• Composites Research
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• 제18권4호
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• pp.1-7
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• 2005

삽입된 광섬유 브래그 격자(fiber Bragg grating, FBG) 센서를 이용하여 수압시험 동안에 필라멘트 와인딩 된 복합재료 압력탱크의 실시간 구조 건전성 모니터링을 수행하였다. 일반적으로 압력탱크의 내부와 외부의 유한요소해석 결과는 변형률과 응력 모두 큰 차이를 보인다. 그러므로, 압력탱크의 건전성을 검증하기 위해서는 운용 중 탱크 내부의 변형률 값을 정확하게 측정해야 한다. 여러 광섬유 센서 중 FBG 센서는 변형률 게이지에 비해 구조물에 삽입이 용이하고 많은 수의 센서를 한 가닥의 광섬유에 파장 분할 다중화(wavelength division multiplexing, WDM) 기법을 통해 쉽게 다중화 할 수 있다. 본 연구에서는 다중화 된 FBG 센서를 삽입한 표준압력용기(standard testing and evaluation bottle, STEB)를 제작하고 수압시험을 수행하였다. 삽입된 센서의 생존율을 높이기 위해 격자 부분에 대한 보강법을 포함한 새로운 삽입 적용 기법을 고안하였다. 제작된 탱크에 대한 수압 시험을 통해 FBG 센서가 필라멘트 와인딩 된 복합재 압력탱크의 건전성 모니터링을 위해 성공적으로 삽입 적용될 수 있음을 확인하였다.

• 센서학회지
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• 제10권6호
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• pp.304-309
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• 2001

콘크리트 구조물의 내부 변형률을 측정할 수 있는 광섬유 간섭계 센서가 개발되어졌다. 광섬유 간섭계 센서는 11 mm 길이의 광섬유 Fabry-Perot 간섭계를 2 mm 지름의 스텐레스 강관 내부에 접착제로 고정하여 만들었다. 제작된 변형률 센서들은 $100{\times}100{\times}500\;mm^3$ 크기의 콘크리트 구조물 내부에 삽입되어 외부에서 구조물에 압력을 인가했을 때 구조물 내부의 변형률을 측정하였다. 센서들의 출력은 변형률 변화에 따라 선형적으로 변화하였다. 이를 바탕으로 실제 교량에 적용하여 변형률 센서의 광출력 특성을 살펴본 결과 우수한 변형 감지 특성을 보였으며, 실제 구조물에서 원거리측정에 이용도 가능하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.29-33
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• 2000

MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than ＄9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2003년도 춘계학술발표대회 논문집
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• pp.31-36
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• 2003

Recently, composite materials are widely used for nozzle, pressure vessel, skins of satellite and many structures under condition of high temperature due to good thermal characteristics such as low CTE, heat-resistance, etc. Fiber optic sensors, especially FBG(fiber Bragg grating) sensors, can be a good counterproposal of strain gages for the measurement of material properties of composites under high temperature. In this research, T700/Epoxy specimens with embedded FBG sensors were fabricated and tested at the Instron with thermal chamber from room temperature to $400^{\circ}C$. The effects of embedding optical fiber on material properties were also verified. And, the experimental results were discussed and analyzed by microphotographs of the composite specimen.

• Current Optics and Photonics
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• 제4권4호
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• pp.293-301
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• 2020

In this paper we propose and theoretically analyze a monolithic multiparametric sensor consisting of a superstructure of surface-relief waveguide Bragg gratings (WBGs), a micro-machined diaphragm, and a cantilever beam. Diaphragms of two different configurations, namely circular and square, are designed and analyzed separately for pressure measurement. The square diaphragm is then selected for further study, since it shows relatively higher sensitivity compared to the circular one, as it incurs more induced stress when any pressure is applied. The cantilever beam with a proof mass is designed to enhance the sensitivity for acceleration measurement. A unique mathematical method using coupled-mode theory and the transfer-matrix method is developed to design and analyze the shift in the Bragg wavelength of the superstructure configuration of the gratings, due to simultaneously applied pressure and acceleration. The effect of temperature on the wavelength shift is compensated by introducing another Bragg grating in the superstructure configuration. The measured sensitivities for pressure and acceleration are found to be 0.21 pm/Pa and 6.49 nm/g respectively.

• Composites Research
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• 제19권3호
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• pp.43-49
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• 2006

In this paper, a long gauge Fiber Bragg Grating (FBG) sensor system is described and long gauge FBGs are well-suited for measuring the upper parts of the bridge piers under the extremely severe movement conditions. In the experiments, we used more than 30m long FBG sensors to measure the movement of top part of the bridge piers which are separated from the main bridge by cutting the decks. With the actuator, the deck and girders were pushed and released. We checked the movement of the top of the pier while releasing the pressure of the actuator with the long gauge fiber sensor. In order to measure the movement of the upper part of the pier, the reference point must be outside of the pier. Using the optical fiber sensors, one end of the sensor is attached to the top of the pier and the other end is attached to the bottom of the next pier. The fiber sensors showed good response to the release loading and we could calculate the movement of the top part of the pear.

• 센서학회지
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• 제5권4호
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• pp.1-7
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• 1996

실리콘 미세가공 기술로 약 $0.6{\mu}m$ 두께의 150 nm-$Si_{3}N_{4}$/300 nm-$SiO_{2}$/150 nm-$Si_{3}N_{4}$ 다이아프레임을 실리콘 기판위에 형성하고, 이것과 광섬유를 결합하여 광강도형 압력센서를 제작하였다. 센서의 광원에서 사용하는 파장인 $1.3\;{\mu}m$ 근방에서 다이아프레임의 광투과도는 약 50 %였으나, 다이아프레임에 약 $1,000\;{\AA}$의 금(Au)을 증착하여 다이아프레임의 광투과도를 수 %정도로 감소시킬 수 있어서 이 다이아프레임을 센서의 광반사막으로 사용할 수 있었다. 다이아프레임의 크기를 $3{\times}3\;mm^{2}$, $4{\times}4\;mm^{2}$ 및 $5{\times}5\;mm^{2}$로 각각 변화시켜 제작한 센서에서, 센서의 광출력은 $0{\sim}77\;torr$의 측정압력범위에서 인가하는 압력을 중가 시킴에 따라 각각 선형적으로 감소하였으며, 이들 센서의 압력감도는 각각 0.52 nW/torr, 0.65 nW/torr 및 0.77 nW/torr로서 다이아프레임의 크기를 증가시킴에 따라 증가하였다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2002년도 ICCAS
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• pp.95.1-95
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• 2002

<1. New level meter inside the fuel tank> Ultrasound level sensors are widely applied as level meters of liquid tank. Measurement instrument of level between water and fuel is developed. Since the fuel is inflammable, the sensor system doesn't allow to include any electric circuit inside the fuel tank. The optical cable sensor can satisfy this explosive condition. The measurement method with ultrasonic sensor is attached on the tank wall or tank manhole lid. The pressure sensor can't be applied inside the gasoline fuel tank. An ultra-sonic sensor doesn't detect a enough signal reflected from water level deep under gasoline fuel. The pressure sensor is difficult to measure the height o...

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.126-126
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• 2009

Noninvasive plasma diagnostic technique is introduced to analyze and characterize HICP (Helmholtz Inductively Coupled Plasma) source during the plasma etching process. The HICP reactor generates plasma mainly through RF source power at 13.56MHz RF power and RF bias power of 12.56MHz is applied to the cathode to independently control ion density and ion energy. For noninvasive sensors, the RF sensor and the OES (Optical emission spectroscopy) were employed since it is possible to obtain both physical and chemical properties of the reactor with plasma etching. The plasma impedance and optical spectra were observed while altering process parameters such as pressure, gas flow, source and bias power during the poly silicon etching process. In this experiment, we have found that data measured from these noninvasive sensors can be correlated to etch results. In this paper, we discuss the relationship between process parameters and the measurement data from RF sensor and OES such as plasma impedance and optical spectra and using these relationships to analyze and characterize H-ICP source.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2007년도 추계학술대회 논문집
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• pp.100-103
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• 2007

A microlens array has been required to improve light conversion efficiency in image sensors. A microlens array can be usually fabricated by photoresist reflow, hot-embossing, micro injection molding, and UV-imprinting. Among these processes, a UV-imprinting, which is operated at room temperature with relatively low applied pressure, can be a desirable process to integrate microlens array on image sensors, because this process provides the components with low thermal expansion, enhanced stability, and low birefringence, furthermore, it is more suitable for mass production of high quality microlens array. In this study, to analyze the optical properties of the wafer scale microlens array integrated image sensor, another wafer scale simulated image sensor chip array was designed and fabricated. An aspherical square microlens was designed and integrated on a simulated image sensor chip array using a UV-imprinting process. Finally, the optical performances were measured and analyzed.