• Journal of Welding and Joining
• /
• 제21권6호
• /
• pp.46-54
• /
• 2003

The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven which can be established by thermal buoyancy forces. Forced convection-infrared reflow soldering process with air injection is simulated using a 2-dimensional numerical model. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, blowing velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be used in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.

• Journal of Welding and Joining
• /
• 제15권6호
• /
• pp.105-115
• /
• 1997

A numerical study is performed to predict the thermal response of a detailed card assembly during infrared reflow soldering. The card assembly is exposed to discontinuous infrared panel heater temperature distributions and high radiative/convective heating and cooling rates at the inlet and exit of the oven. The convective, radiative and conduction heat transfer within the reflow oven as well as within the card assembly are simulated and the predictions illustrate the detailed thermal responses. The predictions show that mixed convection plays an important role with relatively high frequency effects attributed to buoyancy forces, however the thermal response of the card assembly is dominated by radiation. The predictions of the detailed card assembly thermal response can be used to select the oven operating conditions to ensure proper solder melting and minimization of thermally induced card assembly tresses and warpage.

• Composites Research
• /
• 제35권2호
• /
• pp.86-92
• /
• 2022

본 연구에서는 접착제를 구성하는 분자 결합 구조의 차이가 열가소성 복합재의 계면 특성에 미치는 영향을 판단하기 위해 진행되었다. 고온 오븐 접합 공정을 이용하여 carbonfiber/polyetherketoneketone(CF/PEKK) 열가소성 복합재료를 융합 접합, polyetheretherketone(PEEK), polyetherimide(PEI) 접착제 접합하였다. 그리고 lap 전단 강도 시험과 디지털 광학 현미경과 주사 전자 현미경을 이용한 파단면 분석, FTIR 분석을 수행하였다. 그 결과, 접착제 접합은 CF/PEKK와 접착제를 구성하는 주요 결합기인 에테르기, 케톤기, 이미드기의 결합이 증가한 인터페이즈를 형성하여 접착 강도를 강화시켰다. 그리고, 에테르기와 케톤기를 더 많이 함유한 PEEK를 사용하는 것이 더 강한 결합력을 갖는 인터페이즈를 형성하여, 복합재의 접착 강도를 향상시켰다.

• 한국산업보건학회지
• /
• 제5권2호
• /
• pp.172-183
• /
• 1995

The airborne concentrations of the welding fumes produced during $CO_2$ arcwelding process at shipbuilding, shiprepairing, container manufacturing and car accessary manufacturing industry were investigated. The effects how much reduced the welding fume were checked when the portable fan was used. The results were as follows; 1.The geometric mean of welding fume concentration in shipbuilding factory was $10.05mg/m^3$. This exposure concentration was higher than other 3 manufacturing industries at 95% confidence level. 2. The sampling filters for welding fume could be digested with acid within 1 hour by microwave oven. The recoveries for investigated metal elements were all over 95%. 3. The optimal wavelength could be selected for the simultaneous analysis of 8 metal elements by ICP(Inductively Coupled Plasma). 4. Noxious gases($O_1,NO_2$) produced during $CO_1$ gas arc welding process were detected that the concentration of ozone($O_1$) was less than 0.01 ppm and that of nitrogen dioxide($NO_2$) was 0.01-0.03 ppm. 5. The geometric mean of welding fume particle diameter was $1.26{\mu}m$ and geometric standard deviation was 1.51 for the counts when particle an analyzer(ELZONE) had been used. 6. When the portable fan had been used,the reduced percent of total welding fume for workers was about 47.8% when portable fan was applied to blow and 71.7% when to exhaust.

• Journal of Welding and Joining
• /
• 제30권5호
• /
• pp.64-69
• /
• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.