• 소성∙가공
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• 제31권4호
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• pp.179-185
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• 2022

The influence of post-roll bonding heat treatment conditions such as temperature and time on the variation in the diffusion layer, generated at the bonding interface and the subsequent mechanical properties of the roll-bonded Ti grade 1/Al1050/Ti grade 1 sheets, was systematically investigated. The intermetallic compound (IMC) phase generated by post heat treatment conditions adopted in this study was obviously indexed as monolithic TiAl₃. Whereas the thickness of IMC layer generated by annealing at 500 ℃ was approximately 100 nm scale, it drastically increased above 1.5 ㎛ when annealed at 600 ℃. Uniaxial tensile and peel tests were then performed to compare mechanical properties. As a result, the bonding strength drastically increased above 7.9 N/mm by annealing at 600 ℃, which implies that proper annealing condition was a prerequisite, to improving interface bonding strength as well as global elongation properties for Ti/Al/Ti 3-ply sheet.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1985-1987
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• 1996

Shape memory alloy springs have been fabricated and annealed at $400^{\circ}C$, $450^{\circ}C$ and $500^{\circ}C$ in atmosphere and in nitrogen gas. The optimal heat treatment condition in view of maximum generated force has been decided by the iso-thermal test with variation of annealing condition. Experimental results show that the heat treatment with high temperature in nitrogen gas is desirable for high generated force and can be used for the design of shape memory alloy springs.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.58-58
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• 2000

Recently low resistance of bus line is required for large screen size RFT-CLD panels. As a result, lower resistance Al-alloy is currently reviewed extensively. The resistivity is required smaller than 10$\mu$$\Omega$cm and high resistance of chemical attack is required. In this paper, Al-W thin film were deposited on glass substrates by D.C magnetron sputtering system under various condition for high chemical resistance. Its properties were characterized by SEM, AFM, XRD, 4-point-probe, and cyclic voltammertry. The optimal condition of Al-W was 10$0^{\circ}C$, 100W, 0.4Pa, 23sccm(Ar) and 35$0^{\circ}C$, 20min. annealing. At that condition the resistivity of Al-W(3 wt.%) was about 11$\mu$$\Omega$cm. And when wt.% of W in Al-W alloy was higher than about 4%, Al-W alloy thin film has high chemical resistance.

• 한국진공학회지
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• 제8권3A호
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• pp.245-248
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• 1999

Recently low resistance of gate line or data line is required for large screen size TFT-LCD panels. As a result, lower resistance Al-alloy is currently reviewed extensively and the resistivity is required smaller than 10$\mu\Omega$cm. In this paper, Al-Nd and Al-Zr thin film were deposited on glass substrated by D.C. magnetron sputtering system under various condition. Its properties were characterized by SEM, AFM, XRD and 4-point-probe. The optimal condition was $120^{\circ}C$, 125W, 0.4Pa, 30sccm (Ar) and $350^{\circ}C$, 20min. annealing. At that condition the resistivity of Al-Zr(0.9%wt.) is about 4$\mu\Omega$cm.

• 한국재료학회지
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• 제17권4호
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• pp.227-231
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• 2007

Transparent conducting indium tin oxide (ITO) films were deposited onto the Polyethersulfone (PES) substrate by using a magnetron sputter type negative metal ion source. In order to investigate the influence of cesium (Cs) partial pressure during deposition and annealing temperature on the optoelectrical properties of ITO/PES film the films were deposited under different Cs partial pressures and post deposition annealed under different annealing temperature from $100^{\circ}C$ to $170^{\circ}C$ for 20 min at $3\;{\times}\;10^{-1}$ Pa. Optoeleetrical properties of ITO films deposited without intentional substrate heating was influenced strongly by the Cs partial pressure and the Cs partial pressure of $1.5\;{\times}\;10^{-3}$ Pa was characterized as an optimal Cs flow condition. By increasing post-deposition vacuum annealing temperature both optical transmission in visible light region and electrical conductivity of ITO films were increased. Atomic force microscopy (AFM) micrographs showed that the surface roughness also varied with post-deposition vacuum annealing temperature.

• Journal of Welding and Joining
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• 제23권6호
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• pp.77-86
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• 2005

Low temperature bonding of the silicon and glass using the Spin-on Glass (SOG) has been conducted experimentally to figure out the effects of the SOG solution composition and process variables on bond strength using the Design of Experiment method. In order to achieve the high quality bond interface without rack, sufficient reaction time of the optimal SOG solution composition is needed along with proper pressure and annealing temperature. The shear strength under the optimal SOG solution composition and process condition was higher than that of conventional anodic bonding and similar to that of wafer direct bonding.

• 한국수소및신에너지학회논문집
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• 제8권1호
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• pp.11-21
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• 1997

$ZrV_{0.7}Mn_{0.5}Ni_{1.2}$ alloy is attractive for anode material in Ni/MH secondary battery because of its large hydrogen storage capacity in gas-solid reaction and long cycling durability in KOH electrolyte. In this work, in order to further improve the discharge performance of this alloy electrode, the alloy was annealed by optimal condition which is for 12 hours at $1000^{\circ}C$. The alloy annealed under optimal condition had higher rate capability and discharge capacity than as-cast one. The microstructure of the as-cast and annealed alloy was investigated by scanning electron microscopy and energy dispersive spectroscopy. Ni content in the matrix was increased, being this homogenized after annealing. Additionally, The measurement of the surface area by B.E.T. analysis showed that there was little difference as-cast and annealed alloy. Therefore, improvement in the rate capability of the annealed alloy is due to increase of Ni content in the matrix.

• 한국방재학회:학술대회논문집
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• 한국방재학회 2008년도 정기총회 및 학술발표대회
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• pp.815-818
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• 2008

Titanium was oxidized with oxygen plasma and calcinated with rapid thermal annealing for degradation of humic acid dissolved in water. Titania photocatalytic plate was produced by titanium surface oxidized with oxygen plasma by Plasma Enhanced Chemical Vapor Deposition(PECVD). RF-power and deposition condition is controlled under 100 W, 150 W, 300 W and 500 W. Treatment time was controlled by 5 min and 10 min. The film properties were evaluated by the X-ray Photoelectron Spectroscopy (XPS) and X-Ray Diffraction (XRD). From the experimental results, we found the optimal condition of titania film which exhibited good performance. Moreover photocatalytic capacity was about twice better than thermal spray titania film, and also as good as titania powder.

• E2M - 전기 전자와 첨단 소재
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• 제7권2호
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• pp.117-122
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• 1994

The role of ZnS buffer layer not only suppresses chemical reactions between emission material and insulating material but also alters the luminescence and the crystallinity of the emission layer, if ZnS buffer layer was sandwiched between emission layer and insulating layer of electroluminescent device. In this research, we fabricated ZnS thin film with rf magnetron sputter system by varying rf power 100, 200W, substrate temperature 100, 150, 200, 250.deg. C and post-annealing temperature 200, 300, 400, 500.deg. C and analysed X-ray diffraction pattern, transmission spectra and cross section by SEM photograph for seeking the optimal crystallization condition of ZnS buffer layer. As a result, increasing the rf power, the crystallinity of ZnS thin film was improved. It was found that the ZnS thin film had better properties than anything else when fabricated with the following conditions ; rf power 200W, substrate temperature 150.deg. C, and post-annealing temperature 400.deg. C. ZnS thin film had the transmittance more than 80% in visible range. So it is suitable to use as a buffer layer of electroluminescent devices.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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• pp.844-847
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• 1997

In this paper, scheduling problem is dealt for the minimization of due date penalty for the customer order. Multiproduct batch processes have been dealt with for their suitability for high value added low volume products. Their scheduling problems take minimization of process operation for objective function, which is not enough to meet the customer satisfaction and the process efficiency simultaneously because of increasing requirement of fast adaptation for rapid changing market condition. So new target function has been suggested by other researches to meet two goals. Penalty function minimization is one of them. To present more precisely production scheduling, we develop new scheduling model with penalty function of earliness and tardiness We can find many real cases that penalty parameters are divergent by the difference between the completion time of operation and due date. That is to say, the penalty parameter values for the product change by the customer demand condition. If the order charges different value for due date, we can solve it with the due date period. The period means the time scope where penalty parameter value is 0. If we make use of the due date period, the optimal sequence of our model is not always same with that of fixed due date point. And if every product have due date period, due date of them are overlapped which needs optimization for the maximum profit and minimum penalty. Due date period extension can be enlarged to makespan minimization if every product has the same abundant due date period and same penalty parameter. We solve this new scheduling model by simulated annealing method. We also develop the program, which can calculate the optimal sequence and display the Gantt chart showing the unit progress and time allocation only with processing data.