• Journal of Bio-Environment Control
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• v.9 no.4
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• pp.201-206
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• 2000

A certain system to overcome high temperature should be introduced for the stable year-round cultivation in greenhouses. There are efficient methods to overcome high temperature such as ventilation system with shading screen, fan and pad system with screen, and fog system with screen. This study was carried out to find a means to determine the capacity of such system. Heat balance equations for each system were established and verified by experimental results. The calculated ventilation rates from heat balance equations showed a good agreement with the measured ones. The evapotranspiration coefficient was the most important parameter affecting the ventilation requirement among input parameter affecting the ventilation requirement among input parameters except weather data. When the evaportanspiration coefficient increased 1%, the ventilation requirement decreased 1.3%. Therefore the data of evapotranspiration coefficient should be accumulated by various experiments, and then design standards and selection guidelines should be provided. The simulation results for same design conditions shown that air exchanges requirement and evaporating water of fan and pad system were 5.1∼7.7% and 6.8∼9.3% larger than those of fog system, respectively.

• Korean Journal of Materials Research
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• v.10 no.12
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• pp.853-863
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• 2000

In this study, a new UBM materials system for solder flip chip interconnection of Cu pads were investigated using electroless copper (E-Cu) and electroless nickel (E-Ni) plating method. The interfacial reaction between several UBM structures and Sn-36Pb-2Ag solder and its effect on solder bump joint mechanical reliability were investigated to optimife the UBM materials design for solder bump on Cu pads. Fer the E-Cu UBM, continuous coarse scallop-like $Cu_{6}$ $Sn_{5}$ , intermetallic compound (IMC) was formed at the solder/E-Cu interface, and bump fracture occurred this interface under relative small load. In contrast, Fer the E-Ni/E-Cu UBM, it was observed that E-Ni effectively limited the growth of IMC at the interface, and the Polygonal $Ni_3$$Sn_4$ IMC was formed because of crystallographic mismatch between monoclinic $Ni_3$$Sn_4$ and amorphous E-Ni phase. Consequently, relatively higher bump adhesion strength was observed at E-Ni/E-Cu UBM than E-Cu UBM. As a result, it was fecund that E-Ni/E-Cu UBM material system was a better choice for solder flip chip interconnection on CU PadS.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.1
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• pp.13-22
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• 2001

This paper presents three dimensional structure of RF packages and the improvement effect of its electrical characteristics when implementing RF transceivers. We divided RF modules into several subunits following each subunit function based on the partitioning algorithm which suggests a method of three dimension stacking interconnection, PAA(pad area array) interconnection and stacking of three dimensional RF package structures. 224MHz ITS(Intelligent Transportation System) RF module subdivided into subunits of functional blocks of a receiver(RX), a transmitter(TX), a phase locked loop(PLL) and power(PWR) unit, simultaneously meeting the requirements of impedance characteristic and system stability. Each sub­functional unit has its own frequency region of 224MHz, 21.4MHz, and 450KHz~DC. The signal gain of receiver and transmitter unit showed 18.9㏈, 23.9㏈. PLL and PWR modules also provided stable phase locking, constant voltages which agree with design specifications and maximize their characteristics. The RF module of three dimension stacking structure showed $48cm^3$, 76.9％ reduction in volume and 4.8cm, 28.4％ in net length, 41.8$^{\circ}C$, 37% in maximum operating temperature, respectively. We have found that three dimensional PAA package structure is able to produce high speed, high density, low power characteristics and to improve its functional characteristics by subdividing RF modules according to the subunit function and the operating frequency, and the features of physical volume, electrical characteristics, and thermal conditions compared to two dimensional RF circuit modules.

• Journal of Nutrition and Health
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• v.10 no.1
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• pp.1-9
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• 1977

The changes of the total body composition, internal organs, skeletal muscles, and epididymal fat pad in rats fed protein depletion diet and 4 different recovery diets were examined. Seventy-eight male Sprague-Dawley rats weighing $212{\pm}2$ gr were used, and the results were as follows : A) After the 2 weeks of protein depletion, body weight decreased about 20% from the initial weight. It was mainey due to the total body lipid reduction. Among various organ weights, liver and spleen reduced $35{\sim}58%$, kidney and heart reduced $18{\sim}30%$, and muscles reduced $2{\sim}13%$, while brain, epididymal fat pad were not changed significantly. In regarding protein and lipid contents of these tissues, protein in liver, lipid in muscle, and both in spleen were markedly reduced. B) With the 2 weeks of feeding recovery diets, the increases of body weight were different among 4 Groups. High-fat group gained at the highest level (67%), and high-CHO group the lowest (30%). Total body composition (%) cf the standard and high-protein groups recovered to the level of 0 day protein depletion, while protein in the high-fat group and water in the high-CHO group decreased, and fat in these 2 groups increased. Weights of organs and muscles of the high-protein and high-fat groups were similar to the standard group and tllose of the high-CHO group were lower than the standard group. Composition of organs and muscle in the high-protein group was similar to the standard group, while the N contents of the high-fat and high-CHO groups were lower an the lipid content of the high-fat group was higher than the standard group. The weight and lipid content of epididymal fat pad were the highest in the high-fat group.

• Proceedings of the KSR Conference
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• 2011.10a
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• pp.975-985
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• 2011

Cu-Matrix sintered brake pads and low alloyed heat resistance steel are most applied to basic brake system for high energy moving machine. In this research, we analyzed tribological characteristics for influence of air velocity between disk and pad. At low brake pressure with air flow, friction stability was decreased due to no formation of tribofilm at disk surface. But there are no significant change of friction coefficient at all test conditions. Wear rate of friction materials were decreased with increasing of air flow velocity. In result, air flow velocity influenced friction stability, wear rate of friction materials and disk but not friction coefficient.

• Transactions of the Korean Society of Automotive Engineers
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• v.22 no.5
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• pp.44-49
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• 2014

As expansion and contraction of bike disk brake are happened continuously by temperature at repeated urgent braking. In this study, 3 kinds of model are designed according to configurations of holes and thermal durabilities on bike disk brake are investigated by comparing 3 models through temperature and thermal analyses. Maximum thermal stress happened at the disk contacted with pad and the connection part fixing disk rotor. Instead of initial state, the temperature is uniformly distributed at transient state. As the area of hole at disk rotor face becomes wider, thermal stress becomes lower at the initial state. On the other hand, in case the number of holes increases, thermal stress becomes lower at the elapsed time of 100 seconds. The thermal durability of bike disk brake can be improved by applying this study result with configurations of holes.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.1
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• pp.85-90
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• 2003

Removal rate and Within Wafer Non-Uniformity (WIWNU), the most critical issues in Chemical Mechanical Polish (CMP) process, are related to the pressure distribution, wafer shape, slurry flow, mechanical property of pad and etc. Among them, wafer warp generated by other various manufacturing process of wafer may induce the deviation of pressure distribution on the backside of wafer. In the convex shaped wafer the pressure onto the backside of wafer is higher than that of perfectly flat shaped wafer. Besides, such an added pressure is in proportion to the curvature of wafer. That is, the bigger the curvature of wafer becomes the higher the removal rate goes. And the WIWNU is known to be directly related to the pressure distribution on the wafer as well. In other words, the deviation of pressure distribution is in proportion to the WIWNU. In this paper, it is found that the wafer shape may be modified through heating the backside of it and thus properly changed pressure onto the backside of it may improve the WIWNU.

• Journal of the Korean Society of Clothing and Textiles
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• v.24 no.1
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• pp.15-23
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• 2000

Effect of fixation methods on the flame retardant(FR) and performance properties of MDPPA/HMM treated cotton fabrics were studied. Combination of three different fixation methods - premercerization, swelling agent treatment, pad dry cure fixation, and wet fixation - were applied to flame retardant finish of cotton with MDPPA/HMM. As a result, an increase in internal volume of cotton fiber by pre-mercerization and addition of swelling agent, and wet fixation increased %add-on of FR agent improving FR efficiency and wash fastness. Tensile strength of MDPPA/HMM treated cotton fabrics by wet fixation and swelling agent were slightly decreased, but that of premercerized cotton was improved. Wet fixated fabric showed lower bending rigidity and better compressional properties which improved fabric hand. Retention of swelling ability of cotton treated with MDPPA/HMM improved moisture absorption properties.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.194-195
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• 2009

본 연구에서는 고속전단 강도에 표면 처리의 변화가 미치는 영향에 대해 연구하고자 하였다. 표면 처리를 ENIG, ENEPIG, OSP로 하여 고속전단시험을 수행하였다. 고속전단 결과 SAC105의 전단 강도 값은 ENIG가 가장 작았고, ENEPIG가 가장 높았다. SAC305의 전단 강도 값은 ENIG가 가장 작았고, OSP와 ENEPIG는 비슷한 값을 나타냈다.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 1992.11a
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• pp.13-18
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• 1992

대형 틸팅패드 저어널베어링은 고속안정성 특성이 우수한 베어링으로서 시스템의 안정성이 매우 중요시되는 터빈발전기 등 대형 고속 회전기계에 많이 사용되고 있다. 그런데 이들 대형 저어널베어링에서는 유막의 온도상승이 매우 많고, 유체의 흐름이 거의 난류영역에 이르기 때문에 베어링의 운전특성을 정확하게 예측하기가 어려운 실정이다. Hopf & Schuler는 대형 틸팅패드 저어널베어링에 대한 실험적 연구에서 유동상태에 따라 베어링의 온도분포가 서로 달라진다고 발표하였다. 대형 틸팅패드 저어널베어링은 구조적으로 유동상태가 복잡할 뿐만 아니라 계산과정도 까다로운 편이어서 온도상승과 난류를 고려하여 엄밀하게 운전특성을 예측한 연구는 거의 없다. 따라서 본 연구에서는 대형 틸팅패드 저어널베어리으이 운전특성을 보다 엄밀하게 예측하기 위하여 3차원 적으로 유막의 점도변화 및 패드에서의 열전달을 고려하고, 와점성계수를 이용한 난류윤활이론을 사용하여 유막의 온도상승 및 난류가 베어링의 온도분포, 부하능력, 마찰손실 등의 운전특성에 미치는 영햐을 보다 엄밀하게 제시하고자 한다.