 있으나 전기적 검사만으로는 Timing이 주요한 변수가 되는 LED 장비에서는 검출할 수 없는 구동불량이 존재하며 영상기반 검사는 영상획득에 일관성이 결여되거나 Gray Scale의 구분이 불명확하며 검출결과의 재현성이 떨어진다. EVT 시스템은 Pattern Generator에서 인가된 입력 패턴 신호라 구동모듈을 통한 후 출력되는 디지털 신호를 직접 비교하여 패턴을 검사하고 아날로그 신호 (전압, 저항, 파형)의 이상 여부도 신속 정확하게 검사할 수 있는 H/W적인 방법이다. 높은 검출 신뢰도와 빠른 처리 속도 뿐만 아니라 간결한 시스템 구성으로 원가절감 실현 등 많은 장점을 가진다.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.84-91
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• 2010

The bonding process of LCD panel is attaching an inner lead to an outer lead in the production line of LCD panel module. It is composed of an OLB process and a PCB bonding process. Since bonding tool assembly is one of the core parts of the bonding equipment that determines the durability and performance of the final product, much design efforts to enhance uniformity and efficiency of the process have been made. In this paper, FE analyses have been employed to determine the bonding tool size. Bonding tool of long bar shape has been simplified as a piece with same heater pitch, and appropriate boundary conditions such as convection and radiation are considered. Thermal analysis results by the FEM have been validated by the experiments. With the use of FE analysis varies design parameters and the corresponding effects have been evaluated. It was observed that the approach presented in this paper could be employed for the design of LCD module bonding tool.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1735-1736
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• 2006

As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

• Journal of international Conference on Electrical Machines and Systems
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• v.3 no.3
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• pp.248-251
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• 2014

As more vehicles become equipped with advanced electronic control systems, more consideration is needed with regards to automotive safety issues related to the effects of electromagnetic waves. Unwanted electromagnetic waves from the antenna, electricity and other electronic devices cause the performance and safety problem of automotive components. In general, Power Integrity and Signal Integrity analysis have been widely used, but these analyses have stayed PCB level. PCB base analysis is different from radiated emission TEST condition so its results are used just for reference. This paper proposes EMC optimization technology using module level 3-dimensional radiation simulation process closed to fundamental test conditions. If module level EMC analysis, which is proposed in this study, is applied to all automotive electronics systems, unexpected EMC noise will be prevented.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1669-1670
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• 2006

LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. But, with the development of blue LEDs and the improvement of LED brightness, color variation are becoming more and more popular as lighting and application devices in this page, 1 used the Light Tools which was a simulation program in order to recognize optical a few characteristic of LEDs arrangement along reflector matrial and designed LED Arranged 5 phi LED in 5mm interval In the square that was $10{\times}10$ And designs a reflection board on pcb, structural design of PCB changed as five type. - Aluminum, Gold. Chromium, Nickel, Copper.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.283-291
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• 2006

[ $\blacksquare$ ] Mega Trends $\blacksquare$ Ceramic Based Module -> PCB Based SiP $\blacksquare$ Mobile SiP decreases footprint more than 40% than discrete

• Journal of Korea Society of Industrial Information Systems
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• v.9 no.2
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• pp.89-95
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• 2004

CDMA is the way that more than one users can share the time and frequency at the same time and connect with multiple access in mobile communication. Multiple Access is indispensible for mobile communication because the limited frequency is able to be used by many users in mobile communication. CDMA is also applied to home network, military, business and medical sectors. This paper, presents a users should share limited frequency resource. CDMA module implemented with 8-layer PCB which consists of the Slice-board circuit, keeping Radio frequency characteristics and a slot type connector.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.5
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• pp.586-592
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• 2018

In this paper, HIC with various functions is proposed for the design 140W LED power control circuit. The proposed HIC integrates constant voltage/constant current circuit, short circuit protection circuit, internal constant voltage circuit, and dimmer circuit, thereby reducing the horizontal length of the PCB by 16% comparing with the conventional system. Through various experiments, we verified the performance of each block implemented inside of HIC with numerical results. (Constant voltage variation ratio: 2.9%, dimmer circuit duty variation within 5%, stable short protection at 720 mA) Since the PCB area can be significantly reduced by applying the proposed HIC. It is possible to reduce the PCB manufacturing time which takes up most of the manufacturing time, however, It is expected that the faulted power module can be replaced without replacing the whole PCB, so that maintenance / repair can be made easier.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.12 no.4
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• pp.51-56
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• 2012

Nowadays, For that reason, the tactical training system that were applied to recruit training center and police training, a real-life survivor game place is a drill using conventional training methods that there is no special training system at open terrain and field, there is no training accomplishment in conformity with battlefield situation portrayal. Therefore, this paper developed the tactical training evaluation system and real-time monitoring system that is compensated the defect and controlled sensing, interlock with PC as wireless a way of GUI using PCB mounted MICOM. This system evaluate drill that regulate sensor control module, tactical training system remotely according to what they should do, is installed to fit the occasion as to be reflected or transmission choosingly and is a 24V H/W drive module.