• Journal of Institute of Control, Robotics and Systems
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• v.16 no.5
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• pp.469-475
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• 2010

This paper presents a method of classifying discolored defects of metal pads using geometric texture for AFVI (Automated Final Vision Inspection) systems. In PCB manufacturing process, the metal pads on PCB can be oxidized and discolored partly due to various environmental factors. Nowadays the discolored defects are manually detected and rejected from the process. This paper proposes an efficient geometric texture feature, SUTF (Symmetry and Uniformity Texture Feature) based on the symmetric and uniform textural characteristics of the surface of circular metal pads for automating AFVI systems. In practical experiments with real samples acquired from a production line, 30 discolored images and 1232 roughness images are tested. The experimental results demonstrate that the proposed method using SUTFs provides better performance compared to Gabor feature with 0% FNR (False Negative Rate) and 1.46% FPR (False Positive Rate). The performance of the proposed method shows its applicability in the real manufacturing systems.

• Journal of the KSME
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• v.34 no.2
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• pp.112-117
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• 1994

최근의 전자기기는 반도체 기술의 급속한 발전에 따라 소형화, 고기능화 및 다양화 뿐만 아니라 경박단소화되는 추세에 있다. 이러한 시장의 요구에 대응하여 표면실장용 전자부품이 등장하여 그 사용이 점차증가하고 있고 여기에 발맞춰 국내 . 외 전자기기 제조업체가 제품내의 PCB를 SMD화하는 추세에 있다. 따라서 표면실장 부품의 조립을 위한 고밀도, 고정도의 실장기술의 개발이 요구되고 있다. 또한 부품 자동삽입 등 기존의 방법들로 조립된, 전자기기 내부에 사용 되는 PCB의 조립상태 및 각 부품의 특성들을 검사하기 위한 In-circuit Tester의 기술도 빠른 속도로 발전하여 자동화되어가고 있는 추세에 있다. 이에 따라 본 연구소에서는 '90년에 능 Mounter GCA-M2000 모델을 개발 완료하였고 현재 관련 사업부에서 양산중에 있으며, 아날로그 방식 및 디지털 방식의 In-circuit Tester 모델도 개발 완료하여 현재 양산 중에 있다. 이 지면을 빌어 소개할 기회를 갖고자 한다.

• Korean Journal of Optics and Photonics
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• v.20 no.4
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• pp.223-229
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• 2009

This paper describes the development of a simulator which can numerically calculate an image to be acquired in a machine vision system for automated optical inspection. The simulator is based on a ray tracing technique and composed of three modules which are an illuminating system, a specimen and an imaging system. Kinds of model parameters for modules and their values are carefully chosen from the direct measurement and the observation of related phenomena. Finally, the validity of the simulator is evaluated by logical analysis and by comparison with measured images.

• Proceedings of the IEEK Conference
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• 2003.07e
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• pp.2375-2378
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• 2003

In manufacture of printed circuit boards, one important issue is precisely to measure the three-dimensional shape of the solder paste silk-screened prior to direct surface mounting of chips. This paper presents the 3D shape reconstruction of solder paste using the optical triangulation method based on structured light or slit beam and the measurement algorithm for height, volume. area, and coplanarity on component pads from the 3D range image. Futhermore, statistical process control function is incorporated for process capability analysis.

• Proceedings of the Korea Information Processing Society Conference
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• 2001.04b
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• pp.1237-1240
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• 2001

최근 제품의 초소화와 반도체의 고집적화로, 작은 크기로 많은 리드를 제공하기 위해, 부품 밑면에 격자형태로 볼이 배열되어 있는 BGA나 CSP부품들이 최근 많이 이용되고 있다. 하지만, BGA는 한번 PCB에 장착되면, 볼 외관검사가 원천적으로 불가능하므로, 부품을 장착하기 전에 볼 품질의 검사와 부품의 정밀한 위치 및 각도의 측정이 요구된다. 본 논문에서는 BGA부품의 위치 및 각도를 추출하기 위한 방법과 볼을 검사하기 위한 알고리즘을 소개한다.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.48-51
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• 1997

This paper presents the algorithm of FIC inspection in chip mounter. When device is mounted on the PCB, it is impossible to get zero defects since there are many problems which can not be predicted. Of these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). In this paper, we proposed a new algorithm based on the Radon transform which uses a projection to inspect the FIC(Flat Integrated Circuit) device and compared this method with other algorithms. We measured the position error and applied this algorithm to our image processing board which is characterized by line scan camera. We compared speed and accuracy in our board.

• Journal of Institute of Control, Robotics and Systems
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• v.9 no.10
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• pp.774-781
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• 2003

The important factors that cause position error in X-Y robot are inertial force, frictions and spring distortion in screw or coupling. We have to estimate these factors precisely to correct position errors, Which is very difficult. In this paper, we makes systems to inspect metal stencil which is used to print solder paste on pads of SMD of PCB with low precision X-Y robot and vision system. To correct position error that is caused by low precision X-Y robot, we defines position error vector that is formed with position of objects that exist in reference and camera image. We apply MHT(Modified Hough Transformation) for the aim of determining the dominant position error vector. We modify reference image using extracted dominant position error vector and obtain reference image that is the same with camera image. Effectiveness and performance of this method are verified by simulation and experiment.

• KIPS Transactions on Software and Data Engineering
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• v.6 no.3
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• pp.135-140
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• 2017

SMT is an equipment that picks up electronic components and does precise placing onto PCBs. In order to do this, it stops in front of a camera installed in the middle to go over vision inspection. And after that it is move for placing. In this paper, We compared to the method of the placing after inspect to the stoped component and the moving component in front of the camera. As a result, This paper shows that the time efficiency of the fly-motion was increased by 9 percent than the stop-motion.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.29B no.1
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• pp.76-84
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• 1992

The vision system is essential for SMT(Surface Mounting Technology) automation. The system plays the role of matching the positions betweem SMD and PCB, and inspecting SMD in the final stage of mounting. Real-time processing and high-precision are indispensable for practical purpose. In this paper, a new algorithm for position matching and inspection of SMD is proposed, and which is implemented on the DSP board using DSP board using DSP5600. Experimental results show mean matching error within 0.1 mm in the direction of x,y and execution time within 300msec. Therefore, we could attain high-speed and high-precision of the vision system for SMT automation.

• IE interfaces
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• v.23 no.1
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• pp.58-67
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• 2010

The purpose of this paper is to present the development processes of the assembly line tester of power transmission for lift truck. Because power transmission is most important part of lift truck, all assembled powertrain parts must be inspected for operational defects, pressures and RPM. Developed assembly line tester is designed to take about 25 minutes for inspecting each assembled power transmission and located it at the end of assembled line. The assembly line no-load tester consists of three parts: (1) the driving hardware part; for installing and operating the transmission. (2) control PCB part; send data from sensors to a computer and control driving part, (3) operation software of no-load tester; for an automatic inspection or manual inspection, for database management and printing transcripts.