• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.23 no.12
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• pp.1045-1055
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• 2013

It is true that the dependency on import is currently high in case of the safety checkup system of domestic airplanes, and it is at the point of time that localization of HUMS for small airplanes is required. In this study, the design factors were selected for the lightweight of HUMS for small airplanes by using Pro-Engineer which is a design tool and Abaqus. 9 models were made through experiment plans with Taguchi method for this, and the each model for weight lightening was selected through vibration analysis and shock analysis while in operation with experiment profile values. After fabricating HUMS, it was verified that as a result of experiment with the same profile values as the analysis, there was similarity between the analyzed values and values of the experiment. As a result of performing weight lightening which is the purpose of the study, electronic performance for small airplanes is assured and a design plan reducing 15 % weight compared to the targeted weight was deduced. Besides, it could be verified that the light weight model satisfied the maximum allowable displacement value of PCB[printed circuit board] and accordingly satisfied electronic properties of HUMS. In this study, the reliability of a product was certified through the result of an experiment on ground. If the reliability of HUMS were verified through a test flight in the future, it is considered that it would make a big contribution to localization of aerospace electronic equipment.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.42 no.9
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• pp.789-794
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• 2014

The FPGA is used to the high speed digital satellite communication on the Digital Signal Process Unit of the next generation GEO communication satellite. The high capacity FPGA has the high power dissipation and it is difficult to satisfy the derating requirement of temperature. This matter is the major factor to degrade the equipment life and reliability. The thermal control at the equipment level has been worked through thermal conduction in the space environment. The FPGA of CCGA or BGA package type was mounted on printed circuit board, but the PCB has low efficient to the thermal control. For the FPGA heat dissipation, the heat sink was applied between part lid and housing of equipment and the performance of heat sink was confirmed via thermal vacuum test under the condition of space qualification level. The FPGA of high power dissipation has been difficult to apply for space application, but FPGA with heat sink could be used to space application with the derating temperature margin.