• Title/Summary/Keyword: Oxide bonding

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Synthesis and Properties of CuNx Thin Film for Cu/Ceramics Bonding

  • Chwa, Sang-Ok;Kim, Keun-Soo;Kim, Kwang-Ho
    • The Korean Journal of Ceramics
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    • v.4 no.3
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    • pp.222-226
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    • 1998
  • $Cu_3N$ film deposited on silicon oxide substrate by r.f. reactive sputtering technique. Synthesis and properties of copper nitride film were investigated for its possible application to Cu metallization as adhesive interlayer between copper and $SiO_2. Cu_3N$ film was synthesized at the substrate temperature ranging from $100^{\circ}C$ to $200^{\circ}C$ and at nitrogen gas ratio above $X_{N2}=0.4. Cu_3N, CuN_x$, and FGM-structured $Cu/CuN_x$ films prepared in this work passed Scotch-tape test and showed improved adhesion property to silicon oxide substrate compared with Cu film. Electrical resistivity of copper nitride film had a dependency on its lattice constant and was ranged from 10-7 to 10-1 $\Omega$cm. Copper nitride film was, however, unstable when it was annealed at the temperature above $400^{\circ}C$.

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Condition and New Testing Method of Interfacial Oxide Films in Directly Bonded Silicon Wafer Pairs (직접 접합된 실리콘 기판쌍에 있어서 계면 산화막의 상태와 이의 새로운 평가 방법)

  • ;;;;D.B. Murfett;M.R.Haskard
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.32A no.3
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    • pp.134-142
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    • 1995
  • We discovered that each distinct shape of the roof-shaped peaks of (111) facets, which are generated on (110) cross-section of the directly bonded (100) silicon wafer pairs after KOH etching, can be mapped to one of three conditions of the interfacial oxide existing at the bonding interface as follows. That is, thick solid line can be mapped to stabilization, thin solid line to disintegration, and thin broken line to spheroidization. also we confirmed that most of the interfacial oxides of a well-aligned wafer pairs were disintegrated and spheroidized through high-temperature annealing process above 900$^{\circ}$C while the oxide was stabilized persistently when two wafers are bonded rotationally around their common axis perpendicular to the wafer planes.

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Enhancement of Thermomechanical Properties of Poly(D, L-lactic-co-glycolic acid) and Graphene Oxide Composite Films for Scaffolds

  • Yoon, Ok-Ja;Sohn, Il-Yung;Kim, Duck-Jin;Lee, Nae-Eung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.548-548
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    • 2012
  • Thermomechanical and surface chemical properties of composite films of poly(D, L-lactic-co-glycolic acid) (PLGA) were significantly improved by the addition of graphene oxide (GO) nanosheets as nanoscale fillers to the PLGA polymer matrix. Enhanced thermomechanical properties of the PLGA/GO (2 wt.%) composite film, including an increase in the crystallization temperature and reduction in the weight loss, were observed. The tensile modulus of a composite film with increased GO fraction was presumably enhanced due to strong chemical bonding between the GO nanosheets and PLGA matrix. Enhanced hydrophilicity of the composite film due to embedded GO nanosheets also improved the biocompatibility of the composite film. Improved thermomechanical properties and biocompatibility of the PLGA composite films embedded with GO nanosheets may be applicable to biomedical applications such as scaffolds.

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Thermomechanical Properties of Poly(D, L-actic-co-glycolic acid) and Graphene Oxide Nanocomposite for Scaffolds

  • Sohn, Il-Yung;Yoon, Ok-Ja;Kim, Duck-Jin;Lee, Nae-Eung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.478-478
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    • 2011
  • The thermomechanical and surface chemical properties of nanocomposite of poly( D, L-actic-co-glycolic acid) (PLGA) were improved significant due to concentration of graphene oxide (GO) nanosheets as nanoscale fillers to PLGA film. Thermomechanical properties of the PLGA/GO (2wt.-%.) nanocomposite were decreased crystallization and melting temperature, weight loss. The storage and loss moduli of the nanocomposite were enhanced by chemical bonding between the oxygenated functional groups of the GO nanosheets and the polymer chains in the PLGA matrix. Enhanced hydrophilicity of nanocomposite caused by embedded GO nanosheets also improved for good biocompatibility. Our findings indicate that thermomechanical properties and biocompatibility of nanocomposite embedded with GO nanosheets are attractive candidates for use in biomedical applications such as scaffolds.

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Etch characteristics of ITO(Indium Tin Oxide)using ${SF_6}/{O_2}$-gas ECR(Electron Cyclotron Resonance) plasmas (ECR을 이용한 ${SF_6}/{O_2}$ 가스 플라즈마에 의한 ITO의 식각 특성연구)

  • 권광호;강승열;김곤호;염근영
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.7
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    • pp.563-567
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    • 2000
  • We presented the etch results of indium-tin oxide thin films by using SF$_{6}$/O$_2$gas electron cyclotron resonance plasma and conducted X-ray phtoelectron spectroscopy and quadrupole mass spectrometer analyses for the etch characteristics. The etch rate of the films was greatly dependent on that of oxygen which was the major constituent element of the films. The oxygen was removed by the forms like $O_2$or SOF$_2$. We examined the ratio of atomic content of O and In and the change of this ratio was related to the removal rate of InF$_{x}$ and the S-metal bonding.ing.

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Experimental investigation of mechanical and microstructural properties of concrete containing modified nano-Graphene Oxide

  • Maryam Ashouri;Ehsanollah Zeighami;Alireza Azarioon;Seyyed Mohammad Mirhosseini;Sattar Ebrahimi Yonesi
    • Advances in nano research
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    • v.16 no.5
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    • pp.435-444
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    • 2024
  • Microscopic defects within the microstructure of hardened cement paste are the main source of weakness in concrete. As a solution, nano-graphene oxide (GO) can be employed to improve the cement paste microstructure. However, there is a number of disadvantages, e.g., fluidity reduction and non-uniform dispersion. The present study sought to modify GO by fabricating a copolymer (PSGO) in a novel process to exploit the advantages of nano-GO while minimizing its disadvantages. Using 0.03wt% copolymerled to 38.8% higher tensile strength, 29.3% higher compressive strength and 25% higher workability. The SEM images revealed that GO and modified GO enhanced concrete by secondary hydration and bonding with C-S-H, creating a firm, integrated, and foil-like structure, and reducing the crack size and depth.

Synthesis of Alumina-Grafted Manganese Oxide Particles Using Surfactants through Coprecipitation Method and Their Thermal Properties

  • Kwon, Boseong;Park, Jun-Hwan;Jang, Seong-Cheol;Oh, Seong-Geun
    • Bulletin of the Korean Chemical Society
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    • v.34 no.12
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    • pp.3559-3564
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    • 2013
  • Alumina particles were grafted onto the surface of manganese oxide particles via the coprecipitation process using surfactant and cosurfactant. The phase of Mn/Al salts (Phase I) and the phase of precipitation agent (Phase II) were prepared in aqueous surfactant solution, separately. Phase II was added into Phase I and the reaction was performed to form the precursors of composites through hydrogen bonding between $Mn(OH)_2$ and $Al(OH)_3$ prepared by the reaction of Mn/Al salts with the precipitation agent. The alumina-grafted manganese oxide particles were obtained as a final product after calcination. The concentrations of Al salt and surfactant were varied to investigate their effects on the formation and the crystallinity of composites. In addition, the crystal structure of products could be controlled by changing the calcination temperature. Through thermal analyses, it was found that the thermal stability of manganese oxide was improved by the introduction of alumina on its surface.

A Study on the Fluxless Bonding of Si-wafer/Solder/Glass Substrate (Si 웨이퍼/솔더/유리기판의 무플럭스 접합에 관한 연구)

  • ;;;N.N. Ekere
    • Journal of Welding and Joining
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    • v.19 no.3
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    • pp.305-310
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    • 2001
  • UBM-coated Si-wafer was fluxlessly soldered with glass substrate in $N_2$ atmosphere using plasma cleaning method. The bulk Sn-37wt.%Pb solder was rolled to the sheet of $100\mu\textrm{m}$ thickness in order to bond a solder disk by fluxless 1st reflow process. The oxide layer on the solder surface was analysed by AES(Auger Electron Spectroscopy). Through rolling, the oxide layer on the solder surface became thin, and it was possible to bond a solder disk on the Si-wafer with fluxless process in $N_2$ gas. The Si-wafer with a solder disk was plasma-cleaned in order to remove oxide layer formed during 1st reflow and soldered to glass by 2nd reflow process without flux in $N_2$ atmosphere. The thickness of oxide layer decreased with increasing plasma power and cleaning time. The optimum plasma cleaning condition for soldering was 500W 12min. The joint was sound and the thicknesses of intermetallic compounds were less than $1\mu\textrm{m}$.

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Effect of silica coating on bond strength between a gold alloy and metal bracket bonded with chemically cured resin

  • Ryu, Min-Ju;Gang, Sung-Nam;Lim, Sung-Hoon
    • The korean journal of orthodontics
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    • v.44 no.3
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    • pp.105-112
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    • 2014
  • Objective: The purpose of this study was to evaluate the effects of three different surface conditioning methods on the shear bond strength (SBS) of metal brackets bonded directly to gold alloy with chemically cured resin. Methods: Two hundred ten type III gold alloy specimens were randomly divided into six groups according to the combination of three different surface conditioning methods (aluminum oxide sandblasting only, application of a metal primer after aluminum oxide sandblasting, silica coating and silanation) and thermocycling (with thermocycling, without thermocycling). After performing surface conditioning of specimens in accordance with each experimental condition, metal brackets were bonded to all specimens using a chemically cured resin. The SBS was measured at the moment of bracket debonding, and the resin remnants on the specimen surface were evaluated using the adhesive remnant index. Results: Application of metal primer after aluminum oxide sandblasting yielded a higher bond strength than that with aluminum oxide sandblasting alone (p < 0.001), and silica coating and silanation yielded a higher bond strength than that with metal primer after aluminum oxide sandblasting (p < 0.001). There was no significant change in SBS after thermocycling in all groups. Conclusions: With silica coating and silanation, clinically satisfactory bond strength can be attained when metal brackets are directly bonded to gold alloys using a chemically cured resin.

Investigations on the Structural Properties of Vanadium Oxide Thin Films Prepared by RF Magnetron Sputtering (RF 마그네트론 스퍼터링으로 퇴적시킨 바나듐 산화막의 구조적 특성에 관한 고찰)

  • 최용남;박재홍;최복길;최창규;권광호
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.07a
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    • pp.456-459
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    • 2000
  • Thin films of vanadium oxide(V$O_x$) have been deposited by r.f. magnetron sputtering from $V_2$$O_5$ prget in gas mixture of argon and oxygen. Crystal structure, surface morphology, chemical composition and bonding properties of films in-situ annealed in $O_2$ ambient with various heat-treatment conditions are characterized through XRD, SEM, AES, RBS and FTIR measurements. The filrns annealed below 200 $^{\circ}C$are amorphous, and those annealed above 30$0^{\circ}C$ are polycrystalline. The growth of grains and the transition of vanadium oxide into the higher oxide have been obsenred with increasing the annealing temperature and time. The increase of O/V ratio with increasing the annealing temperature and time is attributed to the diffusion of oxygen and the partial filling of oxygen vacancies. It is observed that the oxygen atoms located on the V-0 plane of $V_2$$O_5$ layer participate more readily in the oxidation process.

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