• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.65-70
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• 2021

In this study, interfacial properties and mechanical properties of joints were reported after Cu pads finished with organic solderability preservative (OSP) on flame retardant-4 (FR-4) printed circuit board (PCB) and electronic components were joined with a Sn-57Bi-1Ag solder paste by using a laser bonding process. The laser bonding process was performed under various bonding conditions with changing a laser power and a bonding time and effects of bonding conditions on interfacial and mechanical properties of joints were analyzed. In order to apply for industry, properties of bonding joints using a reflow bonding process which are widely used were compared. When the laser bonding process were performed, we observed that Cu₆Sn₅ intermetallic compounds (IMCs) were fully formed at the interface although the bonding times were very short about 2 and 3 s. Furthermore, void formations of the joints by using the laser bonding process were suppressed at the joints with comparing to the reflow bonding process and shear strengths of bonding joints were higher than that by using the reflow bonding process. Therefore, in spite of a very short bonding time, it is expected that joints will be stably formed and have a high mechanical strength by using the laser bonding process.

• Resources Recycling
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• v.25 no.2
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• pp.42-48
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• 2016

Although the generation of waste flat panel displays in Korea is expected to exceed one million sets in 2016, a comprehensive recycling technology has not yet been developed for effective recovery of valuable materials from the wastes, rendering to outshine the national prestige as a global leader in display industries. The overall aim of this study was to analyze the statistical data of various valuable materials and their ratio after dismantling 40-inch and 42-inch sized waste LCDs. The analysis results showed that plastic portion of the wastes was about 22% and the portion of PCB (Print Circuit Board) part was about 9% by weight whereas panel part was about 34% and leftovers including metals totalled about 35% by weight. Based on the analytical results, a higher value recycling process could be proposed with advanced material separation techniques.

• Journal of Korea Foundry Society
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• v.41 no.6
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• pp.550-557
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• 2021

With the advent of the fourth industrial revolution, the interest in the internet of things (IoT) in manufacturing is growing, even at foundries. There are several types of process data that can be automatically collected at a foundry, but considerable amounts of process data are still managed based on handwriting for reasons such as the limited functions of outdated production facilities and process design based on operator know-how. In particular, despite recognizing the importance of converting process data into big data, many companies have difficulty adopting these steps willingly due to the burden of system construction costs. In this study, the field applicability of IoT-based devices was examined by manufacturing devices and applying them directly to the site of a centrifugal foundry. For the centrifugal casting process, the temperature and humidity of the working site, the molten metal temperature, and mold rotation speed were selected as process parameters to be collected. The sensors were selected in consideration of the detailed product specifications and cost required for each process parameter, and the circuit was configured using a NodeMCU board capable of wireless communication for IoT-based devices. After designing the circuit, PCB boards were prepared for each parameter, and each device was installed on site considering the working environment. After the on-site installation process, it was confirmed that the level of satisfaction with the safety of the workers and the efficiency of process management increased. Also, it is expected that it will be possible to link process data and quality data in the future, if process parameters are continuously collected. The IoT-based device designed in this study has adequate reliability at a low cast, meaning that the application of this technique can be considered as a cornerstone of data collecting at foundries.

• Journal of Institute of Convergence Technology
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• v.1 no.1
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• pp.34-40
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• 2011

In this paper, a hybrid design tool combining one-dimensional(1D) lumped model and three-dimensional computational fluid dynamics(CFD) approach has been developed in order to evaluate the performance of inkjet print head and droplet control process are studied to reduce the deviations between nozzles which affect the size of the printed line for the industrial application of direct writing on printed circuit boards(PCB). 1D lumped model analysis shows that it is useful tool for evaluating performance of an inkjet head by varying the design parameters. The differences in ejected volume and droplet velocity between analytical and experimental result are within 12%. Time sequence of droplet generation is verified by the comparison between 3D analysis result and photographic images acquired by stroboscopic technique. In addition, by applying DPN process, velocity and volume uniformity between nozzles is dramatically improved that the tolerance achieved by the piezoelectric inkjet printhead across the 64 nozzles is 5 to 8%. A printed line pattern is successfully obtained using the fabricated inkjet print head and droplet calibration system.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.121-126
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• 2017

EES System support to maximize equipment efficiency by providing real-time information of main equipment which has a significant effect on product quality and productivity, and to prevent equipment failure by detecting equipment abnormality in advance. Smart Equipment Engineering System(S-EES) integrates the activities performed at equipment that are the core of production activities and manages them by system so as to maximize the efficiency of equipment and raise the quality level of products to one level. In other words, when the product is put into the equipment, the recipe is downloaded through the RMS, the recipe is set to the optimal condition through R2R(process control), and the system detects and controls the abnormality of the equipment during operation through the FDC function in real time it means. In this way, we are working with the suitable recipe that matches the lot of product, detecting the abnormality of the equipment during operation, preventing the product from being defective, and establishing a system to maximize the efficiency through real-time equipment management. In this study, we review the present status and problems of equipment management in actual production lines, collect the requirements of the manufacturing line for the PCB line, design and develop the system, The measurement model was studied.

• Resources Recycling
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• v.19 no.5
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• pp.44-49
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• 2010

SiC powders have been recovered from silicon-containing waste slurry by carbothermal reduction method with carbon black. Large amount of silicon-containing waste slurry is generated from Solar Cell industry. In an environmental and economic point of view, retrieve of the valuable natural resource from the silicon waste is important. In this study, SiC powder recovered by the reaction ball-milled silicon powder from waste and carbon black at $1350^{\circ}C$ for 3h under vacuum condition. Physical properties of samples have been characterized using SEM, XRD, Particle size analyzer and FT-IR spectroscopy.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.42-48
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• 2023

Recently, there has been an increasing demand for performance improvement and miniaturization in response to the growing variety of signals and power demands in many industries such as mobile, IoT, and automotive. As a result, there is a high demand for high-performance chips and advanced packaging technologies that can package such chips. In this context, the FOWLP process technology is a suitable technology, and this paper discusses the plasma application technologies that are being used and studied to improve the shortcomings of this process. The paper is divided into four parts, with an introduction and case studies for each of the plasma application technologies used in each part.

• Journal of the Korean Academic Society of Industrial Cluster
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• v.1 no.1
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• pp.16-28
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• 2007

This paper analyzes the effects of networking and competition on individual companies' R&D investment, focusing on pharmaceuticals, PCB (Printed Circuit Board), and auto parts sectors. Data were obtained through a survey on firms operating in Seoul, Incheon, and Gyung-gi metropolitan area. The estimation results suggest the networking with other actors in the clusters tends to increase R&D investments of individual firm's. But competition in a cluster tend to reduce individual firm's R&D investment. These results suggest the public policy promoting networking in a cluster could induce private firms' R&D investments and, therefore, should be maintained.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.105-105
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• 2006

IT 산업 및 반도체 산업이 발전함에 따라 초소형, 고집적화 시스템의 요구에 대응하기 위해서 고해상도 및 고정밀의 패턴 구현에 관한 많은 연구가 진행되고 있다. 이러한 연구는 각종 산업제품의 PCB(Printed Circuit Board) 및 디스플레이 장치인 PDP(Plasma Display Panel), LCD(Liquid Crystal Display) 등에 적용되어 널리 응용되고 있다. 현재 널리 사용되는 인쇄 회로 기판은 마스킹 후 선택적 에칭 방식을 적용하여 금속 배선을 형성하는 방식을 적용하고 있다. 이러한 방식은 설계가 변경될 경우 마스크를 다시 제작해야 하는 번거로움이 있어 설계 변경이 용이하지 않고 더욱 길어진 생산시간의 증가로 인하여 생산성 및 집적도가 떨어지게 된다. 따라서 최근에는 이러한 한계를 극복하기 위한 방안이 여러 가지 측면에서 시도되고 있으며, 그 중에서도 Inkjet Printing 기술에 대한 관심이 증가하고 있다. 본 연구에서는 Inkjet Printing 방식을 적용하여 금속 배선을 형성하고 선폭과 두께의 오차를 줄여 배선의 Tolerance 를 개선할 수 있는 방안을 제안하였다. Inkjet Printing 방식을 이용한 기존의 금속 배선 형성은 고해상도의 DPI(Dot Per Inch)에서 잉크 액적이 뭉치는 Bulge 현상이 발생되어 원하는 형상 및 배선의 폭을 구현하는데 어려움이 있었다. Bulge 현상은 배선의 불균일성을 야기할 뿐만 아니라 근접한 배선의 간섭에도 영향을 미처 금속 배선의 기능을 할 수 없는 단점을 발생시킨다. 따라서 본 연구에서는 이러한 Bulge 현상을 줄이고 배선간의 간섭을 방지하여 원하는 배선을 용이하게 형성할 수 있는 순차적 인쇄 방식을 적용하였다. 본 연구에서는 노즐직경 35um 의 Inkjet Head 와 나노 Ag 입자 잉크를 사용하여 Glass 표면 위에 배선을 형성하고 배선의 폭과 두께를 측정하였다. 또한 순차적 인쇄 방식을 적용하여 700DPI 이상의 고해상도에서 나타날 수 있는 Bulge 현상이 감소하였음을 관찰하였으며 금속 배선의 Tolerance를 10%내외로 유지할 수 있음을 확인하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.413-413
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• 2008

최근 잉크젯, 스크린, 그라비아 등 기존의 인쇄 방식과 인쇄 기술을 이용하여 저가의 전자회로 혹은 전자 소자를 제조하고자 프린팅 소재 및 공정 개발에 대한 산업계의 관심이 증가하고 있다. 특히 PCB, RFID, 디스플레이, 태양전지 분야의 전극재료의 개발에 많은 연구가 진행 중에 있으며, 다양한 인쇄 방법 중 미세회로의 구현이 가능한 잉크젯 프린팅을 통한 전극 형성방법에 주목하고 있다. 본 연구는 잉크젯 프린팅 방식을 통해 배선을 형성하고자 이에 적합한 다양한 농도의 잉크를 배합하여 평가하였으며, 첨가제 및 소결, 건조 조건의 변화를 통해 기재와의 부착력, 배선의 크랙을 조절하였다.