• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.05a
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• pp.674-675
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• 2016

In this paper, we propose a manufacturing process model of Internet of Things devices using a Printed Circuit Board (PCB)-mounted RFID tag chip for reducing electronic wastes. Electrical and electronic products require a PCB surface mount and many examination. Also, conventional barcode systems cannot provide traceability management in PCB manufacturing before finishing Surface Mount Technology (SMT) process. The proposed process model does not require workers' attaching and detaching process unlike barcode systems. Also, RFID tag chip can record all the data in manufacturing steps. Thus, the number of connections to a database management system (DBMS) can be reduced.

• Journal of Korean Society for Quality Management
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• v.26 no.2
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• pp.106-117
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• 1998

The following study has been undertaken to build QIP (Quality Improvement Process) of an inner-layer process in a PCB (Printed Circuit Board) manufacturing plant. The objective of the study is stabilization and optimization of the process through quality improvement. To do that, defective factors in process are gathered by the cause and effect analysis and classified by PFD (Process Flow Diagram), key factors are found out by PFMECA (Process Failure Mode and Effect Criticalty Analisis), DOE(Design of Experiments) is a, pp.ied to those key factors to optimize the process, SPC (Statistical Process Control) chart is used to maintain the optimal conditions of the process and to improve quality continuously, and a quality management system is developed to improve quality mind and quality system for the PCB jmanufacturing plant. Overall, QIP is established to improve quality for the PCB manufacturing plant in the study.

• KIPS Transactions on Software and Data Engineering
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• v.4 no.2
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• pp.65-70
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• 2015

In the PCB(Printed Circuit Board) manufacturing industry, the yield is an important management factor because it affects the product cost and quality significantly. In real situation, it is very hard to ensure a high yield in a manufacturing shop because products called chips are made through hundreds of nano-scale manufacturing processes. Therefore, in order to improve the yield, it is necessary to analyze main fault process and equipment that cause low PCB yield. This paper proposes a systematic approach to discover fault-causing processes and equipment by using a logistic regression and a stepwise variable selection procedure. We tested our approach with lot trace records of real work-site. A lot trace record consists of the equipment sequence that the lot passed through and the number of faults for each fault type in the lot. We demonstrated that the test results reflected the real situation of a PCB manufacturing line.

• Journal of the Korean institute of surface engineering
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• v.54 no.3
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• pp.158-163
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• 2021

Some studies on electrochemical additive manufacturing of metals were summarized in this technical report, and development status of selective electrochemical 3D printing technology was introduced. In order to apply it to the PCB mass production process, essential considerations how to overcome the fundamental problems, such as the sizing, process sequence and PCB process design have been described.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2005.05a
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• pp.207-214
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• 2005

Productivity and quality stability are very important competitive factors in PCB manufacturing lines that process the multiple types of products with the mixed process flows under frequent order information changes. MES is an appropriate IT solution to solve these problems in the medium-sized PCB manufacturing company. This paper introduces the MES development and its effects for a medium-sized PCB manufacturing company. The main functions of an implemented MES are delivery simulation, production scheduling, and production process monitoring. Productivity are improved up to $10{\sim}20%$ and manufacturing lead times per order are shortened up to 2 days according to the manufacturing scenarios.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.5
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• pp.397-401
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• 2008

Most of the topic in PCB industry was about increasing the volume of product for the development of electronics in numerous industrial application area. However, it has been emerged that yield improvement quality manufacturing via detecting any suspicious process in order to minimize the scrapped product and material waste. In addition, recently, restriction of hazardous substances (RoHS) claims that electronic manufacturing environment should reduce the harmful chemicals usage, thus the importance of monitoring copper etchant and detecting any mis-processing is crucial for electronics manufacturing. In this paper, we have developed real-time chemical monitoring system using RGB sensor, which is simpler but more accurate method than commercially utilized oxidation reduction potential (ORP) technique. The developed Cu etchant monitoring system can further be utilized for copper interconnect process in future nano-semiconductor process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.10
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• pp.2935-2944
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• 2009

This paper proposes Dual DBR(Drum-Buffer-Rope) system for a small-to-medium-sized PCB(Printed Circuit Board) manufacturing line. DBR method of TOC(Theory of Constraints) is an effective system for a small-to-medium-sized company to build production scheduling system. But to apply it to PCB line, it needs more technical consideration because of multiple constraints, looping process line and complex buffer management. This paper proposes an answer of these problems using Dual DBR to build production scheduling system more successfully. And it was confirmed that lead time was reduced more than 20% applying Dual DBR system to a domestic PCB manufacturing line actually.

• The Journal of the Korea Contents Association
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• v.17 no.7
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• pp.182-192
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• 2017

Recently, there is an increasing interest in analysis of big data that is coming from manufacturing industry. In this paper, we use PCB (Printed Circuit Board) manufacturing data to provide manufacturers with information on areas with high PCB defect rates, and to visualize them to facilitate production and quality control. We use the K-means and DBSCAN clustering algorithms to derive the high fraction of PCB defects, and compare which of the two algorithms provides more accurate results. Finally, we develop a system of MVC structure to visualize the information about bad clusters obtained through clustering, and visualize the defected areas on actual PCB images.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2009.10a
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• pp.421-426
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• 2009

This paper presents vibration analysis of maskless exposure module in Printed Circuit Board (PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the Finite Element Analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.19 no.12
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• pp.1322-1328
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• 2009

This paper presents vibration analysis of maskless exposure module in printed circuit board(PCB) manufacturing system. In order to complete exposure process in PCB, masking type module has been widely used in electronics industries. However, masking process confronts some limitations of application due to higher production cost for masking as well as lower printing resolution. Therefore, maskless exposure module is started to be in the spotlight for flexible production system to meet the needs of fabrication in variable patterns at low cost. Since maskless exposure process adopts direct patterning to PCB, vibration problems become more critical compared to conventional masking type process. Moreover, movements of exposure engine as well as stage generate vibration sources in the system. Thus, it is imperative to analyze the vibration characteristics for the maskless exposure module to improve the quality and accuracy of PCB. In this study, vibration analysis using the finite element analysis is conducted to identify the critical structural parts deteriorating vibration performance. Also, Experimental investigations are conducted by single/dual encoder measurement process under the operating module speed. Measurement points of vibration are selected by three places, which are base of stage, exposure engine and top of stage, to check the effect of vibration from the exposure engine. Comparisons between analysis results and experimental measurement are conducted to confirm the accuracy of analysis results including the developed FE model. Finally, this studies show feasibility of optimal design using the developed FE analysis model.