• 제목/요약/키워드: Optimal filling conditions

검색결과 46건 처리시간 0.034초

반도체 칩 캡슐화 공정의 최적조건에 관한 연구 (A Study on Optimal Process Conditions for Chip Encapsulation)

  • 허용정
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 춘계학술대회 논문집
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    • pp.477-480
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    • 1995
  • Dccisions of optimal filling conditions for the chip encapsulation have been done primarily by an ad hoc use of expertise accumulated over the years because the chip encapsulation process is quite complicated. The current CAE systems do not provide mold designers with necessary knowledge of the chip encapsulation for the successful design of optimal filling except flow simulation capability. There have been no attempts to solve the optimal filling problem in the process of the chip encapsulation. In this paper, we have constructed an design system for optimal filling to avoid short shot in the chip encapsulation process which combines an optimization methodology with CAE software.

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미성형 방지를 위한 최적조건 생성 시스템 연구 (A Study on Intelligent Generator of Optimal Process Conditions to Avoid Short Shot)

  • 강성남;허용정;조현찬
    • 한국정밀공학회지
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    • 제19권12호
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    • pp.33-37
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    • 2002
  • A short shot is a molded part that is incomplete because insufficient material was injected into the mold. Remedial actions to control the process conditions can be taken by the injection molding experts based on their knowledge and experience. However, it is very difficult for the non-experts to avoid short shot by finding the proper process conditions such as mold temperature, melt temperature and filling time. In this paper, an intelligent generator of the optimal process conditions based upon fuzzy logic algorithm is proposed so that trial and error can be minimized and the non-experts as well as the experts can also find the optimal process conditions.

사출성형용 지능형 미성형 방지 최적조건 생성 시스템 연구 (A Study on Intelligent Generator of Optimal Process Conditions to Avoid Short Shot)

  • 강성남;허용정;조현찬
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2001년도 춘계학술대회 논문집
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    • pp.402-405
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    • 2001
  • A short shot is a molded part that is incomplete because insufficient material was injected into the mold. Remedial actions to control the process conditions can be taken by the injection molding experts based on their knowledge and experience. However, it is very difficult for the non-experts to avoid short shot by finding the proper process conditions such as mold temperature, melt temperature and filling time. In this paper, an intelligent generator of the optimal process conditions based upon fuzzy logic algorithm is proposed so that trial and error can be minimized and the non-experts as well as the experts can also find the optimal process conditions.

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다수 캐비티 사출금형에서 성형 인자가 충전 불균형에 미치는 영향 (Effects of processing Factors on Filling Imbalances in Multi-cavity Injection Mold.)

  • 강철민;정영득
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2004년도 추계학술대회논문집
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    • pp.54-57
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    • 2004
  • Almost all injection molds have multi-cavity runner for mass production, which are designed with geometrically balanced runner system in order to minimize filling imbalance between cavity to cavity during processing. However, even though geometrically balanced runner is used, filling imbalances have sometimes been observed. These filling imbalances have historically been considered as result of uneven mold temperature and mold deflection, but it actually results from non-symmetrically shear, pressure, temperature distribution within melt material as it flows through the runner system. Filling imbalance could be decreased by modifying processing conditions that are related to shear, pressure, temperature such as injection rate, mold temperature, injection pressure, melt temperature. In this study, a series of experiment was conducted using Taguchi method to determine which processing condition influence as the primary cause of filling imbalance in geometrically balanced runner system. As a result of experiments, this paper could present an optimal processing condition to minimize variable that brings about filling imbalance geometrically balanced runner system

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원통형 플라스틱 성형품의 싱크 마크를 최소화하기 위한 사출성형 조건의 최적화 (Optimization of injection molding to minimize sink marks for cylindrical geometry)

  • 권윤숙;제덕근;정영득
    • Design & Manufacturing
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    • 제2권2호
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    • pp.33-37
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    • 2008
  • This paper describes the optimization of injection molding conditions to minimize sink marks. Sink marks, which refer to a small depression on the surface opposite a thick wall thickness, are often encounted in injection molded plastic parts. Part geometry, material properties and processing conditions during injection molding can affect the sink mark depth. We designed the runner system which is possible balanced filling to cavities using CAE program and then obtained optimal processing conditions by Taguchi's Robust Design technique. By actual injection molding using optimized mold and molding conditions, it confirmed that sink mark depth decreased zero compared to 1mm level in the conventional mold and process.

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원통형 플라스틱 성형품의 싱크 마크를 최소화하기 위한 사출성형 조건의 최적화 (Optimization of Injection Molding to Minimize Sink Marks for Cylindrical Geometry)

  • 권윤숙;정영득
    • 한국정밀공학회지
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    • 제25권7호
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    • pp.111-115
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    • 2008
  • This paper describes the optimization of injection molding conditions to minimize sink marks. Sink marks, which refer to a small depression on the surface opposite a thick wall thickness, are often encounted in injection molded plastic parts. Part geometry, material properties and processing conditions during injection molding can affect the sink mark depth. We designed the runner system which is possible balanced filling to cavities using CAE program $Moldflow^{TM}$ and then obtained optimal processing conditions by Taguchi's Robust Design technique. By actual injection molding using optimized mold and molding conditions, it confirmed that sink mark depth decreased zero compared to 1mm level in the conventional mold and process.

반도체 칩 캡슐화성형 유동해석 및 성형조건 최적화에 관한 연구 (Flow Analysis and Process Conditions Optimization in a Cavity during Semiconductor Chip Encapsulation)

  • 허용정
    • 마이크로전자및패키징학회지
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    • 제8권4호
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    • pp.67-72
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    • 2001
  • 반도체 칩 캡슐화성형시 칩 캐비티에서의 유동을 보다 엄밀하게 모델링하고 해석하기 위한 연구가 이루어졌다. 리드프레임에서의 구멍부위를 통과하는 유동의 모델링을 시도하였고 리드프레임에서의 열 경계조건을 정확하게 취급하였다. 유동의 이론적 해석을 위해 헬레쇼오 모델을 채택하였고 리드프레임에 의해 아래 위로 분리된 각각의 캐비티로 가정하여 해석하였다. 리드프레임에서 구멍부위를 통과하는 유동은 헬레쇼오 모델링시에 질량 소스(source) 항으로 삽입되었다. 유동해석 프로그램과 콤플렉스 방법에 기반을 둔 최적화 프로그램을 연계하여 미성형 방지를 위한 최적 공정조건을 성공적으로 정확하게 얻어낼 수 있었다.

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지역 및 파종기 차이가 소맥의 등숙 및 품질에 미치는 영향 (Effects of Region and Sowing Date on Grain- filling and Quality in Wheat)

  • 류용환;하용웅;최창열
    • 한국작물학회지
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    • 제28권3호
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    • pp.368-373
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    • 1983
  • 본 시험은 1978년부터 1979년까지 2개년간 수원과 광주에서 소맥 “조광”을 공시하여 파종기를 달리하였을 때 등숙기간중 립중의 경시적인 증가양상과 품질의 변이에 관하여 등숙기간별로 추적조사한 바 그 결과를 요약하면 다음과 같다. 1. 출수기는 지역간에는 수원에서 파종기차이에서는 적기파종에서 빨랐으나 년차간에는 차이가 없었으며 출수까지의 일수는 지역 및 파종기에 따라 변이가 비교적 커서 수원에서 225-207일, 광주는 192-176일이 소요되었다. 2. 등숙전기의 립중은 광주에서 보다 수원에서 무거웠으나 최종 립중은 반대로 광주에서 높았다. 3. 등숙일수는 년차변이가 커서 수원에서 적기파종한 경우는 43-49일, 광주는 44-51일이었으며 만기파종은 동일지역내에서 적기파종에 비해 1-4일이 단축되었다. 4. 제분율은 지역간에는 광주에서, 파종기간에는 적기파종에서 다소 높았으며 등숙일수에 따라서는 등숙이 진전됨에 의해 증가하여 만기파종에서는 출수후 45일에 최대가 되었으나 적기파종에서는 45일이후까지 경미한 증가경향을 보였다. 5. 단백질함량과 심전가는 제분율과는 반대로 고온하에서 등숙이 이루어진 북부지방에서, 파종기에 따라서는 만기파종에서 높았으며 등숙기간별로는 일양적인 경향이 없었다.

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알루미늄합금의 반용융 단조 및 주조공정에 관한 수치해석 (Numerical Analysis on Semi-Solid Forging and Casting Process of Aluminum Alloys)

  • 강충길;임미동
    • 소성∙가공
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    • 제6권3호
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    • pp.239-249
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    • 1997
  • The behaviour of alloys in the semi-solid state strongly depends on the imposed stress state and on the morphology of the phase which can vary from dendritic to globular. To optimal net shape forging of semi-solid materials, it is important to investigate for filling phenomena in forging process of arbitrarily shaped dies. To produce a automotive part which has good mechanical property, the filling pattern according to die velocity and solid fraction distribution has to be estimated for arbitrarily shaped dies. Therefore, the estimation of filling characteristic in the forging simulation with arbitrarily shaped dies of semi-solid materials are calculated by finite element method with proposed algorithm. The proposed theoretical model and a various boundary conditions for arbitrarily shaped dies is investigated with the coupling calculation between the liquid phase flow and the solid phase deformation. The simulation process with arbitrarily shaped dies is performed to the isothermal conditions of two dimensional problems. To analysis of forging process by using semi-solid materials, a new stress-strain relationship is described, and forging analysis is performed by viscoelastic model for the solid phase and the Darcy's law for the liquid flow. The calculated results for forging force and filling limitations will be compared to experimental data. The filling simulation of simple products performed with the uniform billet temperature(584$^{\circ}C$) from the induction heating by the commercial package MAGMAsoft. The initial step of computation is the touching of semi-solid material with the end of die gate and the initial concept of proposed system just fit with the capability of MAGMAsoft.

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퍼지 알고리듬을 이용한 금형 온도 지적생성 시스템에 관한 연구 (A Study on Intelligent Generator of Mold Temperature Using Fuzzy Algorithm to Prevent Short Shot)

  • 강성남;허용정
    • 마이크로전자및패키징학회지
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    • 제8권4호
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    • pp.53-57
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    • 2001
  • 사출성형공정에서 미성형은 가장 빈번하게 발생하는 성형불량중의 하나이다. 이러한 미성형을 해결하기 위해 가상 경제적인 효율적인 방법은 공정조건을 개선하는 일이다. 그러나 대부분의 경우 사출 전문가의 오랜 기간 축적된 경험과 지식에 의존하기 때문에 여러 번의 시행착오을 겪어야 한다. 따라서 본 논문에서는 퍼지 알고리즘을 기반으로 하여 시스템에 적합한 공정조건을 찾는데 있어 시행착오를 줄이고, 또한 비전문가도 쉽게 적용학 수 있는 지능형 공정조건 생성 시스템을 제안하였다.

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