• Proceedings of the Materials Research Society of Korea Conference
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• 1998.05a
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• pp.10-10
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• 1998

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.05a
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• pp.143-143
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• 2001

• Proceedings of the Optical Society of Korea Conference
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• 1999.08a
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• pp.228-229
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• 1999

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.11a
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• pp.117-117
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• 1998

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.45-49
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• 1999

A flammable gas sensor based on the $SnO_2$thin film deposited by the reactive ion assisted deposition was fabricated and ultra-thin Pd layer as catalyst was adsorbed at surface by ion beam sputtering. The initial oxidation states of Pd catalyst were controlled to investigate the role of Pd in the sensing process of inflammale gas sensor through annealing in air and vacuum respectively. The Pd catalyst existing in pure metallic state showed the sensitivity higher than that of PdO. The result might be closely related to the fact that PdO as a surface acceptor would receive electrons via Pd sub-channel from $SnO_2$, and thus which reduces the sensitivity and delay the response time.

• Proceedings of the Membrane Society of Korea Conference
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• 1996.06a
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• pp.121-147
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• 1996

Since 1980, the water quality of ultra-pure water has been rapidly improved, and presently ultra-pore water producing equipment for 64Mbit is in operation. Table 1 shows the degree of integration of DRM and required water quality exlmple. The requirements of the ultra-pure water for 64Mbit are resistivity: 18.2 MQ/cm or higher, number of particulates: 1 pc/ml or less (0.05 $\mu$m or larger). bacteria count: 0.1 pc/l or less. TOC (Total Organic Carbon, index of organic snbstance) : 1ppb or less, dissolved oxygen: 5ppb or less, silica: 0.5ppb or less, heavy metal ions: 5ppb or less. The effect of metals on the silicon wafer has been well known, and recently it has been reported that the existence of organic substance in ultra-pure water is closely related to the device defect, drawing attention. It is reported that if organic substance sticks to the natural oxidation film, the oxide film remaims on the organic substance attachment in the hydrofluoric acid treatment (removal of natural oxidation film). The organic substance forms film on the silicon wafer, and harmful elements such as metals and N.P.S., components contained in the organic substance and the bad effect due to the generatinn of silicon carbide cannot be forgotten. In order to remove various impurities in raw water, many technological develoments (membrane, ion exchange, TOC removal, piping material, microanalysis, etc.) have been made with ultra-pure water producing equipment and put to practical use. In this paper, technologies put to practical use in recent ultra-pure vater producing equimeut are introduced.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.268-268
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• 2012

Adsorption and desorption of toluene from bare and $TiO_2$-coated silica with a mean pore size of 15 nm was studied using breakthrough curves and temperature programmed desorption. Thicknesses of $TiO_2$ films prepared by atomic layer deposition on silica were < 2 nm, and ~ 5 nm, respectively. For toluene adsorption, both dry and humid conditions were used. $TiO_2$-thin film significantly improved toluene adsorption capacity of silica under dry condition, whereas desorption of toluene from the surface as a consequence of displacement by water vapor was more pronounced for $TiO_2$-coated samples with respect to the result of bare ones. In the TPD experiments, silica with a thinner $TiO_2$ film (thickness < 2 nm) showed the highest reactivity for toluene oxidation to $CO_2$ in the absence and presence of water. We show that the toluene adsorption and oxidation reactivity of silica can be controlled by varying thickness of $TiO_2$ thin films.

• Corrosion Science and Technology
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• v.20 no.3
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• pp.152-157
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• 2021

Stainless steel is a metal that does not generate rust. Due to its excellent workability, economic feasibility, and corrosion resistance, it is used in various industrial fields such as ships, piping, nuclear power, and machinery. However, stainless steel is vulnerable to corrosion in harsh environments. To solve this problem, its corrosion resistance could be improved by electrochemically forming an anodized film on its surface. In this study, 316L stainless steel was anodized at room temperature with ethylene glycol-based 0.1 M NH₄F and 0.1M H₂O electrolyte to adjust the thickness of the oxide film using different anodic oxidation voltages (30 V, 50 V, and 70 V) with time control. The anodic oxidation experiment was performed by increasing the time from 1 hour to 7 hours at 2-hour intervals. Corrosion resistance according to the thickness of the anodic oxide film was observed. Electrochemical corrosion behavior of oxide films was investigated through polarization experiments.

• Journal of the Korean institute of surface engineering
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• v.57 no.2
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• pp.86-91
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• 2024

In this study, we investigated the effect of Na₂SiO₃ concentration on the Plasma Electrolytic Oxidation(PEO) film formation of Al6061 alloy. The morphology of the PEO films were examined by Optical Microscope(OM) and Scanning Electron Microscope(SEM). PEO film thickness increases as the Na₂SiO₃ concentration increases. The elemental analysis of PEO films was conducted using Dispersive X-ray Spectrometer(EDS). The cross-sectional elemental analysis result shows that the Si concentration tends to increase as the concentration of Na₂SiO₃ increases. X-Ray Diffraction(XRD) analysis was performed to confirm the degree of phase change according to Na₂SiO₃ concentration. In addition, Vickers hardness was measured to confirm the mechanical strength of the PEO film. As the concentration of Na₂SiO₃ increases, the hardness value also tends to increase.

• Progress in Superconductivity
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• v.7 no.2
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• pp.130-134
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• 2006

Buffer layers such as $CeO_2\;and\;Yb_2O_3$ films for YBCO coated conductors were deposited on (100) $SrTiO_3$ single crystals and (100) textured Ni substrates by a metal organic chemical vapor deposition (MOCVD) system of the hot-wall type. The substrates were moved with the velocity of 40 cm/hr. Source flow rate, $Ar/O_2$ flow rate and deposition temperature were main processing variables. The degree of film epitaxy and surface morphology were investigated using XRD and SEM, respectively. On a STO substrate, the $CeO_2$ film was well grown epitaxially above the deposition temperature of $450^{\circ}C$. However, on a Ni substrate, the XRD showed NiO (111) and (200) peaks due to Ni oxidation as well as (111) and (200) film growth. For the films deposited with $O_2$ gas as oxygen source, it was found that the NiO film was formed at the interface between the buffer layer and the Ni substrate. The NiO layer interrupts the epitaxial growth of the buffer layer. It seems that the epitaxial growth of the buffer layer on Ni metal substrates using $O_2$ gas is difficult. We are considering a new method avoiding Ni oxidation with $H_2O$ vapor instead of $O_2$ gas.