• Journal of IKEEE
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• v.22 no.3
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• pp.882-885
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• 2018

Recently, signal integrity on PCB (printed circuit board) becomes very important as the system operation speed increases. So far, PCB is customarily designed to minimize area and cost. However, ultra-high-speed PCB often fail to operate properly, unless it is precisely and carefully designed considering dielectric characteristics, line width, line spacing, and impedance matching. This paper surveys many problems in ultra-high-speed PCB and various design methods to mitigate them.

• Journal of the Korea Computer Industry Society
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• v.2 no.12
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• pp.1533-1540
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• 2001

In this paper, we described extraction method of electrical parameters and modeling method of PCB nets on PCB design process. To analyze electrical characteristics of real PCB structure, we selected a cache memory system as an experimental board and designed 6 layer PCB substrate. For extraction of the electrical parameters, we divided circuit elements into the components of conductor types which are wires, via holes, BGA balls etc. and combined the calculated value by real net structure to modeling the PCB nets. We analyzed the electrical characteristics of the PCB nets with the simulation tools of SPICE and XNS. The simulation analysis has shown that the maximum signal delay was 2.6ns and the maximum crosstalk noise was 281 mV and we found that the designed substrate was adequate to system specification.

• Journal of the Institute of Convergence Signal Processing
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• v.9 no.2
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• pp.135-140
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• 2008

In this paper, the spiral antenna with the center frequencies of 315MHz, 433MHz, and 447MHz for RKE system of a vehicle is designed on PCB. The antenna is microstrip line-fed, and applied PIFA concept near the feeding part to easily tune center frequency and input impedance. The PIFA-type spiral antenna with the size of $30mm{\times}20mm$ is designed on printed PCB by considering the effect of circuits and components on PCB, ECU case and vehicle body. Also chip inductor inserted dual-band spiral antenna of 315MHz and 447MHz is designed. We found that the antenna designed on PCB satisfied the antenna specifications through measurement and field test.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.05a
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• pp.303-306
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• 2012

According to the rapid development of cell phone and camera industry, all of electronic products obtain small-size, high-performance and variety. Therefore, PCB also obtains high-integration, multi-layers and high-specification rapidly. Among the digital cameras which are continuously evolved and developed, the market of mirror-less camera and hybrid digital camera is continuously increased because of the customer's request for small-size and weight lightening, except for DSLR camera. Therefore, the difficulty of PCB design is gradually increased and design L/T is longer according to the high-specifications, low-current and high-performance components. This thesis suggests the method to reduce L/T for PCB design applied to the reduction of digital camera's developing period and manufacturing period.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.12
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• pp.73-81
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• 2011

As high speed digital systems continue to use components with faster edge rate and clock speeds, transmission of the digital information, it can bring about many troubles. The increasing requirement for controlled impedance PCBs becomes both a critical success factor and a design challenge to implement a system. Especially, the noise sources in high frequency digital systems include the noise in power supply, ground and packaging, and they destroy the fidelity of signals. Therefore PCB design with impendence matching is needed to improve fidelity of signal in H/W. In this paper, we have developed an impedance control and analysis tool for multi-layer PCB design, and simulates the tracks controlled impedance with the test coupon. So, it can save the design time and support the economical PCB design.

• Proceedings of the KAIS Fall Conference
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• 2004.11a
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• pp.151-153
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• 2004

본 연구는 PCB 생산 자동화를 위하여 PCB 생산라인과 CAD 설계간의 다른 데이터 체계를 호환성을 갖춘 데이터 체계로 변환하는 인터페이스를 설계하였다. CAD로 설계한 PCB 부품 정보를 분석하여 Human error 검출 알고리즘을 개발하였고, IC 부품들에 관한 정보를 DB로 구축하였으며 데이터 호환을 위한 알고리즘과 인터페이스를 설계하였다. 기존의 수작업 공정을 자동화함으로서 1-2일 정도의 시간을 수분 이내로 단축시킬 수 있도록 하였다.

• The Journal of the Korea Contents Association
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• v.5 no.5
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• pp.17-25
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• 2005

In this paper, we design data transformation interface for the automation of PCB product. The data designed to CAD does not exchange itself for the assembly line, so we construct an automation system which is exchangeable. To do this, we analyze the information of PCB components and construct the Information of IC components as database. We also develope two kinds of algorithm; one is to detect human error and another is to exchange itself for the data which is suitable for PCB assembly line. We design data transformation interface to do addition and revision of the information for PCB assembly line. By automating existing manual processing, we are able to shorten access time and enhance reliability of the data and the efficient assembly line of PCB.

• Journal of IKEEE
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• v.21 no.3
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• pp.272-275
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• 2017

Recently, semiconductor integration density enormously increases and its interconnection width is significantly narrowed, which leads to EMI (electromagnetic interference) problems on chip level. Chip manufacturer exploits TEM cell (transverse electromagnetic cell) to measure EMI on chip level, which requires PCB (printed circuit board) for measurement purpose. However, it is often neglected to consider that PCB patterns and other factors can affect on EMI measurement. In this paper, several test patterns are designed for different PCB design variables, and effects of PCB patterns on EMI measurement in TEM cell are analyzed. Based on these analyses, PCB design guidelines are also proposed to minimize the effects on EMI measurements.

• The Journal of Information Technology
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• v.3 no.4
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• pp.13-21
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• 2000

The thesis is for the analysis of the current trend adapted for the method of the test information exchange in the environment of the internal circuit in case of PCB design, The design process is most powerful for improving test characteristics among the entire process of PCB. The PCB is more and more difficult to test as the processes proceed because the nodes become more and more complicated. The data exchange for improving PCB test performance should be easy in order to provide more reliable products in the shorter period. The design technology oriented for the test makes the PCB and its components tested reliably and quickly so that it can effectively improve the quality of the PCB and largely reduce the time and cost of the test development, In addition it can make the substantial standardization In improve the speed of the repeated test and treatment so that the Period of development can be shorter. Also, it helps to effectively detect the potential defects of the products, so that highly reliable PCB can be produced.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.6
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• pp.39-44
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• 2011

This purpose of this study is to propose the characteristics analysis of the PCB pattern designed two modes for the output voltage value on the PMIC through converting the limited voltage value inputted from a battery. The PCB design technology has been undergoing difficulty in getting the related technology in a domestic market because of increasing EMI/EMC, Cross-talk, Impedance. And it requires to have the appropriate clearance between the patterns and the technology of PCB pattern width with a amperage according to various uses. The study carried out the characteristics analysis of the PCB pattern designed from a direct output method without a capacitor[mode1], to an output method through a capacitor[mode2] for PMIC output voltage value. Besides, we calculated the pattern width with a amperage using the equation suggested by IPC-2221, presenting the right way of the layout design to analyze the trouble with the test. Therefore, this study is expected to contribute not only to applying the PMIC design for the mobile panel power supply, but also helping the design and application technology in various areas such as car control, camera, note-book, computer, PDA, etc.