• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2000년도 추계학술대회 논문집
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• pp.33-37
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• 2000

Milling fixture is one kind of machining device according to the industrial demands for multi manufacturing products on the growing at alarming rate. In the field of design and making for machine tool working, welding, assembling with fixture for mass production is a specific division. In order to prevent the production defects, occurring, the optimum design of product, fixture putting in the field is very significant manufacturing method. They require analysis of many kinds of important factors, theory and practice of machine tool operating process and its situations, fixture and its structure, machining condition for tool making tool materials, heat treatment of fixture components, know-how and so on. In this study we designed and constructed a milling fixture of mass production and performed tryout under the AUTO CAD, database, I-DEAS and WINDOW environment. Especially part 1 of this study is reveals with the analysis of part drawing, fixture planning, fixture design etc.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.19-21
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• 2005

The ball shea. tests for ball grid array (BGA) and flip chip packages were carried out with different displacement rates to find out the optimum condition of the displacement rate for this test. The BGA packages consisted of two different kinds of solder balls (eutectic Sn-37wt.%Pb and Sn-3.5wt.%Ag) and electroplated Au/Ni/Cu substrate, whereas the flip chip package consisted of electroplated Sn-37Pb solder and Cu UBM. The packages were reflowed up to 10 times, or aged at 443 K up to 21 days. The variation of the displacement rate resulted in the variations of the shear properties such as shear force, displacement rate at break, fracture mode and strain rate sensitivity. The increase in the displacement rate led to the increase of the shear force and brittleness of solder joints.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.291-293
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• 2005

The purpose of this study is to evaluate the effects of line heating variables for forming the curved plate on the behavior of distortion using FEA and experiment. The optimum mixed ratio and standoff for flame heating was established under the heating conditions given in this study. With the heating condition, the predictive equation of angular distortion and transverse shrinkage was established using FEA and verified by comparing the predicted results and experimental results.

• 한국레이저가공학회지
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• 제7권2호
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• pp.19-26
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• 2004

The effect of shield gas on the weldability, mechanical properties and formability of CO2 laser weld joint in 600MPa grade high strength steel was investigated. Bead on plate welds were made under various welding speed and shield gas. Tensile test was carried out under the load of perpendicular and parallel direction to the weld line, Formability of the joint was evaluated by Erichsen test. As the welding speed increases, the porosity fraction decreases. The porosity fraction in the joint used Ar-$50\%He$ mixed gas as a shield gas was lower than that of the joint used Ar gas. Hardness at the weld metal of full penetrated joint was nearly equal to that of water quenched raw metal. In a tensile test under a perpendicular load to the weld axis, strength and elongation of joint produced by optimum condition were nearly equal to those of base metal. However, the strength of joint in a tensile test under a parallel load to weld axis was higher than that of raw metal, but the elongation of joint was lower than that of raw metal. Elongation and formability were further increased by the method of using Ar+He mixed gas as a shield gas as compared with Ar gas. Formabilities of joints were recorded ranging from $58\%\;to\;70\%$ of that of base metal with different shield gases.

• Journal of Welding and Joining
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• 제24권2호
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• pp.64-70
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• 2006

The 3-dimensional (3D) chip stacking technology is a leading technology to realize a high density and high performance system in package (SiP). There are several kinds of methods for chip stacking, but the stacking and interconnection through Cu filled through-hole via is considered to be one of the most advanced stacking technologies. Therefore, we studied the optimum process of through-hole via formation and Cu filling process for Si wafer stacking. Through-hole via was formed with DRIE (Deep Reactive ion Etching) and Cu filling was realized with the electroplating method. The optimized conditions for the via formation were RE coil power of 200 W, etch/passivation cycle time of 6.5 : 6 s and SF6 : C4F8 gas flow rate of 260 : 100 sccm. The reverse pulsed current of 1.5 A/dm2 was the most favorable condition for the Cu electroplating in the via. The Cu filled Si wafer was chemically and mechanically polished (CMP) for the following flip chip bumping technology.

• Journal of Welding and Joining
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• 제10권3호
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• pp.63-72
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• 1992

The joining methods of ceramics to metals which can be expected to obtain high temperature strength are mainly classified into the solid-state diffusion bonding method and the active brazing method. Between these two, the solid-state diffusion bonding method is given attentions as substituting method for active brazing method due to being capable of obtaining higher bonding strength at high temperature and accurate bonding. In this paper, the solid-state diffusion bonding of $Al_{2}$O$_{3}$ ceramics to Ni-Cr-Mo alloy steel (SNCM21) using insert metal was carried out. The insert metal employed in this study was experimentally home-made, Ag-Cu-Ti alloy. Influence of several bonding parameters of $Al_{2}$O$_{3}$SNCM21 joint was quantitatively evaluated by bonding strength test, and microstructural analyses at the interlayer were performed by SEM/EDX. From above experiments, the optimum bonding condition of the solid-state diffusion bonding of $Al_{2}$O$_{3}$/SNCM21 using Ag-Cu-Ti insert metal was determined. Futhermore, high temperature strength and thermal-shock properties of $Al_{2}$O$_{3}$/SNCM21 joint were also examined. The results obtained are as follows. 1. The maximum bonding strength was obtained at the temperature of 95% melting point of insert metal. 2. The high temperature strength of $Al_{2}$O$_{3}$/SNCM21 joint appeared to bemaximum value at test temperature 500.deg.C and the bonding strength with increasingtemperature showed parabolic curve. 3. The strength of thermal-shocked specimens was far deteriorated than those of as-bonded specimens. Especially, water-quenched specimen after heated up to 600.deg. C was directly fractured in quenching.

• 대한조선학회지
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• 제20권2호
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• pp.1-20
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• 1983

In this paper design criteria for semi-submersibles, effective at the stage of basic design, are reviewed first generally. Thereafter an extensive study is focussed on essential problematic areas such as design load, heaving motion, overall structural analysis and welding technique. The necessity for this kind of research is apparent in the light of the fact that ocean exploration and exploitation becomes extended to deeper ocean and that semi-submersibles are the most favorite unit for operation under this environment. In some sense principles in naval architecture are indeed applicable to the design of semi-submersible. However, because of the difference in geometry between ships and semi-submersibles, there are significant deviations in design method. A thorough discussion is made on particular behaviours of a semi-submersible in stability, wave load, motion characteristics and structural responses. Then some calculation-procedures and design guidelines are tentatively proposed. A numerical calculation for a semi-submersible Sedco 708 is exemplified for better understanding of the concept. The structure has 4 main and another 4 secondary stabilizing columns with catamaran-type lower hull. In this example design condition is supposed to be 28m wave height, 90 knots wind speed for survival condition and seastate 6 for operational condition in water of 100m depth. The numerical result implies that the actual design of this model can be assessed close to optimum. Further intensive research is strongly required in the subject fields of dynamic stability, rational evaluation of wave load statistical basis for fatigue life judgement.

• 대한기계학회논문집A
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• 제34권10호
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• pp.1367-1375
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• 2010

본 연구에서는 핫스템핑 소재로 사용되는 보론합금강판 22MnB5의 단일 겹치기 점용접에서 용접부의 강도 향상을 위한 최적화를 수행하였다. 최적화 과정은 다구찌 실험계획법에 의해 행해졌으며 공정변수는 전류, 가압력 및 통전시간으로 선정하였고, 잡음인자로서 핫스템핑 시 소재의 가열온도와 유지시간을 고려하였다. 가열조건에 따라 22MnB5 표면의 알루미늄 도금층과 모재 간의 확산반응에 의해 화합물층 두께에 산포가 발생하였으며 이러한 산포는 너겟의 형성에 영향을 미치는 것을 알 수 있었다. 한편 용접부의 인장전단강도를 목적함수로 하였을 때, 이러한 가열조건에 강건한 최적의 용접 조건은 전류 8kA, 가압력 4kN, 통전시간 18cycle로 선정되었다. 최적 조건의 검증 결과 용접부의 인장전단강도 는 32kN으로서 요구되는 규격인 23kN보다 크게 증가되었다.

• 한국산학기술학회논문지
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• 제4권3호
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• pp.183-188
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• 2003

본 연구는 Connector Mold의 Termina (리브)에 가스 모임으로 인한 미성형 및 웰드라인이 생성되어 이를 방지하기 위해 과다한 사출압력, 금형온도 및 수지온도를 높이므로 Burr둥의 불량현상이 발생하게된다. 따라서 연구에서는 진공성형시스템을 응용한 Connector Mold를 개발하기 위하여 사출성형의 중요한 인자가 되는 용융수지온도, 금형온도, 냉각조건을 최적 조건에서 진공압을 체계적으로 제어함으로 각 캐비티의 깊은 글 부분의 미충전 부분을 진공화 하여 충전불량을 해소하면서, 싸이클 시간을 단축시킬 수 있는 진공시스템을 연구개발 성형가공에 적용함으로 우수한 제품과 생산성 향상의 효과를 얻을 수 있다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.568-571
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• 1997

The overall aim of this paper is to determine coupling loss factor using loss factor and structural loss factor. For this purpose, two kinds of loss factor were adopted. One is loss factor of each sub structure, another is structural loss factor based on the complex welded or assembled structure. Using these two parameters, it is possible to derive the coupling loss factor which represent characteristic condition of SEA theory. Coupling loss factor of conjunction in complex structure was expressed as power balance equation. The derived equation for a coupling loss factor has been simplified on the assumption of one directional power flow between two sub structures. Using these conditions, it is possible to find the coupling loss factor equation. The comparison between theory of power transmission on conjunction and above equation, show a good agreement in simple beam structure. To check the effectiveness of above equation, it was adopted rotary compressor. Rotary compressor has three main conjunctions between shell and internal vibration part. This equation was applied to find out the optimum welding point with respect to reduce the noise propagation. It shows the effective tool to evaluate the coupling loss factor in complex structure.