• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.526-530
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• 2004

We report the space charge and the surface potential of the interface between metal and CuPc according to isotropic property and different metal by measuring the microwave reflection coefficients $S_{11}$ of copper(II)-phthalocyanine(CuPc) thin films by using a near-field microwave microscope(NSMM) in order to understand. CuPc thin films were prepared on gold and aluminium substrates using a thermal evaporation method. Two kinds of CuPc thin films were prepared. One was deposited on preheated substrate at $150^{\circ}C$ and the other was annealed after deposition by using thermal evaporation methods. The microwave reflection coefficients $S_{11}$ of CuPc thin films were changed by the dependence on the heat treatment conditions. By comparing reflection coefficient $S_{11}$ we measured electrical conductivity of CuPc thin films and studied this results with respect to the surface potential and space charge of the interface between metal and CuPc thin films.

• Carbon letters
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• 제15권3호
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• pp.214-217
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• 2014

A filtration-taping method was demonstrated to fabricate carbon nanotube (CNT) emitters. This method shows many good features, including high mechanical adhesion, good electrical contact, low temperature, organic-free, low cost, large size, and suitability for various CNT materials and substrates. These good features promise an advanced field emission performance with a turn-on field of $0.88V/{\mu}m$ at a current density of $0.1{\mu}A/cm^2$, a threshold field of $1.98V/{\mu}m$ at a current density of $1mA/cm^2$, and a good stability of over 20 h. The filtration-taping technique is an effective way to realize low-cost, large-size, and high-performance CNT emitters.

• Transactions on Electrical and Electronic Materials
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• 제4권2호
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• pp.24-28
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• 2003

(Ba,Sr,Ca)TiO$_3$ powders, prepared by the sol-gel method, were mixed with organic binder and the BSCT thick films were fabricated by the screen printing techniques on alumina substrates. All the BSCT thick films, sintered at 1420$^{\circ}C$, showed the typical XRD patterns of a perovskite polycrystalline structure. The average grain sizes decreased with increasing amounts of ZrO$_2$, and the BSCT(40/40/20) thick films doped with 2wt% MnO$_2$ showed a value of 8$\mu\textrm{m}$. The thickness of thick films by four-cycle on printing/drying was approximately 951$\mu\textrm{m}$. The relative dielectric constant decreased with increasing Ca content and MnO$_2$ doping amount. The relative dielectric constant, dielectric loss and tunability of the BSCT(50/40/10) thick films doped with 2.0wt% ZrO$_2$ were 772, 0.184％ and 15.62%, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.165-166
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• 2008

$(Ba_{0.6},Sr_{0.3},Ca_{0.1})TiO_3$ powders, which were prepared by sol-gel method using a solution of Ba-acetate, Sr-acetate and Ca-acetate and Ti iso-propoxide, were mixed with organic vehicle and the BSCT thick films were fabricated by the screen-printing techniques on high purity alumina substrates. The structural and dielectirc properties were investigated for various $Pr_2O_3$ and $Y_2O_3$doping contents. As a result of thermal analysis of $(Ba_{0.6},Sr_{0.3},Ca_{0.1})TiO_3$ powders, the exothermic peak was observed at around $670^{\circ}C$ due to the formation of the polycrystalline perovskite phase. All BSCT thick films, sintered at $1420^{\circ}C$ for 2h, showed the typical XRD patterns of perovskite polycrystalline structure. The average grain size of the specimens decreased with amount of $Pr_2O_3$ and $Y_2O_3$ contents.

• 마이크로전자및패키징학회지
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• 제5권1호
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• pp.7-18
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• 1998

In the flip chip interconnection on organic substrates using eutectic Pb/Sn solder bumps highly reliable Under Bump Metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as 1$\mu$m Al/0.2$\mu$m Pd/1$\mu$m Cu, laid under eutectic Pb/Sn solder were investigated with regard to their interfacial reactions and adhesion proper-ties. The effects of numbers of solder reflow and aging time on the growth of intermetallic compounds (IMCs) and on the solder ball shear strength were investigated. Good ball shear strength was obtained with 1$\mu$m Al/0.2$\mu$m Ti/5$\mu$m Cu and 1$\mu$m Al/0.2$\mu$m ni/1$\mu$m Cu even after 4 solder reflows or 7 day aging at 15$0^{\circ}C$. In contrast 1$\mu$m Al/0.2$\mu$m Ti/1$\mu$m Cu and 1$\mu$mAl/0.2$\mu$m Pd/1$\mu$m 쳐 show poor ball shear strength. The decrease of the shear strength was mainly due to the direct contact between solder and nonwettable metal such as Ti and Al resulting in a delamination. In this case thin 1$\mu$m Cu and 0.2$\mu$m Pd diffusion barrier layer were completely consumed by Cu-Sn and pd-Sn reaction.

• 한국신뢰성학회지:신뢰성응용연구
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• 제17권1호
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• pp.72-77
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• 2017

Purpose: The electrochemical corrosion behavior of tin oxide film coated on PET substrates has been studied under varying concentrations of acrylic acid to investigate possible corrosion in contact with the acidic environment. Method: Potentiodynamic test was performed for a commercial ITO/PET film in 0.1, 0.3, and 0.5 M of acrylic acid. The surface morphology was analyzed by scanning electron microscope (SEM) and energy dispersive spectroscopy (EDS). Results: Potentiodynamic test results showed an increase in Icorr and decrease in Ecorr value with increasing concentration of acid. Microscopic evaluation suggested the presence of certain deep cracks on the surface of the film in addition with a severe acidic attack. Conclusion: Exposure of ITO to acrylic acid resulted in the stress corrosion cracking of ITO film due to the mechanical mismatch between brittle inorganic ITO fim and a compliant organic PET substrate leading to the subsequent failure of the film.

• 상하수도학회지
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• 제28권1호
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• pp.55-60
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• 2014

Food waste leachate (FWL) is a serious pollutant waste coming from the food waste recycling facilities in Korea. FWL has a high organic matter content and high COD to nitrogen (COD/N) ratio, which can disturb efficient methane production in the anaerobic digestion of FWL. In the present study a microalga, Clorella vulgaris (C.V), was used as co-substrate for the FWL anaerobic digestion in order to supply nutrients, decrease the COD/N ratio and increase its methane yield. Different co-digestion mixtures (COD/N ratios) were studied by using biochemical methane potential test and modified Gompertz equation for kinetic study. Mixed substrate of FWL and C. vulgaris in the co-digestion clearly showed more the biomethane yield than the sole substrates. The maximum methane production, 827.7 mL-$CH_4$/g-VS added, was obtained for COD/N ratio of 24/1, whereas the highest improvement of methane yield was found for COD/N ratio of 15/1.

• 한국결정성장학회지
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• 제10권3호
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• pp.205-210
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• 2000

초음파분무를 이용한 MOCVD법으로 강유전체 $PbTiO_3$박막을 Si(100) wafer와 ITO-coated glass위에 제조하였다 Si 기판 위에 증착된 박막으로부터, 출발원료의 농도비(Ti/Pb)가 1.2일 때, 단일 perovskite 상을 얻을 수 있었다. ITO-coated glass 위에 증착된 박막은 Si기판 위에 제조된 박막보다 박막의 성장속도가 더 빠르며, 기판온도를 $530^{\circ}C$부터 $570^{\circ}C$까지 증가시켰을 때, 결절성과 입자 크기의 증가에 의해 유전상수는 증가하였다. $570^{\circ}C$에서의 유전상수 및 유전손실 값은 각각 205, 0.016을 나타내었다. 기판온도가 $600^{\circ}C$ 이상인 경우, 유전상수가 감소되는 경향을 보였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2008년도 제39회 하계학술대회
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• pp.1291-1292
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• 2008

ITO is widely used as an anode material in OLED, because of its good transparency, low electrical resistivity, high work function, and efficient hole injection properties. The interface between the electrode and the organic layer in the OLED effects the charge injection process and may influence the electrical and the luminance properties. Surface treatment of ITO, such as an Aquaregia treatment has been shown to enhance the efficiency, and luminance characteristics of the OLED. In this study, we investigated the effect of Aquaregia treatment. The fundamental structures of the OLED were ITO/NPB/$Alq_3$/LiF/Al. The current density-voltage-luminance, efficiency, and lifetime characteristics were measured with untreated and Aquaregia-treated ITO substrates. The Aquaregia treatment was found to enhance the performance of OLED. For the Aquaregia treated device, the maximum luminance and efficiency were increased by about 2 times compared to the untreated device. The mechanism of the Aquaregia treatment is discussed based on AFM analyses.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.30-34
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• 2008

The transfer assembly (or transfer printing) technique is a promising method for fabricating multi-scale structures on various substrates including semiconductors and polymers, and has been applied to fabrication of flexible devices with superior performance to conventional organic flexible devices. The mechanical behaviors of the structures fabricated by the transfer assembly is a very important information for design and reliability evaluation purpose, but the measurement of the behaviors is difficult since their critical-dimensions are very tiny. In this study, Au films with nano-scale thickness were fabricated on a silicon substrate and their mechanical properties were measured using micro-tensile test. The Au films on the silicon substrate were then transferred to a PDMS substrate using the transfer assembly technique. Self-assembled monolayer (SAM) with a thiol group was used to enhance the transfer of Au films, and the mechanical behaviors were characterized using wrinkle-based test. The test results from micro-tensile and wrinkle-based test are compared to each other, and their implication to the transfer assembly technique is discussed.