• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.12
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• pp.1-7
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• 2010

In this paper, we suggested a sensing method of PoRAM with the multilevel cell When a specific voltage is applied between top and bottom electrodes of PoRAM unit cell, we can distinguish cell states by changing resistance values of the cell. Especially, we can use the PoRAM as the multilevel cell due to have four stable resistance values per cell. Therefore, we proposed an address decoding method, sense amplifier and control signal for sensing of a multilevel cell. The sense amplifier is designed based on a current comparator that compared a cell current the cell with a reference current, and have a low input impedance for a amplification of the current. The proposed circuit was designed in a $0.13{\mu}m$ CMOS technology, we verified to sense each data "00", "01", "10", "10" by four states of a cell current.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.15-19
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• 2009

A high efficient organic red light emitting device with structure of DNTPD/TAPC/$Bebq_2$ :[$(pq)_2Ir(acac)$, SFC-411]/SFC-137 was fabricated on the plastic substrate, which can be applied in the fields of flexible display and illumination. In the device structure, N,N'-diphenyl-N,N'-bis-[4-(phenyl-m-tolylamino)-phenyl]-biphenyl-4,4'-diamine[DNTPD] as a hole injection layer and 1,1-bis-(di-4-tolylaminophenyl) cyclohexane [TAPC] as a hole transport were used. Bis(10-hydroxybenzo[h]quinolinato) beryllium complex [$Bebq_2$] was used as a light emitting host material. The host material, $Bebq_2$ was doubly doped with volume ratio of 7% iridium(III)bis-(2-phenylquinoline)acetylacetonate[$(pq)_2$Ir(acac)] and 3% SFC-411[red phosphor dye coded by the proprietary company]. And then, SFC-137 was used as an electron transport layer. The luminous intensity and current efficiency of the fabricated device were $22,780\;cd/m^2$ at 9V and 17.3 cd/A under $10,000\;cd/m^2$, respectively. The maximum current efficiency of the device was 22.4cd/A under $580\;cd/m^2$.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.19.2-19.2
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• 2010

Printed electronics using printing process has broadened in all respects such as electrics (lighting, batteries, solar cells etc) as well as electronics (OLED, LCD, E-paper, transistor etc). Copper is considered to be a promising alternative to silver for printed electronics, due to very high conductivity at a low price. However, Copper is easily oxidized, and its oxide is non-conductive. This is the highest hurdle for making copper inks, since the heat and humidity that occurs during ink making and printing simply accelerates the oxidation process. A variety of chemical treatments including organic capping agents and metallic coating have been used to slow this oxidation. We have established synthetic conditions of copper nanoparticles (CuNPs) which are resistant to oxidation and average diameter of 20 to 50nm. Specific resistivity should be less than $4\;{\mu}{\Omega}{\cdot}cm$ when sintered at lower temperature than $250^{\circ}C$ to be able to apply to conductive patterns of FPCBs using ink-jet printing. Through this study, the parameters to control average diameter of CuNPs were found to be the introduction of additive agent, the feeding rate of reducing agent, and reaction temperature. The CuNPs with various average diameters (58, 40, 26, 20nm) could be synthesized by controlling these parameters. The dispersed solution of CuNPs with an average size of 20 nm was made with nonpolar solvent containing 3 wt% of binder, and then coated onto glass substrate. After sintering the coated substrates at $250^{\circ}C$ for 30 minutes in nitrogen atmosphere, metallic copper film resulted in a specific resistivity of $4.2\;{\mu}{\Omega}{\cdot}cm$.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.362-363
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• 2012

A new cross-linkable polymer, cross-linked d-PBAB, which has the triphenylamine as the hole transporting moiety and ethynyl group as the thermal cross-linker is firstly synthesized by the combination of anionic polymerization and deprotection process. The thermal cross-linking reaction was performed at $240^{\circ}C$ for 50 min and cross-linked d-PBAB layer showed smooth surface and is not soluble at organic solvent under spin-coating of emitting layer (EML). The solution-processed PLED which was fabricated with cross-linked d-PBAB as HTL showed approximately two times higher Lmax and four times higher LEmax than those obtained from PLED with PEDOT:PSS as the HTL. These result is ascribed to better ability of cross-linked d-PBAB to block electrons and to prevent exciton-quenching than those of PEDOT : PSS at the EML interface. This results strongly suggested that cross-linked d-PBAB can be a promising material to replace conventional PEDOT : PSS. It can be suspected that PLEDwith cross-linked d-PBAB would show longer lifetime compared with that of PLED with PEDOT : PSS, and thus further studies are under investigation.

• Korean Journal of Optics and Photonics
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• v.18 no.6
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• pp.441-446
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• 2007

Outcoupling efficiency of the OLED device is improved by incorporating both a microlens array and a diffractive grating pattern. The microlens array improves the light transmission at the interface of glass and air, and the diffractive grating outcouples the guided mode propagating at the waveguide, which consists of ITO and organic layers. By using the PDMS soft mold imprinting method, the microlens array is fabricated on the glass substrate. The diffractive grating pattern is directly fabricated on the ITO surface by using laser interferometry. A microlens array with a diameter of $10{\mu}m$ improves the light coupling efficiency by 22%. The diffractive grating made of TSMR photoresist enhances the luminance power efficiency by 41% at a current density of $20mA/cm^2$.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.100-101
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• 2012

The plasma damage free and room temperature processedthin film deposition technology is essential for realization of various next generation organic microelectronic devices such as flexible AMOLED display, flexible OLED lighting, and organic photovoltaic cells because characteristics of fragile organic materials in the plasma process and low glass transition temperatures (Tg) of polymer substrate. In case of directly deposition of metal oxide thin films (including transparent conductive oxide (TCO) and amorphous oxide semiconductor (AOS)) on the organic layers, plasma damages against to the organic materials is fatal. This damage is believed to be originated mainly from high energy energetic particles during the sputtering process such as negative oxygen ions, reflected neutrals by reflection of plasma background gas at the target surface, sputtered atoms, bulk plasma ions, and secondary electrons. To solve this problem, we developed the NBAS (Neutral Beam Assisted Sputtering) process as a plasma damage free and room temperature processed sputtering technology. As a result, electro-optical properties of NBAS processed ITO thin film showed resistivity of $4.0{\times}10^{-4}{\Omega}{\cdot}m$ and high transmittance (>90% at 550 nm) with nano- crystalline structure at room temperature process. Furthermore, in the experiment result of directly deposition of TCO top anode on the inverted structure OLED cell, it is verified that NBAS TCO deposition process does not damages to the underlying organic layers. In case of deposition of transparent conductive oxide (TCO) thin film on the plastic polymer substrate, the room temperature processed sputtering coating of high quality TCO thin film is required. During the sputtering process with higher density plasma, the energetic particles contribute self supplying of activation & crystallization energy without any additional heating and post-annealing and forminga high quality TCO thin film. However, negative oxygen ions which generated from sputteringtarget surface by electron attachment are accelerated to high energy by induced cathode self-bias. Thus the high energy negative oxygen ions can lead to critical physical bombardment damages to forming oxide thin film and this effect does not recover in room temperature process without post thermal annealing. To salve the inherent limitation of plasma sputtering, we have been developed the Magnetic Field Shielded Sputtering (MFSS) process as the high quality oxide thin film deposition process at room temperature. The MFSS process is effectively eliminate or suppress the negative oxygen ions bombardment damage by the plasma limiter which composed permanent magnet array. As a result, electro-optical properties of MFSS processed ITO thin film (resistivity $3.9{\times}10^{-4}{\Omega}{\cdot}cm$, transmittance 95% at 550 nm) have approachedthose of a high temperature DC magnetron sputtering (DMS) ITO thin film were. Also, AOS (a-IGZO) TFTs fabricated by MFSS process without higher temperature post annealing showed very comparable electrical performance with those by DMS process with $400^{\circ}C$ post annealing. They are important to note that the bombardment of a negative oxygen ion which is accelerated by dc self-bias during rf sputtering could degrade the electrical performance of ITO electrodes and a-IGZO TFTs. Finally, we found that reduction of damage from the high energy negative oxygen ions bombardment drives improvement of crystalline structure in the ITO thin film and suppression of the sub-gab states in a-IGZO semiconductor thin film. For realization of organic flexible electronic devices based on plastic substrates, gas barrier coatings are required to prevent the permeation of water and oxygen because organic materials are highly susceptible to water and oxygen. In particular, high efficiency flexible AMOLEDs needs an extremely low water vapor transition rate (WVTR) of $1{\times}10^{-6}gm^{-2}day^{-1}$. The key factor in high quality inorganic gas barrier formation for achieving the very low WVTR required (under ${\sim}10^{-6}gm^{-2}day^{-1}$) is the suppression of nano-sized defect sites and gas diffusion pathways among the grain boundaries. For formation of high quality single inorganic gas barrier layer, we developed high density nano-structured Al2O3 single gas barrier layer usinga NBAS process. The NBAS process can continuously change crystalline structures from an amorphous phase to a nano- crystalline phase with various grain sizes in a single inorganic thin film. As a result, the water vapor transmission rates (WVTR) of the NBAS processed $Al_2O_3$ gas barrier film have improved order of magnitude compared with that of conventional $Al_2O_3$ layers made by the RF magnetron sputteringprocess under the same sputtering conditions; the WVTR of the NBAS processed $Al_2O_3$ gas barrier film was about $5{\times}10^{-6}g/m^2/day$ by just single layer.

• Journal of the Korea Organic Resources Recycling Association
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• v.5 no.1
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• pp.33-42
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• 1997

It is not long since treatment of food waste became a social problem. However, it is a fact that there have been a lot of debates on the treatment of food waste since several years ago. At present, two ways of disposing food waste are under great interest in Korea and Japan. One is drying of food waste at high temperature. The other is disappearance type, in which analysis by microorganism takes place with continuous supply of a bulking agent for a certain period of time that was stored in a reactor. In our laboratory, Disappearance type Food Waste Disposer is under interest, and experiments regarding condition establishment for efficient analysis of food waste were conducted. As preceding experimentation, experiments were done with regard to the selection of a substance to be used as a bulking agent, improvement by addition of a substance which maximizes initial growth of microorganism, and a concentration change in rank odors generated by reaction with deodorizer (absorbent). The results turned out to be satisfactory.

• Current Photovoltaic Research
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• v.4 no.2
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• pp.68-79
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• 2016

The power conversion efficiency of perovskite solar cells has remarkably increased from 3.81% to 22.1% in the past 6 years. Perovskite solar cells, which are based on the perovskite crystal structure, are fabricated using organic-inorganic hybrid materials. The advantages of these solar cells are their low cost and simple fabrication procedure. Also, they have a band gap of about 1.6 eV and effectively absorb light in the visible region. For the commercialization of perovskite solar cells in the field of photovoltaics, the issue of their long term stability cannot be overlooked. Although the development of perovskite solar cells is unprecedented, their main drawback is the degradation of the perovskite structure by moisture. This degradation is accelerated by exposure to UV light, temperature, and external bias. This paper reviews the aforesaid reasons for perovskite solar cell degradation. We also discuss the research directions that can lead to the development of perovskite solar cells with high stability.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.47-53
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• 2012

Bonding strength of Sn-3.0Ag-0.5Cu solder joint due to degradation characteristic of OSP surface finish was investigated, compared with SnPb finish. The thickness variation and degradation mechanism of organic solderability preservative(OSP) coating were also analyzed with the number of reflow process. To analyze the degradation degree of solder joint strength, FR-4 PCB coated with OSP and SnPb were experienced preheat treatment as a function of reflow number from 1st to 6th pass, respectively. After 2012 chip resistors were soldered with Sn-3.0Ag-0.5Cu on the pre-heated PCB, the shear strength of solder joints was measured. The thickness of OSP increased with increase of the number of reflow pass by thermal degradation during the reflow process. It was also observed that the preservation effect of OSP decreased due to OSP degradation which led Cu pad oxidation. The mean shear strength of solder joints formed on the Cu pads finished with OSP and SnPb were 58.1 N and 62.2 N, respectively, through the pre-heating of 6 times. Although OSP was degraded with reflow process, the feasibility of its application was proven.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.344-344
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• 2014

Transparent amorphous oxide semiconductors such as a In-Ga-Zn-O (a-IGZO) have advantages for large area electronic devices; e.g., uniform deposition at a large area, optical transparency, a smooth surface, and large electron mobility >10 cm2/Vs, which is more than an order of magnitude larger than that of hydrogen amorphous silicon (a-Si;H).1) Thin film transistors (TFTs) that employ amorphous oxide semiconductors such as ZnO, In-Ga-Zn-O, or Hf-In-Zn-O (HIZO) are currently subject of intensive study owing to their high potential for application in flat panel displays. The device fabrication process involves a series of thin film deposition and photolithographic patterning steps. In order to minimize contamination, the substrates usually undergo a cleaning procedure using deionized water, before and after the growth of thin films by sputtering methods. The devices structure were fabricated top-contact gate TFTs using the a-IGZO films on the plastic substrates. The channel width and length were 80 and 20 um, respectively. The source and drain electrode regions were defined by photolithography and wet etching process. The electrodes consisting of Ti(15 nm)/Al(120 nm)/Ti(15nm) trilayers were deposited by direct current sputtering. The 30 nm thickness active IGZO layer deposited by rf magnetron sputtering at room temperature. The deposition condition is as follows: a rf power 200 W, a pressure of 5 mtorr, 10% of oxygen [O2/(O2+Ar)=0.1], and room temperature. A 9-nm-thick Al2O3 layer was formed as a first, third gate insulator by ALD deposition. A 290-nm-thick SS6908 organic dielectrics formed as second gate insulator by spin-coating. The schematic structure of the IGZO TFT is top gate contact geometry device structure for typical TFTs fabricated in this study. Drain current (IDS) versus drain-source voltage (VDS) output characteristics curve of a IGZO TFTs fabricated using the 3-layer gate insulator on a plastic substrate and log(IDS)-gate voltage (VG) characteristics for typical IGZO TFTs. The TFTs device has a channel width (W) of $80{\mu}m$ and a channel length (L) of $20{\mu}m$. The IDS-VDS curves showed well-defined transistor characteristics with saturation effects at VG>-10 V and VDS>-20 V for the inkjet printing IGZO device. The carrier charge mobility was determined to be 15.18 cm^2 V-1s-1 with FET threshold voltage of -3 V and on/off current ratio 10^9.