• Journal of IKEEE
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• v.25 no.3
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• pp.528-533
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• 2021

This paper presents the PCB heat dissipation characteristics of high density DC-DC converter for electric vehicles. This paper also analyzes the heat dissipation structure of the high density DC-DC converter and optimizes the PCB heat dissipation design of the high density power system through thermal analysis simulation. Based on heat transfer theory, the thermal path of general electronic devices is analyzed and the thermal resistance equivalent circuit is modeled in this paper. Additionally, the thermal resistance equivalent circuit of the 500W synchronous buck converter, which is addressed in this paper, is modeled to present a structural heat dissipation path for better thermal performance. The validity of the proposed scheme is verified through the thermal analysis simulation results and experiments applying multi-surface heat dissipation structure to a 500[W](12[V], 41.67[A]) synchronous buck converter prototype with an input voltage 72[V].

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.195-196
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• 2008

• Journal of IKEEE
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• v.23 no.4
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• pp.1473-1476
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• 2019

Accurate material information is very important in PCB (Printed Circuit Board) design. In an integrated mast of a battleship, heat reduction is essential for stealth functionality. So heat dissipation from internal control equipments should be reduced as much as possible. Control equipments mostly consist of PCBs, but it often suffers from impedance mismatching due to imprecise Dk (Dielectric Constant), which significantly increases heat dissipation. In this paper, measurement methods of Dk is investigated. Also, effects on impedance mismatch by Dk variation with operating frequency is investigated.

• Journal of Aerospace System Engineering
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• v.14 no.3
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• pp.51-59
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• 2020

In the case of cubesat, a PCB-based deployable solar panel advantageous in terms of weight reduction and electrical circuit design is widely used considering the limited weight and volume of satellites. However, because of the low thermal conductivity of PCB, there is a limit relative to heat dissipation. In this paper, the thermal gap pad is applied to the contact between the PCB-based solar panel and the aluminum stiffener mounted on the outside of the panel. Thus, the heat transfer from the solar cell to the rear side of the panel is facilitated. It maximizes the heat dissipation performance while maintaining the merits of PCB panel, and thus, it is possible to improve the power generation efficiency from reducing the temperature of the solar cell. The effectiveness of the thermal design of the 6U cubesat's deployable solar panel using the thermal gap pad has been verified through on-orbit thermal analysis based on the results, compared with the conventional PCB-based solar panel.

• Journal of the Korean institute of surface engineering
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• v.48 no.2
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• pp.33-37
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• 2015

High efficiency LED device is being concerned due to its high heat loss, and such heat loss will cause a shorter lifespan and lower efficiency. Since there is a demand for the materials that can release heat quickly into the external air, the organic insulating layer was required to be replaced with high thermal conductive materials such as metal or ceramics. Through anodizing the upper layer of Al, the Breakdown Voltage of 3kV was obtained by using an uniform thickness of $60{\mu}M$ aluminum oxide($Al_2O_3$) and was carried out to determine the optimum process conditions when thermal cracking does not occur. Two Ni layers were formed above the layer of $Al_2O_3$ by sputtering deposition and electroplating process, and saccharin was added for the purpose of minimizing the remain stress in electroplating process. The results presented that the 3-layer film including the Ni layer has an adhesive force of 10N and the thermal conductivity for heat dissipation is achieved by 150W/mK level, and leads to improvement about 7 times or above in thermal conductivity, as opposed to the organic insulation layer.

• Proceedings of the KIPE Conference
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• 2019.07a
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• pp.271-272
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• 2019

본 논문은 친환경 전기차용에 적용되는 있는 고밀도 LDC(Low-Voltage DC-DC Converter) 전력변환장치의 PCB구조와 스위칭소자에 따른 PCB의 발열특성을 해석한다. 전력변환장치 PCB사이에 알루미늄 플레이트를 적용하여 다면 방열경로를 통한 PCB방열특성을 비교하고, 또한 기존 Si-FET와 낮은 온 상태 도통저항을 가지는 GaN-FET 반도체디바이스를 적용한 전력변환장치의 PCB 방열특성을 시뮬레이션을 통해 비교 및 검토하였다.

• The Journal of the Korea institute of electronic communication sciences
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• v.18 no.4
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• pp.641-648
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• 2023

Recently, the rapid growth of artificial intelligence among the 4th industrial revolution has progressed based on the performance improvement of semiconductor, and circuit integration. According to transistors, which help operation of internal electronic devices and equipment that have been progressed to be more complicated and miniaturized, the control of heat generation and improvement of heat dissipation efficiency have emerged as new performance indicators. The DUT(Device Under Test) Shell is equipment which detects malfunction transistor by evaluating the durability of transistor through heat dissipation in a state where the power is cut off at an arbitrary heating point applying the rating current to inspect the transistor. Since the DUT shell can test more transistor at the same time according to the heat dissipation structure inside the equipment, the heat dissipation efficiency has a direct relationship with the malfunction transistor detection efficiency. Thus, in this paper, we propose various method for PCB configuration structure to optimize heat dissipation of DUT shell and we also propose various transformation and thermal analysis of optimal DUT shell using computational fluid dynamics.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.7
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• pp.310-316
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• 2019

In automotive application, customers are demanding high efficiency and various functions for convenience. The demand for these automotive applications is steadily increasing. In this study, it has been studied the analysis of heat flow to improve the PCB(printed circuit board) heating performance of WPC (wireless power charger) recently developed for convenience. The charging performance of the wireless charger has been reduced due to power dissipation and thermal resistance of PCB. Therefore, it has been proposed optimal PCB design, layout and position of electronic parts through the simulation of heat flow analysis and PCB design was analyzed and decided at each design stage. Then, the experimental test is performed to verify the consistency of the analysis results under actual environmental conditions. In this paper, The PCB modeling and heat flow simulation in transient response were performed using HyperLynx Thermal and FloTHERM. In addition, the measurement was performed using infrared thermal imaging camera and used to verify the analysis results. In the final comparison, the error between analysis and experiment was found to be less than 10 % and the heating performance of PCB was also improved.

• Journal of Power Electronics
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• v.19 no.1
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• pp.296-306
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• 2019

The flyback topology is being widely used in power adapters. The coupling capacitance between primary and secondary windings of a flyback transformer is the main path for common-mode (CM) noise conduction. A Y-cap is usually used to effectively suppress EMI noise. However, this results in problems in space, cost, and the danger of safety leakage current. In this paper, the CM noise behaviors due to the electric field coupling of the transformer windings in a flyback adapter with synchronous rectification are analyzed. Then a scheme with balance winding is proposed to reduce the CM noise with a transformer winding design that eliminates the Y-cap. The planar transformer has advantages in terms of its low profile, good heat dissipation and good stray parameter consistency. Based on the proposed scheme, with the help of a full-wave simulation tool, the key parameter influences of the transformer PCB winding design on CM noise are further analyzed. Finally, a PCB transformer for an 18W adapter is designed and tested to verify the effectiveness of the balance winding scheme.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.320-323
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• 2005

This paper discusses heat problem of IC, which composes the electronic instruments, to guarantee reliability of electronic instruments. And also proposes the unified equivalent model for various electronic instrument products to guarantee reliability and life of its parts. Because electronic instruments are down sizing and operated with high frequency, the internal temperature of electronic instruments is rising steadily. The internal temperature of the electronic instruments gives a big effect to electronic instrument's reliability and life. The semiconductor parts are the representative heat generation parts because of its complicated function, high frequency and high density. Consequently, guaranteeing reliability and life of electronic semiconductor is the important start point in securing the reliability and life of the electronic instrument product. Unfortunately, there are many factors, which affect heat dissipation efficiency. The heat dissipation efficiency follows the environment where the electronic instrument products are used. Therefore it is very difficult to define reliability and life of the electronic manufactures. Electronic instrument products are composed of printed circuit board (PCB), integrated circuit (IC), resistance, and capacitor and so on. And there are superposed thermal resistances, because the parts are arrayed on the printed circuit board (PCB), Therefore the total thermal resistance is variable. Consequently it cannot have same thermal model for each electronic instrument products. In the next part, we propose the unified equivalent model for various electronic instruments. And using the proposed equivalent model proofs the method for analysis reliability of electronic parts.