• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.281-281
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• 2015

PCB(printed circuit board) 제조 공정이 복잡해지고 부품의 고집적화로 Chip, ICD 등 부품 및 가공 크기가 작아져 Open Fail, short 등 다양한 불량이 나타난다. 본 연구에서는 이러한 불량의 원인을 규명하고 해결하기 위하여, 전자현미경을 이용하여 불량 PCB 분석을 진행 하였다.

• Proceedings of the Korea Society for Simulation Conference
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• 1999.04a
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• pp.122-126
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• 1999

시스템 레벨 PCB(Printed Circuit Board) 디자인은 최종적인 시스템 특성에 정확한 정보를 갖지 못하는 디자인 결정을 하기 위해 여러 가지 정보가 필요하다. 또한 분할 할 때 분할 시간과 방법은 매우 중요하고 합성 결과의 특성은 교환(tradeoffs)과 디자인 결정에 매우 민감하다. 그러므로 만일 디자인이 합성되고 단일 보드로 디자인된다 할지라도 후에 다중 보드로 분할 될 수 있다. 따라서 본 논문에서는 PCB회로 디자인의 제약구동 방법중 off-critical-path 분할기법을 사용한 휴리스틱(heuristic) 방법을 제안했고 교환 그래프 착색 알고리즘을 제안했다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.288-289
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• 2012

이동통신, 전자부품의 고속송신에 따라 핵심으로 사용되는 인쇄회로기판(PCB, Printed Circuit Board)의 신뢰성을 향상시키기 위한 주석도금기술과 품질 향상이 요구되고 있다. 오랜 역사를 갖고 있는 습식전자부품 주석도금기술은 과거의 현장에서 기본원리, 도금액분석 등을 이수하는 정도였다. 최근 도금뿌리산업육성과 함께 PCB주석도금 신기술정보를 입수하여 현장품질기술지원이 필요하다. 이에 수시로 업그레이드되고 변화하고 있는 해외신기술동향과 특허정보를 지원하였다.

• Journal of the Korean Institute of Navigation
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• v.23 no.2
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• pp.61-66
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• 1999

It is being more and more difficult to suppress emissions from electronic products using PCB(Printed Circuit Board) to the limit. Therefore, the exact evaluation of the emission from PCB has been more important to reduce the required time and the cost at the design phase of the products, especially on board ship's equipments. This research has evaluated the emission radiated from PCB based on the theoretical approach of SDA(Spectral Domain Analysis), which is available to analyze microwave stripline, coplanar line, patch antenna, etc. According to the theoretical results, it has been clearly shown that the emission radiated from PCB is reduced as the thickness of PCB is thinner, the permittivity of PCB is higher, the length of stripline is shorter, and the frequency is lower.

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.735-738
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• 2003

The PTFE composites for the microwave printed circuit board were prepared using woven glass fiber. The dielectric constant of the PTFE composites with oven glass fiber tended to decrease with an increase of immersion time, and was saturated at 3 times immersion. It resulted from the fact that fine powders of PTFE filled up at the pore and bend of woven glass fiber sufficiently. As the immersion time increased, the propagation velocity increased due to the reduction of dielectric constant.

• The Journal of the Korea institute of electronic communication sciences
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• v.11 no.5
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• pp.465-472
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• 2016

This study materialized an FPGA-based system to extract PCB patterns. The Printed Circuit Boards that are produced these days are becoming more detailed and complex. Therefore, the importance of a vision system to extract defects of detailed patterns is increasing. This study produced an FPGA-based system that has high speed handling for vision automation of the PCB production process. A vision library that is used to extract defect patterns was also materialized in IPs to optimize the system. The IPs materialized are Camera Link IP, pattern matching IP, VGA IP, edge extraction IP, and memory IP.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.7
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• pp.753-759
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• 2014

This paper introduces the reduction design technique of the resonance phenomenon of the inner PCB based on power integrity from the analysis about the inner power supply line generating RLC resonance. With the technique, the resonant frequency resulted from the structural characteristics of the PCB can be analyzed and allows to predict and the capacitor for resonance phenomenon reduction can be decided as a decoupling capacitor. From the simulation result, it was confirmed that the PCB's resonance phenomenon reduction design technique should have the reduction effect in the inner motherboard of the industrial controller. This research will be contributed to the improvement of the safety of a PDN (Power Delivery Network) structure in the layout design technique of the PCB.

• Korean Journal of Materials Research
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• v.13 no.4
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• pp.239-245
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• 2003

In order to explore the possibility to extract precious metals from PCB(Printed Circuit Board) scrap by gravity separation, a high temperature melting process was adopted, from the recycling view point, to investigate the influence of viscosity on A1$_2$$O_3$-CaO$-SiO_2$ slag system composed of PCB scrap. For optimizing the pre-treatment process of PCB scrap, an experimental condition for the complete calcination and oxidation of organic materials in PCB scrap was established and a quantitative analysis of oxidized PCB scrap was also carrie out. It was found that 6 hours were enough for the complete oxidation of PCB scrap at 1273 K in an atmosphere condition. A slag, l5wt%$A1_2$$O_3$-45wt%CaO-40wt%SiO$_2$, was chosen as a basic slag composition which is determined based on the quantitative analysis of PCB scrap. Viscosities were measured in slag systems both made from pure fluxes and from PCB scrap with additional fluxes. Slag viscosities composed of pure fluxes were measured to be 5.29 poise and 30.52 poise at temperatures of 1773 and 1573 K, whereas that of PCB scrap with additional fluxes were 3.37 poise and 69.89 poise, respectively.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.6
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• pp.664-670
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• 2018

In modern society, CCTV, which is the eye of surveillance, is being used to collect image data in various ways in daily life. CCTV is used not only for security, surveillance, and crime prevention but also in many fields such as automobile and black box. In this paper, we have developed a STM32F407 ARM chip based camera system for various applications. In order to develop camera system, modeling of camera system based on 3D structure was carried out in SolidWorks environment. The PCB board design was developed to extract the PCB parts from the camera system modeling files into iges files, convert them from the Altium Designer tool into 3D and 2D boards, After designing the camera system circuit and PCB, we have been studying the implementation of the stable system by using TRM (Thermal Risk Management) tool to cope with the heat simulation generated on the board.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.1195-1196
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• 2008

It is difficult to solve PCB(Printed Circuit Board) Noise problem. Because Electronic circuit system operates very high frequency. Resonance analysis of PCB layout by PI(Power Integrity) Simulation method visualizes distribution of Switching noise between VDD and GND. By using de-cap, we reduce impedance and solve the EMI problems.