• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.134-134
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• 2011

High-k dielectric materials such as $HfO_2$, $ZrO_2$ and $Al_2O_3$ increase gate capacitance and reduce gate leakage current in MOSFET structures. This behavior suggests that high-k materials will be promise candidates to substitute as a tunnel barrier. Furthermore, stack structure of low-k and high-k tunnel barrier named variable oxide thickness (VARIOT) is more efficient.[1] In this study, we fabricated the $WSi_2$ nanocrystals nonvolatile memory device with $SiO_2/HfO_2/Al_2O_3$ tunnel layer. The $WSi_2$ nano-floating gate capacitors were fabricated on p-type Si (100) wafers. After wafer cleaning, the phosphorus in-situ doped poly-Si layer with a thickness of 100 nm was deposited on isolated active region to confine source and drain. Then, on the gate region defined by using reactive ion etching, the barrier engineered multi-stack tunnel layers of $SiO_2/HfO_2/Al_2O_3$ (2 nm/1 nm/3 nm) were deposited the gate region on Si substrate by using atomic layer deposition. To fabricate $WSi_2$ nanocrystals, the ultrathin $WSi_2$ film with a thickness of 3-4 nm was deposited on the multi-stack tunnel layer by using direct current magnetron sputtering system [2]. Subsequently, the first post annealing process was carried out at $900^{\circ}C$ for 1 min by using rapid thermal annealing system in nitrogen gas ambient. The 15-nm-thick $SiO_2$ control layer was deposited by using ultra-high vacuum magnetron sputtering. For $SiO_2$ layer density, the second post annealing process was carried out at $900^{\circ}C$ for 30 seconds by using rapid thermal annealing system in nitrogen gas ambient. The aluminum gate electrodes of 200-nm thickness were formed by thermal evaporation. The electrical properties of devices were measured by using a HP 4156A precision semiconductor parameter analyzer with HP 41501A pulse generator, an Agillent 81104A 80MHz pulse/pattern generator and an Agillent E5250A low leakage switch mainframe. We will discuss the electrical properties for application next generation non-volatile memory device.

• 센서학회지
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• 제6권6호
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• pp.476-482
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• 1997

주성분 분석 및 역전달 인공 신경망의 패턴 인식 기법과 산화물 반도체 가스센서 어레이를 사용한 소형 전자코 시스템을 제작하여 그 특성을 평가하였다. 센서 어레이로서 Pd가 첨가된 $WO_{3}$, Pt가 첨가된 $SnO_{2}$, $TiO_{2}-Sb_{2}O_{5}-Pd$가 첨가된 $SnO_{2}$, $TiO_{2}-Sb_{2}O_{5}-Pd$가 첨가된 후 Pd 코팅층이 형성된 $SnO_{2}$, $Al_{2}O_{3}$가 첨가된 ZnO 및 $PdCl_{2}$가 첨가된 $SnO_{2}$ 등의 6가지 조성의 감지재료가 사용되었다. 전자코 시스템 하드웨어는 CPU로서 16bit의 Intel 80c196kc, 시스템 동작 프로그램의 저장을 위한 EPROM, 인공 신경망의 최적화된 가중치의 다운로딩을 위한 EEPROM, 가스농도의 결과 표시를 위한 LCD 등으로 구성하였다. 시스템의 성능 평가를 위해 자동차에서 배출되는 환경오염 물질인 CO/HC 가스(CO 0%/HC 0 ppm 에서 CO 7.6%/HC 400 ppm 까지 범위의 26가지 CO/HC 혼합가스 패턴)에 대한 인식 실험 결과 우수한 특성을 얻을 수 있었다.

• 구강회복응용과학지
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• 제25권2호
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• pp.183-190
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• 2009

본 연구의 목적은 NaF와 $H_3PO_4$를 사용하여 양극산화과정을 통해 나노튜브 제작 조건을 찾는 것이다. 절삭된 직경 15 mm, 두께 1.5 mm의 티타늄 디스크를 양극에, 백금을 음극에 연결하고 전극간의 거리는 10 mm가 되도록 하였다. $H_3PO_4$와 NaF 용액을 전해질로 하여 양극산화를 시행하였는데 전압, 전해질 농도, 산화시간을 달리하여 티타늄 디스크에 나노튜브를 형성하였다. 양극산화 후 24시간 동안 증류수로 세척한 후 24시간 동안 $40^{\circ}C$ 오븐에서 건조하고 시편의 표면구조 형상을 관찰 분석하였다. 실험 결과 0.5 wt % NaF에서 전압과 시간이 증가함에 따라 pore 형태의 초기 나노튜브 형성되었다. 1.0 wt % NaF에서 20 V, 20 분과 25 분에서 나노튜브가 생성되었고, 30 V에서 튜브의 형태가 커지면서 터지는 양상을 보였다. 2.0 wt % NaF에서 전압과 시간에 상관없이 적절한 나노튜브형태가 형성되지 않았다. $1M\;H_3PO_4$, 1.0 wt % NaF 전해용액, 20 V, 20분 양극산화 조건에서 티타늄 디스크 상에 가장 잘 정렬된 형태의 나노튜브 구조가 형성되었다. 양호한 형태의 나노튜브 형성을 위해서는 전해질의 종류에 따라 적절한 농도, 전압, 시간의 형성조건이 필요할 것으로 사료된다.

• 한국재료학회지
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• 제23권3호
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• pp.155-160
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• 2013

ZnO thin films co-doped with Mg and Ga (MxGyZzO, x + y + z = 1, x = 0.05, y = 0.02 and z = 0.93) were prepared on glass substrates by RF magnetron sputtering with different sputtering powers ranging from 100W to 200W at a substrate temperature of $350^{\circ}C$. The effects of the sputtering power on the structural, morphological, electrical, and optical properties of MGZO thin films were investigated. The X-ray diffraction patterns showed that all the MGZO thin films were grown as a hexagonal wurtzite phase with the preferred orientation on the c-axis without secondary phases such as MgO, $Ga_2O_3$, or $ZnGa_2O_4$. The intensity of the diffraction peak from the (0002) plane of the MGZO thin films was enhanced as the sputtering power increased. The (0002) peak positions of the MGZO thin films was shifted toward, a high diffraction angle as the sputtering power increased. Cross-sectional field emission scanning electron microscopy images of the MGZO thin films showed that all of these films had a columnar structure and their thickness increased with an increase in the sputtering power. MGZO thin film deposited at the sputtering power of 200W showed the best electrical characteristics in terms of the carrier concentration ($4.71{\times}10^{20}cm^{-3}$), charge carrier mobility ($10.2cm^2V^{-1}s^{-1}$) and a minimum resistivity ($1.3{\times}10^{-3}{\Omega}cm$). A UV-visible spectroscopy assessment showed that the MGZO thin films had high transmittance of more than 80 % in the visible region and that the absorption edges of MGZO thin films were very sharp and shifted toward the higher wavelength side, from 270 nm to 340 nm, with an increase in the sputtering power. The band-gap energy of MGZO thin films was widened from 3.74 eV to 3.92 eV with the change in the sputtering power.

• 한국응용과학기술학회지
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• 제31권1호
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• pp.44-49
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• 2014

인지질(L-${\alpha}$-phosphatidylethanolamine, LAPE) 단분자층 LB막의 전기화학적 특성을 통하여 그 안정성을 순환전압전류법으로 조사하였다. LAPE 단분자층 LB막은 ITO glass에 LB법을 사용하여 제막하였다. 전기화학적특성은 0.5 N, 1.0 N, 1.5 N 및 2.0 N $KClO_4$ 용액에서 3 전극 시스템으로 순환전압전류법에 의해 측정하였다. 측정범위는 연속적으로 1650 mV로 산화시키고, 초기 전위인 -1350 mV로 환원시켰다. 주사속도는 각각 50, 100, 150, 200 및 250 mV/s로 설정하였다. 그 결과 LAPE LB막은 순환전압전류곡선으로부터 산화전류로 인한 비가역공정으로 나타났다. LAPE LB막은 전해질농도가 0.01 N, 0.05 N. 0.10 N, 0.15 N 과 0.20 N $KClO_4$ 용액에서 확산계수(D)는 각각 195, 15.9, 5.75, 1.38 및 $0.754cm^2s^{-1}{\times}10^{-9}$을 얻었다.

• 전기화학회지
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• 제1권1호
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• pp.45-51
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• 1998

Ni-MH 전지의 음극으로 쓰이는 수소저장합금(MH)의 한 종류인 $AB_2$계 합금은 수소저장량이 큰 장점이 있으나 초기활성화나 싸이클 수명 및 자기방전 특성이 나쁜 단점이 있다. 본 연구에서는 Zr-Ti-V-Mn-Ni계 합금에 비화학양론적으로 Cr을 소량 첨가했을 때와 La을 첨가하여 불화처리 했을 때의 초기활성화, 싸이클 수명 및 자기방전에 미치는 영향을 조사하였다 EPMA 및 SEM을 이용하여 합금의 표면을 분석하였으며 XRD 분석으로 결정구조를 관찰하였다. 또한 합금으로 전극을 제조하여 정전류 시험법, 임피던스법과 전위주사법 등에 의해 전극특성을 조사하였다. Cr이 첨가될수록 전극표면에 안정한 산화막이 형성되어 V등의 전해질로의 용해를 막아주어 충, 방전에 따른 수명특성 및 자기방전 특성을 향상시키지만 초기 전하이동 반응이 저해되어 초기활성화 특성이 악화되었다. La을 첨가 후 불화처리하면 표면에 반응성이 좋은 입자를 형성하여 전극의 초기 활성화가 크게 향상되었다.

• Imaging Science in Dentistry
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• 제48권2호
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• pp.97-101
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• 2018

Purpose: This study evaluated the radiopacity of contemporary luting cements using conventional and digital radiography. Materials and Methods: Disc specimens (N=24, n=6 per group, ø$7mm{\times}1mm$) were prepared using 4 resin-based luting cements (Duolink, Multilink N, Panavia F 2.0, and U-cem). The specimens were radiographed using films, a complementary metal oxide semiconductor (CMOS) sensor, and a photostimulable phosphor plate (PSP) with a 10-step aluminum step wedge (1 mm incremental steps) and a 1-mm-thick tooth cut. The settings were 70 kVp, 4 mA, and 30 cm, with an exposure time of 0.2 s for the films and 0.1 s for the CMOS sensor and PSP. The films were scanned using a scanner. The radiopacity of the luting cements and tooth was measured using a densitometer for the film and NIH ImageJ software for the images obtained from the CMOS sensor, PSP, and scanned films. The data were analyzed using the Kruskal-Wallis and Mann-Whitney U tests. Results: Multilink (3.44-4.33) showed the highest radiopacity, followed by U-cem (1.81-2.88), Panavia F 2.0 (1.51-2.69), and Duolink (1.48-2.59). The $R^2$ values of the optical density of the aluminum step wedge were 0.9923 for the films, 0.9989 for the PSP, 0.9986 for the scanned films, and 0.9266 for the CMOS sensor in the linear regression models. Conclusion: The radiopacities of the luting materials were greater than those of aluminum or dentin at the same thickness. PSP is recommended as a detector for radiopacity measurements because of its accuracy and convenience.

• Journal of Periodontal and Implant Science
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• 제30권1호
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• pp.187-203
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• 2000

The precipitation of calcium phosphate on implant surface has been known to accelerate osseointegration and to enhance osseous adaptation. The present study was performed to examine whether the precipitation of calcium phosphate on Ti-6Al-4V alloy could be affected by the immersion in NaOH solution and heat treatment. Ti-6Al-4V alloy plates of $15{\times}3.5{\times}1mm$ in dimension were polished sequentially from #240 to #2,000 emery paper and one surface of each specimen was additionally polished with $0.1{\mu}m$ alumina paste. Polished specimens were soaked in various concentrations of NaOH solution(0.1, 1.0, 3.0, 5.0, 7.0, 10.0 M) at $60^{\circ}C$ for 24 hours for alkali treatment, and 5.0 M NaOH treated specimens were heated for 1 hour at each temperature of 400, 500, 600, 700, $800^{\circ}C$. After the alkali and heat treatments, specimens were soaked in the Hank's solution with pH 7.4 at $36.5^{\circ}C$ for 30days.The surface ingredient change of Ti-6Al-4V alloy was evaluated by thin-film X-ray diffractometer(TF-XRD) and the surface microstructure was observed by scanning electron microscope(SEM), and the elements of surface were analyzed by X-ray photoelectron spectroscopy(XPS). The results were obtained as follows ; 1. The precipitation of calcium phosphate on Ti-6Al-4V alloy was accelerated by the immersion in NaOH solution and heat treatment. 2. In Alkali treatment for the precipitation of calcium phosphate on Ti-6Al-4V alloy, the optimal concentration of NaOH solution was 5.0 M. 3. In heat treatment after alkali treatment in 5.0 M NaOH solution, the crystal formation on alloy surface was enhanced by increasing temperature. In heat treated alloys at $600^{\circ}C$, latticed structure and prominences of calcium phosphate layer were most dense. On heat treated alloy surface at the higher temperature(${\geq}700^{\circ}C$), main crystal form was titanium oxide rather than apatite. The above results suggested that the precipitation of calcium phosphate on the surface of Ti-6Al-4V alloy could be induced by alkali treatment in 5.0 M-NaOH solution and by heat treatment at $600^{\circ}C$.

• 대한치과보철학회지
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• 제31권3호
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• pp.423-446
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• 1993

Titanium and its alloys are finding increasing use in medical devices and dental implants. The strong selling point of titanium is its resistance to the highly corrosive body fluids in which an implant must survive. This corrosion resistance is due to a tenacious passive oxide or film which exists on the metal's surface and renders it passive. Potentiodynamic polarization measurement is one of the most commonly used electro-chemical methods that have been applied to measure corrosion rates. And the potentiodynamic polarization test supplies detailed information such as open circuit, rupture, and passivation potential. Furthermore, it indicates the passive range and sensitivity to pitting corrosion. This study was designed to compare the corrosion resistance of the commonly used dental implant materials such as CP Ti, Ti-6A1-4V, Co-Cr-Mo alloy, and 316L stainless steel. And the effects of galvanic couples between titanium and the dental alloys were assessed for their useful-ness-as. materials for superstructure. The working electrode is the specimen , the reference electrode is a saturated calomel electrode (SCE), and the counter electrode is made of carbon. In $N_2-saturated$ 0.9% NaCl solutions, the potential scanning was performed starting from -800mV (SCE) and the scan rate was 1 mV/sec. At least three different polarization measurements were carried out for each material on separate specimen. The galvanic corrosion measurements were conducted in the zero-shunt ammeter with an implant supraconstruction surface ratio of 1:1. The contact current density was recorded over a 24-hour period. The results were as follows : 1. In potential-time curve, all specimens became increasingly more noble after immersion in the test solution and reached between -70mV and 50mV (SCE) respectively after 12 hours. 2. The Ti and Ti alloy in the saline solution were most resistant to corrosion. They showed the typical passive behavior which was exhibited over the entire experimental range. Therefore no breakdown potentials were observed. 3. Comparing the rupture potentials, Ti and Ti alloy had the high(:st value (because their break-down potentials were not observed in this study potential range ) followed by Co-Cr-Mo alloy and stainless steel (316L). So , the corrosion resistance of titanium was cecellent, Co-Cr-Mo alloy slightly inferior and stainless steel (316L) much less. 4. The contact current density sinks faster than any other galvanic couple in the case of Ti/gold alloy. 5. Ag-Pd alloy coupled with Ti yielded high current density in the early stage. Furthermore, Ti became anodic. 6. Ti/Ni-Cr alloy showed a relatively high galvanic current and a tendency to increase.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.456-456
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• 2010

CMOS 소자가 서브마이크론($0.1\;{\mu}m$) 이하로 스케일다운 되면서 단채널 효과(short channel effect), 게이트 산화막(gate oxide)의 누설전류(leakage current)의 증가와 높은 직렬저항(series resistance) 등의 문제가 발생한다. CMOS 소자의 구동전류(drive current)를 높이고, 단채널 효과를 줄이기 위한 가장 효율적인 방법은 소스 및 드레인의 얕은 접합(shallow junction) 형성과 직렬 저항을 줄이는 것이다. 플라즈마 도핑 방법은 플라즈마 밀도 컨트롤, 주입 바이어스 전압 조절 등을 통해 저 에너지 이온주입법보다 기판 손상 및 표면 결함의 생성을 억제하면서 고농도로 얕은 접합을 형성할 수 있다. 그리고 얕은 접합을 형성하기 위해 주입된 불순물의 활성화와 확산을 위해 후속 열처리 공정은 높은 온도에서 짧은 시간 열처리하여 불순물 물질의 활성화를 높여주면서 열처리로 인한 접합 깊이를 얕게 해야 한다. 그러나 접합의 깊이가 줄어듦에 따라서 소스 및 드레인의 표면 저항(sheet resistance)과 접촉저항(contact resistance)이 급격하게 증가하는 문제점이 있다. 이러한 표면저항과 접촉저항을 줄이기 위한 방안으로 실리사이드 박막(silicide thin film)을 형성하는 방법이 사용되고 있다. 본 논문에서는 (100) p-type 웨이퍼 He(90 %) 가스로 희석된 $PH_3$(10 %) 가스를 사용하여 플라즈마 도핑을 실시하였다. 10 mTorr의 압력에서 200 W RF 파워를 인가하여 플라즈마를 생성하였고 도핑은 바이어스 전압 -1 kV에서 60 초 동안 실시하였다. 얕은 접합을 형성하기 위한 불순물의 활성화는 ArF(193 nm) excimer laser를 통해 $460\;mJ/cm^2$의 에니지로 열처리를 실시하였다. 그리고 낮은 접촉비저항과 표면저항을 얻기 위해 metal sputter를 통해 TiN/Ti를 $800/400\;{\AA}$ 증착하고 metal RTP를 사용하여 실리사이드 형성 온도를 $650{\sim}800^{\circ}C$까지 60 초 동안 열처리를 실시하여 $TiSi_2$ 박막을 형성하였다. 그리고 $TiSi_2$의 두께를 측정하기 위해 TEM(Transmission Electron Microscopy)을 측정하였다. 화학적 결합상태를 분석하기 위해 XPS(X-ray photoelectronic)와 XRD(X-ray diffraction)를 측정하였다. 접촉비저항, 접촉저항과 표면저항을 분석하기 위해 TLM(Transfer Length Method) 패턴을 제작하여 I-V 특성을 측정하였다. TEM 측정결과 $TiSi_2$의 두께는 약 $580{\AA}$ 정도이고 morphology는 안정적이고 실리사이드 집괴 현상은 발견되지 않았다. XPS와 XRD 분석결과 실리사이드 형성 온도가 $700^{\circ}C$에서 C54 형태의 $TiSi_2$ 박막이 형성되었고 가장 낮은 접촉비저항과 접촉저항 값을 가진다.