• 제목/요약/키워드: Oxide polishing

검색결과 185건 처리시간 0.027초

Color stability of bulk-fill and incremental-fill resin-based composites polished with aluminum-oxide impregnated disks

  • Koc-Vural, Uzay;Baltacioglu, Ismail;Altinci, Pinar
    • Restorative Dentistry and Endodontics
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    • 제42권2호
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    • pp.118-124
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    • 2017
  • Objectives: This study aimed to evaluate the color stability of bulk-fill and nanohybrid resin-based composites polished with 3 different, multistep, aluminum-oxide impregnated finishing and polishing disks. Materials and Methods: Disk-shaped specimens (8 mm in diameter and 4 mm in thickness) were light-cured between two glass slabs using one nanohybid bulk-fill (Tetric EvoCeram, Ivoclar Vivadent), one micro-hybrid bulk-fill (Quixfil, Dentsply), and two nanohybrid incremental-fill (Filtek Ultimate, 3M ESPE; Herculite XRV Ultra, Kerr) resin-based composites, and aged by thermocycling (between $5-55^{\circ}C$, 3,000 cycles). Then, they were divided into subgroups according to the polishing procedure as SwissFlex ($Colt\grave{e}ne/Whaledent$), Optidisc (Kerr), and Praxis TDV (TDV Dental) (n = 12 per subgroup). One surface of each specimen was left unpolished. All specimens were immersed in coffee solution at $37^{\circ}C$. The color differences (${\Delta}E$) were measured after 1 and 7 days of storage using a colorimeter based on CIE Lab system. The data were analyzed by univariate ANOVA, Mann-Whitney U test, and Friedmann tests (${\alpha}=0.05$). Results: Univariate ANOVA detected significant interactions between polishing procedure and composite resin and polishing procedure and storage time (p < 0.05). Significant color changes were detected after 1 day storage in coffee solution (p < 0.05), except Quixfil/Optidisc which was color-stable after 7 days (p > 0.05). Polishing reduced the discoloration resistance of Tetric EvoCeram/SwissFlex, Tetric EvoCeram/Praxis TDV, Quixfil-SwissFlex, and all Herculite XRV Ultra groups after 7 days storage (p < 0.05). Conclusions: Discoloration resistance of bulk-fill resin-based composites can be significantly affected by the polishing procedures.

Dependence of Nanotopography Impact on Fumed Silica and Ceria Slurry Added with Surfactant for Shallow Trench Isolation Chemical Mechanical Polishing

  • Cho, Kyu-Chul;Jeon, Hyeong-Tag;Park, Jea-Gun
    • 한국재료학회지
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    • 제16권5호
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    • pp.308-311
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    • 2006
  • The purpose of this study is to investigate the difference of the wafer nanotopography impact on the oxide-film thickness variation between the STI CMP using ceria slurry and STI CMP using fumed silica slurry. The nanotopography impact on the oxide-film thickness variation after STI CMP using ceria slurry is 2.8 times higher than that after STI CMP using fumed silica slurry. It is attributed that the STI CMP using ceria slurry follows non-Prestonian polishing behavior while that using fumed silica slurry follows Prestonian polishing behavior.

STI CMP용 가공종점 검출기술에서 나노 세리아 슬러리 특성이 미치는 영향 (Effect of the Nano Ceria Slurry Characteristics on end Point Detection Technology for STI CMP)

  • 김성준;강현구;김민석;백운규;박재근
    • 반도체디스플레이기술학회지
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    • 제3권1호
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    • pp.15-20
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    • 2004
  • Through shallow trench isolation (STI) chemical mechanical polishing (CMP) tests, we investigated the dependence of pad surface temperature on the abrasive and additive concentrations in ceria slurry under varying pressure using blanket film wafers. The pad surface temperature after CMP increased with the abrasive concentration and decreased with the additive concentration in slurries for the constant down pressure. A possible mechanism is that the additive adsorbed on the film surfaces during polishing decreases the friction coefficient, hence the pad surface temperature gets lower with increasing the additive concentration. This difference in temperature was more remarkable for the higher concentration of abrasives. In addition, in-situ measurement of spindle motor was carried out during oxide and nitride polishing. The averaged motor current for oxide film was higher than that for nitride film, meaning the higher friction coefficient.

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나노 세리아 슬러리에 첨가된 연마입자와 첨가제의 농도가 CMP 연마판 온도에 미치는 영향

  • 김성준;강현구;김민석;박재근
    • 한국반도체및디스플레이장비학회:학술대회논문집
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    • 한국반도체및디스플레이장비학회 2003년도 추계학술대회 발표 논문집
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    • pp.122-125
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    • 2003
  • We investigated the effect of the abrasive and additive concentrations in Nano ceria slurry on the pad surface temperature under varying pressure through chemical mechanical polishing (CMP) test using blanket wafers. The pad surface temperature after CMP increased with the abrasive concentration and decreased with increase of the additive concentration in slurries for the constant down pressure. A possible mechanism is that the additive adsorbed on the film surface during polishing decreases the friction coefficient, hence the pad surface temperature gets lower with increase of the additive concentration. This difference of temperature was more remarkable for the higher concentration of abrasives. In addition, in-situ measurement of spindle motor was carried out during oxide and nitride polishing. The averaged motor current for oxide film was higher than that for nitride film, which means the higher friction coefficient.

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Sample Preparation for Microstructural Characterization of Ni-Yttria-Stabilized Zirconia Anodes

  • Sim, Soo-Man
    • 한국세라믹학회지
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    • 제55권4호
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    • pp.376-380
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    • 2018
  • Microstructural characterization of Ni-yttria-stabilized zirconia (YSZ) anodes using secondary electron images has been limited by a lack of contrast between Ni and YSZ phases. This paper reports a sample preparation method for obtaining secondary electron images that allow the detection of Ni, YSZ, and pore phases together. Ni-YSZ anode samples were obtained by reducing NiO-YSZ samples prepared by using the mixed oxide method. Colloidal silica polishing and electrolytic etching were performed on the Ni-YSZ samples. The morphological change of the sample surface after each polishing process is examined.

세륨연마재 폐슬러리 건조분말로부터 희토류와 알루미늄의 분리 (Separation of Rare Earth and Aluminium from the Dried Powder of Waste Cerium Polishing Slurry)

  • 윤호성;김철주;김성돈;이진영;조성욱;김준수
    • 자원리싸이클링
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    • 제12권5호
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    • pp.10-15
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    • 2003
  • 본 연구에서는 세륨연마재 폐슬러리 건조분말로부터 세륨을 포함한 희토류성분과 알루미늄을 분리하고자 하였다. 출발원료인 세륨연마재 폐슬러리 건조분말의 희토류 중에는 산화세륨이 전체 희토류 성분의 약 40% 정도 함유되어 있는데, 산화세륨은 희토류원소들 중에서 가장 안정된 형태로 이에 대한 분해가 용이하지 않다. 그러므로 황산화반응을 이용하여 산화세륨을 분해하므로써 희토류의 분리ㆍ회수율을 향상시키고자 하였으며, 침출용액으로부터 희토류와 알루미늄을 분리하기 위하여, 희토류 원소들은 황산매질에서 황산나트륨과 반응하여 황산나트륨희토류(ReㆍNa($SO_4$)$_2$)를 형성하면서 침전되는 특성을 이용하였으며 쉽게 희토류와 알루미늄을 분리할 수 있었다.

실리콘 웨이퍼위에 증착된 실리케이트 산화막의 CMP 슬러리 오염 특성 (CMP Slurry Induction Properties of Silicate Oxides Deposited on Silicon Wafer)

  • 김상용;서용진;이우선;장의구
    • 한국전기전자재료학회논문지
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    • 제13권2호
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    • pp.131-136
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    • 2000
  • We have investigated the slurry induced metallic contaminations of undoped and doped silicate oxides surface on CMP cleaning process. The metallic contaminations by CMP slurry were evaluated in four different oxide films, such as plasma enhanced tetra-ethyl-orthyo-silicate glass(PE-TEOS), O3 boro-phos-pho-silicate glass(O3-BPSG), PE-BPSG, and phospho-silicate glass(PSG). All films were polished with KOH-based slurry prior to entering the post-CMP cleaner. The Total X-Ray fluorescence(TXRF) measurements showed that all oxide surfaces are heavily contaminated by potassium and calcium during polishing which is due to a CMP slurry. The polished O3-BPSG films presented higher potassium and calcium contaminations compared to PE-TEOS because of a mobile ions gettering ability of phosphorus. For PSG oxides, the slurry induced mobile ion contamination increased with an increase of phosphorus contents. In addition, the polishing removal rate of PSG oxides had a linear relationship as a function of phosphorus contents.

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산화망간이 첨가된 혼합 연마제 실리카 슬러리의 산화막 CMP 특성 (Chemical Mechanical Polishing Characteristics of Mixed Abrasive Silica Slurry (MAS) by adding of Manganese oxide (MnO2) Abrasive)

  • 서용진
    • 전기전자학회논문지
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    • 제23권4호
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    • pp.1175-1181
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    • 2019
  • 논문에서는 1:10으로 희석된 실리카 슬러리에 산화망간(MnO2) 연마제를 첨가하여 재처리된 혼합연마제 슬러리(Mixed Abrasive Slurry; MAS)의 화학기계적연마(CMP) 특성을 연구하였다. 최적의 연마 성능을 갖는 슬러리를 설계하기 위해서는 높은 연마율, 하부층에 대한 적절한 연마선택비, 연마 후의 낮은 표면결함, 슬러리의 안정성 등을 얻어야 한다. 산화망간이 첨가된 MAS의 연마 성능은 연마율 및 비균일도와 같은 CMP 성능, 입도 분석, 표면 형상에 대해 평가하였다. 실험결과, 높은 연마율과 낮은 비균일도 측면에서 볼 때 원액 실리카 슬러리와 대등한 슬러리 특성을 얻을 수 있었다. 따라서 본 연구에서 제안하는 MnO2-MAS를 사용하면 고가의 소모재인 슬러리를 절약하는데 매우 유용할 것이다.

재생된 옥사이드 CMP 슬러리의 물리적, 화학적 특징에 대한 연구 (Physical and Chemical Characterization of Recycled Oxide CMP Slurry)

  • 김명식;박진구;이관호
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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    • pp.235-239
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    • 2001
  • In recent years, as Chemical Mechanical Planarization(CMP) has been routinely utilized in integrated circuit(IC) fabrication, the consumption of slurry, main consumable in a CMP process, is greatly increased. Thus the reprocess of CMP slurries has been actively considered in the industry to reduce cost-of-consumable (COC). The main purpose of this study was to recycle the used oxide slurry using filters as a new method. As a result, Ultra Fine(UF) Filter could distinguish silica from the used oxide slurry and Reverse Osmosis(RO) Filter could distinguish Deionized(DI) Water and chemistry from chemistry solution. The tetraethylorthosilicate removal rate was almost the same as the number of recycle polishing was increased, when it was modified by slightly adding new SS-12 slurry. The microscratch didnt found as the number of recycle polishing was increased.

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새로운 연마제를 이용한 Oxide CMP 특성에 관한 연구 (A study on the Oxide CMP Characteristics using New Abrasive)

  • 한성민;한상준;박성우;이우선;서용진
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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    • pp.378-379
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    • 2006
  • CMP(chemical mechanical polishing) process has been attracted as an essential technology of multi-level interconnection. However, the COO(cost of ownership) is very high, because of high consumable cost. Especially, among the consumables, slurry dominates more than 40 %. So, we focused how to reduce the consumption of raw slurry. In this paper, $ZrO_2$, $CeO_2$, and $MnO_2$ abrasives were added de-ionized water (DIW) and pH control as a function of KOH contents. We have investigate the possibility of new abrasive for the oxide CMP application.

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