• Journal of the Korean Society of Industry Convergence
• /
• v.18 no.4
• /
• pp.241-249
• /
• 2015

The purpose of this research is to develop the pattern recognition algorithm based on smart camera for inspection automation, and including external surface state of molding parts or optical parts. By performance verification, this development can be applied to establish for existing reflex data because inputting surface badness degree of scratch's standard specification condition directly. And it is pdssible to distinguish from schedule error of badness product and normalcy product within schedule extent after calculating the error comparing actuality measurement reflex data and standard reflex data mutually. The proposed technology cab be applied to test for masearing of the smallest 10 pixel unit. It is illustrated the relibility pf proposed technology by an experiment.

• Proceedings of the KIEE Conference
• /
• 2007.10a
• /
• pp.333-334
• /
• 2007

We propose a path planning method to decrease a inspection lead time of line scan camera in SMT(surface mount technology) in-line system. The inspection window area of printed circuit board should be minimized to consider the FOV(field of view) of line scan camera so that line scan inspector is going to find a optimal solution of path planning. We propose one of the hierarchical clustrering algorithm for a given board. Comparative simulation results are presented to verify the usefulness of proposed method.

• Preventive Nutrition and Food Science
• /
• v.2 no.3
• /
• pp.269-279
• /
• 1997

Various nondestructive technologies for quality inspection of fruits and vegetables were reviewed through published literatures and selected agricultural databases. These technologies were grouped into nine categories, including acoustic response, dielectric response, machine vision, magnetic response, mechanical vibration response, microwave response, optical properties, and other possible sensing technologies. Their principles and characteristics were investigated and these technologies were presented with their current and potential applications. The link of appropriate nondestructive technologies with common principal quality parameters of fruits and vegetables was summarized.

• Journal of Korea Multimedia Society
• /
• v.24 no.8
• /
• pp.988-999
• /
• 2021

AOI (Automatic Optical Inspection) of PCB (Printed Circuit Board) is a very important step to guarantee the product performance. The process of registering components called teaching mode is first perform, and AOI is then carried out in a testing mode that checks defects, such as recognizing and comparing the component mounted on the PCB to the stored components. Since most of registration of the components on the PCB is done manually, it takes a lot of time and there are many problems caused by mistakes or misjudgement. In this paper, A components classifier is proposed using YOLO (You Only Look Once) v2's object detection model that can automatically register components in teaching modes to reduce dramatically time and mistakes. The network of YOLO is modified to classify small objects, and the number of anchor boxes was increased from 9 to 15 to classify various types and sizes. Experimental results show that the proposed method has a good performance with 99.86% accuracy.

• Journal of the Korea institute for structural maintenance and inspection
• /
• v.26 no.2
• /
• pp.68-75
• /
• 2022

In this study, in order to directly evaluate the prestress of the PSC structure, a new sensor module based on the measurement of the deformation of concrete was proposed using hetero-core optical fibers and performance tests were performed. In a hetero-core optical fiber, optical loss occurs when a specific part of the transmission path is bent, and the amount of optical loss changes linearly according to the magnitude of the curvature. In order to confirm the measurement performance of the sensor module and the applicability of the optical fiber, the sensor module was deformed and the light passing through the optical fiber was converted into wattage and measured. It can be seen that the light passing through the optical fiber has a linearity of 0.9333 in relation to the deformation while generating the maximum deformation of 0.5 mm at a rate of 0.12 mm/min in a cylindrical concrete specimen with a diameter of 15 cm and a height of 35 cm in which the sensor module is embedded. Based on the results of this experiment, it is judged that it is possible to directly evaluate the prestress of a PSC structure by embedding a sensor module using a hetero-core optical fiber in the structure and measuring the compression deformation in concrete. It is judged that it can be used as useful data for the development of a sheath tube integrated sensor module to be applied to be applied to the girder model experiment.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2005.11a
• /
• pp.149-152
• /
• 2005

In order to extend the life time of building and civil infra-structure, nowadays, patch type carbon sheets are widely used as repairing meterials. Repaired concrete columns and beams with carbon sheets gain their stiffness and strength, but they lose toughness and show brittle failure behaviors. Usually, the cracks of concrete structures are visible with naked eyes and the status of the structure in the life cycle is estimated with visible inspection. After repairing of the structure, crack visibility is blocked by repaired carbon sheets. Therefore, structural monitoring after repairing is indispensible and self diagnosis method with optical fiber sensor is very useful. In this paper, peel-out effects is detected with optical fiber sensors and the strain difference between main structure and repaired carbon sheets when they separate each other.

• Proceedings of the Optical Society of Korea Conference
• /
• 2009.10a
• /
• pp.300-301
• /
• 2009

In order to design a special illuminator required for an automated optical inspection system, distributions of illuminating angles and intensities of illuminating rays incident on a specimen surface are taken into consideration. This methodology is tried to optimize coaxial illuminating systems by using the specially-coded program.

• Current Optics and Photonics
• /
• v.7 no.2
• /
• pp.200-206
• /
• 2023

Near-infrared (NIR) sensing technology using CMOS image sensors is used in many applications, including automobiles, biological inspection, surveillance, and mobile devices. An intuitive way to improve NIR sensitivity is to thicken the light absorption layer (silicon). However, thickened silicon lacks NIR sensitivity and has other disadvantages, such as diminished optical performance (e.g. crosstalk) and difficulty in processing. In this paper, a pixel structure for NIR sensing using a stacked CMOS image sensor is introduced. There are two photodetection layers, a conventional layer and a bottom photodiode, in the stacked CMOS image sensor. The bottom photodiode is used as the NIR absorption layer. Therefore, the suggested pixel structure does not change the thickness of the conventional photodiode. To verify the suggested pixel structure, sensitivity was simulated using an optical simulator. As a result, the sensitivity was improved by a maximum of 130% and 160% at wavelengths of 850 nm and 940 nm, respectively, with a pixel size of 1.2 ㎛. Therefore, the proposed pixel structure is useful for NIR sensing without thickening the silicon.

• The Journal of the Korea Contents Association
• /
• v.6 no.6
• /
• pp.1-8
• /
• 2006

This paper presents an intelligent pattern matching method that can be used to acquire the reliable calibration data for automatic PCB pattern inspection. The inaccurate calibration data is often acquired by geometric pattern variations and selecting an inappropriate model manual. It makes low the confidence of inspection and also the inspection processing time has been delayed. In this paper, the geometric features of PCB patterns are utilized to calculate the accurate calibration data. An appropriate model is selected automatically based on the geometric features, and then the calibration data to be invariant to the geometric variations(translation, rotation, scaling) is calculated. The method can save the inspection time unnecessary by eliminating the need for manual model selection. As the result, it makes a fast, accurate and reliable inspection of PCB patterns.

• 제어로봇시스템학회:학술대회논문집
• /
• 2003.10a
• /
• pp.273-277
• /
• 2003

A general process of electronic assembly is composed of a series of geometric alignments and bonding/screwing processes. After assembly, the function is tested in a following process of inspection. However, assembly of micro-optic devices requires both processes to be performed in equipment. Coarse geometric alignment is made by using vision and optical function is improved by the following fine motion based on feedback of tunable laser interferometer. The general system is composed of a precision robot system for 3D assembly, a 3D vision guided system for geometric alignment and an optical feedback system with a tunable laser. In this study, we propose a new fast alignment algorithm of micro-optic devices for both of visual and optical alignments. The main goal is to find a fastest alignment process and algorithms with state-of-the-art technology. We propose a new approach with an optimal sequence of processes, a visual alignment algorithm and a search algorithm for an optimal optical alignment. A system is designed to show the effectiveness and efficiency of the proposed method.