• Title/Summary/Keyword: Optimized process

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Process Conditions Optimizing the Yield of Power Semiconductors (전력반도체의 수율향상을 위한 최적 공정조건 결정에 관한 연구)

  • Koh, Kwan Ju;Kim, Na Yeon;Kim, Yong Soo
    • Journal of Korean Society for Quality Management
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    • v.47 no.4
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    • pp.725-737
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    • 2019
  • Purpose: We used a data analysis method to improve semiconductor manufacturing yield. We defined and optimized important factors and applied our findings to a real-world process. The semiconductor industry is very cost-competitive; our findings are useful. Methods: We collected data on 15 independent variables and one dependent variable (yield); we removed outliers and missing values. Using SPSS Modeler ver. 18.0, we analyzed the data both continuously and discretely and identified common factors. Results: We optimized two independent variables in terms of process conditions; yield improved. We used DS Leak software to model netting and Contact CD software to model meshes. DS Leak shows smaller the better characterisrics and Contact CD shows normal the best characteristics Conclusion: Various efforts have been made to improve semiconductor manufacturing yields, and many studies have created models or analyzed various characteristics. We not only defined important factors but also showed how to control processing to improve semiconductor yield.

Optimization of the Hydro-Forming Process for Aluminum Bumper Beams by Using Finite Element Analysis (유한요소법을 이용한 하이드로포밍 알루미늄 범퍼빔의 성형공정 최적화)

  • Son, Wonsik;Yum, Sanghyuk;Lee, Jihoon;Kim, Seungmo
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.26 no.4
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    • pp.410-417
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    • 2017
  • Hydro-forming is being employed increasingly to realize lightweight vehicular parts. The bumper beam produced by this process weighs 30% less than the conventional products with equal stiffness. However, hydro-forming involves complex parameters to obtain the target geometry and low residual stress. Parametric studies are conducted using finite element analysis to obtain optimized process conditions. Through these numerical approaches, the internal and holding pressures and feeder forward stroke along the extruded direction are optimized to achieve low residual stress and to minimize springback. The numerical results are verified by experimental observations made by employing a three-dimensional laser scanner. The numerical and experimental results are compared in terms of the springback. Both results show similar tendencies.

The fabrication process and optimum design of RESURF EDMOSFETs for smart power IC applications (Smart power IC용 RESURF EDMOSFETs의 제조공정과 최적설계)

  • 정훈호;권오경
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.7
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    • pp.176-184
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    • 1996
  • To overcome the drawbacks of conventional LDMOSFETs, we propose RESURF EDMOSFETs which can be adapted in varous circuit applications, be driven without charge pumping circuity and thowe threshold voltage can be adjusted. The devices have the diffused drift region formed by a high tmperature process before the gate oxidaton. After the polysilicon gate electrode formation, a fraction of the drift region around the gate edge is opened for supplemental self-aligned ion implantation to obtain self-aligned drift region. This leads to a shorter gate length and desirable drift region junction contour under the gate edge for minimum specific-on-resistance. In additon, a and maximize the breakdown voltage. Also, by biasing the metal field plate, we can reduce the specific-on-resistance further. The devices are optimized by using the TSUPREM-4 process simulator and the MEDICI device simulator. The optimized devices have the breakdwon voltage and the specific-on-resistance of 101.5V and 1.14m${\Omega}{\cdot}cm^{2}$, respectively for n-channel RESURF EDMOSFET, and 98V and 2.75m.ohm..cm$^{2}$ respectively for p-channel RESURF EDMOSFET. To check the validity of the simulations, we fabricated n-channel EDMOSFETs and confirmed the measured breakdown voltage of 97V and the specific-on-resistance of 1.28m${\Omega}{\cdot}cm^{2}$. These results are superior to those of any other reported power devices for smart power IC applications.

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Manufacturing and Thermal Process Optimization of Ag-paste for Fabricating High Efficiency Mono-Si Solar Cell (고효율 단결정 Si 태양전지 제작을 위한 은 페이스트의 제조 및 열 공정 최적화)

  • Pi, Ji-Hee;Kim, Sung-Jin;Son, Chang-Rok;Kweon, Soon-Yong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.2
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    • pp.144-150
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    • 2013
  • A New Ag-pastes were developed for integrating the high efficiency mono-Si solar cell. The pastes were the mixture of 84 wt% Ag, 2 wt% glass frit, 11 wt% solvent of buthyl cabitol acetate, and 3 wt% additives. After fabricating the Ag-pastes by using a 3-roll mill, they were coated on a $SiN_x$/n+/p- stacks of a commercial mono-Si solar cell. And the post-thermal process was also optimized by varying the process conditions of peak temperature. The optimized solar cell efficiency on a 6-inch mono-Si wafer was 18.28%, which was the one of the world best performances. It meaned that the newly developed Ag-paste could be adopted to fabricate a commercial bulk Si solar cell.

Springback Compensation of Sheet Metal Bending Process Based on DOE & ANN (판재 굽힘 성형에서 실험계획법 및 인공신경망을 이용한 탄성회복 보정)

  • An, Jae-Hong;Ko, Dae-Cheol;Lee, Chan-Joo;Kim, Byung-Min
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.32 no.11
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    • pp.990-996
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    • 2008
  • Nowadays, the trend to a lightweight design accelerates the use of advanced high strength steel (AHSS) in automotive industry. Springback phenomena is a hot issue in the sheet metal forming, especially bending process using AHSS. Several analytical methods for that have been proposed in recent years. Each of method has their advantages and disadvantages. There are only a few optimal solutions which can minimize the two objectives simultaneously. In this study, an effective method optimized the multi objective value. The method by the design of experiments(DOE) and artificial neural network(ANN) was presented to compensate springback of bending parts. This method was applied to L and V bending process. The effective method could be optimized to multiple object. It was confirmed that the proposed method was more efficient than traditional manual FEA procedure and the trial and error approach for springback compensation.

Trust Predicated Routing Framework with Optimized Cluster Head Selection using Cuckoo Search Algorithm for MANET

  • Sekhar, J. Chandra;Prasad, Ramineni Sivarama
    • IEIE Transactions on Smart Processing and Computing
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    • v.4 no.2
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    • pp.115-125
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    • 2015
  • This paper presents a Cuckoo search algorithm to secure adversaries misdirecting multi-hop routing in Mobile ad hoc networks (MANETs) using a robust Trust Predicated Routing Framework with an optimized cluster head selection. The clustering technique designed in this framework leads to efficient routing in MANETs. The heavy work load in the node causes an energy drop in cluster head, which leads to re-clustering of the group, and another cluster head is selected to avoid packet loss during data transmission. The problem in the re-clustering process is that the overall efficiency of the routing process is reduced and the processing time is increased. A Cuckoo search based optimization algorithm is proposed to solve the problem of re-clustering by selecting the secondary cluster head within the initially formed cluster group and eliminating the reclustering process. The proposed framework enables a node to select a reliable and secure route for MANET and the performance can be evaluated by comparing the simulated results with the AODV routing protocol, which shows that the performance of the proposed routing protocol are improved significantly.

An Optimized Approach of Fault Distribution for Debugging in Parallel

  • Srivasatav, Maneesha;Singh, Yogesh;Chauhan, Durg Singh
    • Journal of Information Processing Systems
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    • v.6 no.4
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    • pp.537-552
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    • 2010
  • Software Debugging is the most time consuming and costly process in the software development process. Many techniques have been proposed to isolate different faults in a program thereby creating separate sets of failing program statements. Debugging in parallel is a technique which proposes distribution of a single faulty program segment into many fault focused program slices to be debugged simultaneously by multiple debuggers. In this paper we propose a new technique called Faulty Slice Distribution (FSD) to make parallel debugging more efficient by measuring the time and labor associated with a slice. Using this measure we then distribute these faulty slices evenly among debuggers. For this we propose an algorithm that estimates an optimized group of faulty slices using as a parameter the priority assigned to each slice as computed by value of their complexity. This helps in the efficient merging of two or more slices for distribution among debuggers so that debugging can be performed in parallel. To validate the effectiveness of this proposed technique we explain the process using example.

Optimal Criterion for the Scale-Up Production of Schizophyllan in the Stirred Tank Reactor

  • KWAK, JUNG-KI;KOO, JAE-GUEN;PARK, SUNG-WOO;CHO, MAN-GI;KANG, BYEONG-CHUL;RAINER BUCHHOLZ;PETER GOETZ
    • Journal of Microbiology and Biotechnology
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    • v.15 no.1
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    • pp.1-6
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    • 2005
  • Optimal criterion for the scale-up production of schizophyllan, a fungal polysaccharide secreted by Schizophyllum commune, was investigated. For the production of the polysaccharide in a 150-l bioreactor, the culture conditions optimized in a 15-l bioreactor were applied to a 150-l bioreactor with scale-up process, by changing impeller speed and airflow rate. The optimized impeller speed in the 15-l bioreactor was 50 rpm in a technical medium based on barley. For establishment of the scale-up process, 3 kinds of criteria were used while the gas throughput number was kept constant, as follows; constant volume-related power input, constant tip speed of stirrer, and constant Reynolds number. In the 150-l bioreactor, the highest values for the maximum specific growth rate (1.17/day) and productivity (0.63 g/L${\cdot}$day) were achieved in the culture condition from constant volumerelated power input criterion.

Solar Cell Efficiency Improvement using a Pre-deposition Temperature Optimization in The Solar Cell Doping Process (도핑 공정에서의 Pre-deposition 온도 최적화를 이용한 Solar Cell 효율 개선)

  • Choi, Sung-Jin;Yoo, Jin-Su;Yoo, Kwon-Jong;Han, Kyu-Min;Kwon, Jun-Young;Lee, Hi-Deok
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.244-244
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    • 2010
  • Doping process of crystalline silicon solar cell process is very important which is as influential on efficiency of solar. Doping process consists of pre -deposition and diffusion. Each of these processes is important in the process temperature and process time. Through these process conditions variable, p-n junction depth can be controled to low and high. In this paper, we studied a optimized doping pre-deposition temperature for high solar cell efficiency. Using a $200{\mu}m$ thickness multi-crystalline silicon wafer, fixed conditions are texture condition, sheet resistance($50\;{\Omega}/sq$), ARC thickness(80nm), metal formation condition and edge isolation condition. The three variable conditions of pre-deposition temperature are $790^{\circ}C$, $805^{\circ}C$ and $820^{\circ}C$. In the $790^{\circ}C$ pre-deposition temperature, we achieved a best solar cell efficiency of 16.2%. Through this experiment result, we find a high efficiency condition in a low pre-deposition temperature than the high pre-deposition temperature. We optimized a pre-deposition temperature for high solar cell efficiency.

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Effects of process variables on aqueous-based AlOx insulators for high-performance solution-processed oxide thin-film transistors

  • Huh, Jae-Eun;Park, Jintaek;Lee, Junhee;Lee, Sung-Eun;Lee, Jinwon;Lim, Keon-Hee;Kim, Youn Sang
    • Journal of Industrial and Engineering Chemistry
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    • v.68
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    • pp.117-123
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    • 2018
  • Recently, aqueous method has attracted lots of attention because it enables the solution-processed metal oxide thin film with high electrical properties in low temperature fabrication condition to various flexible devices. Focusing the development of aqueous route, many researchers are only focused on metal oxide materials. However, for expansive application of the aqueous-based metal oxide films, the systematic study of performance change with process variables for the development of aqueous-based metal oxide insulator film is urgently required. Here, we propose importance of process variables to achieve high electrical-performance metal oxide insulator based on the aqueous method. We found that the significant process variables including precursor solution temperature and humidity during the spincoating process strongly affect chemical, physical, and electrical properties of $AlO_x$ insulators. Through the optimization of significant variables in process, an $AlO_x$ insulator with a leakage current value approximately $10^5$ times smaller and a breakdown voltage value approximately 2-3 times greater than un-optimized $AlO_x$ was realized. Finally, by introducing the optimized $AlO_x$ insulators to solutionprocessed $InO_x$ TFTs, we successfully achieved $InO_x/AlO_x$ TFTs with remarkably high average field-effect mobility of ${\sim}52cm^2V^{-1}\;s^{-1}$ and on/off current ratio of 106 at fabrication temperature of $250^{\circ}C$.