• 산업공학
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• 제11권2호
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• pp.79-92
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• 1998

For the PCB inspection by computer vision, in some cases, the MRLC file should prepared. The MRLC file contains a RLC(Run Length Code) and a direction flag. In this paper, a generating method of MRLC is described. It is composed of two procedure as followings; (i) rasterizing Gerber file which is a vectorized image of PCB panel, and (ii) calculating a MRLC that is useful for the inspection as a template image. The suggested procedures are written in C-language and executable on Windows 95 and Windows NT.

• 제어로봇시스템학회논문지
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• 제16권11호
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• pp.1089-1095
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• 2010

We propose an image segmentation method for auto-teaching system of PCB (Printed Circuit Board) assembly inspection machines. The inspection machine acquires images of all components in PCB, and then compares each image with its standard image to find the assembly errors such as misalignment, inverse polarity, and tombstone. The component window that is the area of component to be acquired by camera, is one of the teaching data for operating the inspection machines. To reduce the teaching time of the machine, we newly develop the image processing method to extract the component window automatically from the image of PCB. The proposed method segments the component window by excluding the soldering parts as well as board background. We binarize the input image by use of HSI color model because it is difficult to discriminate the RGB colors between components and backgrounds. The linear combination of the binarized images then enhances the component window from the background. By use of the horizontal and vertical projection of histogram, we finally obtain the component widow. The experimental results are presented to verify the usefulness of the proposed method.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1996년도 한국자동제어학술회의논문집(국내학술편); 포항공과대학교, 포항; 24-26 Oct. 1996
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• pp.109-112
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• 1996

The more integrated and smaller SMD are needed, new solder joints packaging technologies are developed in these days such as BGA(Ball Grid Array), Flip Chip, J-lead etc. But, it's unable to inspect solder joints in those devices by visual inspection methods, because they are hided by it's packages. To inspect those new SMD packages, an X-ray system for acquiring a cross-sectional image of a arbitrary plane is necessary. In this paper, an analysis for designing X-ray cross sectional imaging system is presented including the way for correcting the distortion of image intensifier. And we show computer simulation of that system with a simple PCB model to show it's usefulness in applying PCB solder joint inspection.

• 한국기계가공학회지
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• 제2권2호
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• pp.67-74
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• 2003

This paper presents the development of the Inspection machine for SMD mounted on cream solder of PCB. There are mounting errors of SMD such as misalignment, missing part, wrong orientation, wrong polarity and so on. The main hardware of the system consists of a machine vision part and a motion control part. Operating software has been developed in GUI environment to help user convenience. The Inspection Jobs consist of two procedures, that is, creation of the inspection reference data and automatic inspection. The Inspection reference data has a tree structure of linked list including PCB information, blocks, components, windows, and inspection methods. This paper presents versatile inspection methods which include a section length method, a projection method and histogram method. Therefore, user can choose the suitable procedure for various components. Finally, the automatic Inspection procedure using the reference data checks the mounting errors of components.

• 전기학회논문지
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• 제61권3호
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• pp.472-478
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• 2012

The inspection machine in PCB (printed circuit board) assembly line checks assembly errors by inspecting the images inside of the component inspection region. The component inspection region consists of region of component package and region of soldering. It is necessary to extract the regions automatically for auto-teaching system of the inspection machine. We propose an image segmentation method to extract the component inspection regions automatically from images of PCB. The acquired image is transformed to HSI color model, and then segmented by several regions by clustering method. We develop a modified K-means algorithm to increase the accuracy of extraction. The heuristics generating the initial clusters and merging the final clusters are newly proposed. The vertical and horizontal projection is also developed to distinguish the region of component package and region of soldering. The experimental results are presented to verify the usefulness of the proposed method.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 학술회의 논문집 정보 및 제어부문 A
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• pp.291-294
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• 2003

In this paper, 2D and 3D inspection algorithm for printed solder on PCB is introduced. The aim of inspection is the detection of error such as rich solder poor solder and missing solder. For Inspection, laser distance sensor is used. For 2D inspection, laser image that is created by normalizing laser data between 0 and 255 are used. Reference Image is made using gerber file. Image processing algorithm is used for 2D inspection. By adding thickness of metal stencil to laser image, volume for solder can be calculated and 3D inspection is carried out.

• 전기학회논문지
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• 제66권10호
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• pp.1508-1515
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• 2017

This paper proposes the defect detection method for automatic inspection machines in printed circuit boards (PCBs) manufacturing system. The defects of PCB such as open, short, pin hole and scratch can be detected by comparing the standard image and the target image. The standard image is obtained from CAD file such as ODB++ format, and the target image is obtained by arranging, filtering and binarization of captured PCB image. Since the PCB size is too large and image resolution is too high, the image processing requires a lot of memory and computational time. The wavelet transform is applied to compress the standard and target images, which results in reducing the memory and computational time. To increase the inspection accuracy, we utilize the he HH-domain as well as LL-domain of the transformed images. Experimental results are finally presented to show the performance improvement of the proposed method.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1996년도 한국자동제어학술회의논문집(국내학술편); 포항공과대학교, 포항; 24-26 Oct. 1996
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• pp.117-120
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• 1996

In this paper, a new approach to acquire the cross-sentional image for automatic solder joint inspection of double-sided PCB using X-ray source is presented. We designed the apparatus with fixed X-ray source to realize the cross-sectional image by tunning object and detector synchronously. The cross-sectional images are captured at several view angle of X-ray source, the geometric image distortions caused by view angle and the shape of image intensifier are compensated. The precision variation of cross-sectional image by the change of view angle was investigated. Also we acquired the cross-sectional image to the solder joint of double-sided PCB and reconstructed the shape of solder joint.

• 반도체디스플레이기술학회지
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• 제10권1호
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• pp.113-118
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• 2011

This paper proposes computer visual inspection algorithms for PCB defects which are found in a manufacturing process. The proposed method can detect open circuit and short circuit on bare PCB without using any reference images. It performs adaptive threshold processing for the ROI (Region of Interest) of a target image, median filtering to remove noises, and then analyzes connected components of the binary image. In this paper, the connected components of circuit pattern are defined as 6 types. The proposed method classifies the connected components of the target image into 6 types, and determines an unclassified component as a defect of the circuit. The analysis of the original target image detects open circuits, while the analysis of the complement image finds short circuits. The machine vision inspection system is implemented using C language in an embedded Linux system for a high-speed real-time image processing. Experiment results show that the proposed algorithms are quite successful.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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• pp.1774-1777
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• 1997

As factory automation is required, using the vision system is also essential. Especially, the pateh planning of parts with J-lead on PCB plays a import role of whole automation. Path planning is required because J-lead is scatteed compaed to L-lead on PCB. Therefore, in this paper, we propose path planning of part inspection with J-lead to use Hopfield Model(TSP : Traveling Salesman Problem). Then optical system suited to J-lead inspection is designed and the algorithm of J-lead solder joint and part inspection is proposed.