• Title/Summary/Keyword: Optical emission spectroscopy

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Optical Emission Spectroscopy with Parameters During R.F. Discharge of BaTiO3 Target (BaTiO3 타겟의 R.F. 방전 중 변수에 따른 광반사분광 특성)

  • Park, Sang-Shik
    • Korean Journal of Materials Research
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    • v.21 no.9
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    • pp.509-514
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    • 2011
  • In this study, optical emission spectroscopy was used to monitor the plasma produced during the RF magnetron sputtering of a $BaTiO_3$ target. The intensities of chemical species were measured by real time monitoring with various discharge parameters such as RF power, pressure, and discharge gas. The emission lines of elemental and ionized species from $BaTiO_3$ and Ti targets were analyzed to evaluate the film composition and the optimized growth conditions for $BaTiO_3$ films. The emissions from Ar(I, II), Ba(I, II) and Ti(I) were found during sputtering of the $BaTiO_3$ target in Ar atmosphere. With increasing RF power, all the line intensities increased because the electron density increased with increasing RF power. When the Ar pressure increased, the Ba(II) and Ti(I) line intensity increased, but the $Ar^+$ line intensity decreased with increasing pressure. This result shows that high pressure is of greater benefit for the ionization of Ba than for that of Ar. Oxygen depressed the intensity of the plasma more than Ar did. When the Ar/$O_2$ ratio decreased, the intensity of Ba decreased more sharply than that of Ti. This result indicates that the plasma composition strongly depends on the discharge gas atmosphere. When the oxygen increased, the Ba/Ti ratio and the thickness of the films decreased. The emission spectra showed consistent variation with applied power to the Ti target during co-sputtering of the $BaTiO_3$ and Ti targets. The co-sputtered films showed a Ba/Ti ratio of 1.05 to 0.73 with applied power to the Ti target. The films with different Ba/Ti ratios showed changes in grain size. Ti excess films annealed at $600^{\circ}C$ did not show the second phase such as $BaTi_2O_5$ and $TiO_2$.

다양한 기체를 사용한 대기압 플라즈마 젯에 대한 세포 내 활성 산소종의 영향 연구

  • Jo, Hye-Min;Kim, Seon-Ja;Jeong, Tae-Hun;Im, Seon-Hui
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.542-542
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    • 2013
  • 저온 플라즈마를 발생시키는 대기압 마이크로-플라즈마 젯(Micro-plasma jet)을 이용하여 플라즈마와 세포와의 상호작용에 대한 연구를 진행하였다. 세포의 대사과정에서 생성되는 활성산소 종(Reactive Oxygen Species, ROS)은 세포에 산화 스트레스를 유발시킨다. 이러한 스트레스는 세포 예정사(programmed cell death)의 원인이 된다. 플라즈마 형성 기체로 헬륨, 아르곤, 질소를 사용하여 각각의 기체에 따른 세포의 형태 변화 및 세포 내 활성 산소 종의 영향을 분석하였다. 실험에 사용된 세포는 인체의 폐암 세포[Human lung cancer cell, A549]이며 플라즈마 처리 후 Intracellular ROS assay를 통하여 플라즈마에서 발생되는 활성 산소 종(Reactive Oxygen Species, ROS)이 세포 내에 들어가 활성 산소 종을 증가시키는 것을 확인하였다. 이때, 플라즈마에서 발생되는 활성 산소 종(Reactive Oxygen Species, ROS)들은 광 방출 스펙트럼(Optical Emission Spectroscopy)로 분석하였고, 기체별로 비교하여 보았다. 또한, 이 때 발생되는 플라즈마의 전류-전압 특성에 따른 optical intensity를 비교하였다.

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Gas Temperature Measurement in Supersonic Flows by N2+ Emission Spectroscopy (질소 이온 발광 분광법을 이용한 초음속 유동의 기체 온도 측정)

  • Shin, Ji-Chul
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.34 no.3
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    • pp.245-250
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    • 2010
  • The procedure for estimating the gas (rotational) temperature of an air discharge in supersonic flows is presented in detail. Since direct measurement of the temperature in a supersonic flow is difficult, a nonintrusive measurement was performed by optical emission spectroscopy based on the emission spectra of nitrogen molecular ions. A detailed explanation, including the equations for emission line intensity, is presented in order to understand the structure of the emission spectra of nitrogen molecular ions. Using the obtained representation for emission spectrum, a synthetic spectrum of the first negative system of $N_2^+$ is obtained, and it is compared with the experimentally measured spectrum. Within a relative error of approximately 6.8% for the overall band spectra, the synthetic and measured spectra agree well. In the case of a 25-mA DC air discharge in a supersonic (Mach 3) flow, the gas temperature profile shows an approximately linear variation and a peak temperature of approximately 350 K.

OES based PECVD Process Monitoring Accuracy Improvement by IR Background Signal Subtraction from Emission Signal (적외선 배경신호 처리를 통한 OES 기반 PECVD공정 모니터링 정확도 개선)

  • Lee, Jin Young;Seo, Seok Jun;Kim, Dae-Woong;Hur, Min;Lee, Jae-Ok;Kang, Woo Seok
    • Journal of the Semiconductor & Display Technology
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    • v.18 no.1
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    • pp.5-9
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    • 2019
  • Optical emission spectroscopy is used to identify chemical species and monitor the changes of process results during the plasma process. However, plasma process monitoring or fault detection by using emission signal variation monitoring is vulnerable to background signal fluctuations. IR heaters are used in semiconductor manufacturing chambers where high temperature uniformity and fast response are required. During the process, the IR lamp output fluctuates to maintain a stable process temperature. This IR signal fluctuation reacts as a background signal fluctuation to the spectrometer. In this research, we evaluate the effect of infrared background signal fluctuation on plasma process monitoring and improve the plasma process monitoring accuracy by using simple infrared background signal subtraction method. The effect of infrared background signal fluctuation on plasma process monitoring was evaluated on $SiO_2$ PECVD process. Comparing the $SiO_2$ film thickness and the measured emission line intensity from the by-product molecules, the effect of infrared background signal on plasma process monitoring and the necessity of background signal subtraction method were confirmed.

Measurement of Hydroxyl Radical Density at Bio-Solutions Generated from the Atmospheric Pressure Non-Thermal Plasma Jet

  • Kim, Yong Hee;Hong, Young June;Uhm, Han Sub;Choi, Eun Ha
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.494-494
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    • 2013
  • Atmospheric pressure non-thermal plasma of the needle-typed interaction with aqueous solutions has received increasing attention for their biomedical applications [1]. In this context, surface discharges at bio-solutions were investigated experimentally. We have generated the non-thermal plasma jet bombarding the bio-solution surface by using an Ar gas flow and investigated the emission lines by OES (optical emission spectroscopy) [2]. Moreover, The non-thermal plasma interaction with bio-solutions has received increasing attention for their biomedical applications. So we researched, the OH radical density of various biological solutions in the surface by non-thermal plasma were investigated by Ar gases. The OH radical density of DI water; deionized water, DMEM Dulbecco's modified eagle medium, and PBS; 1x phosphate buffered saline by non-thermal plasma jet. It is noted that the OH radical density of DI water and DMEM are measured to be about $4.33{\times}1016cm-3$ and $2.18{\times}1016cm-3$, respectively, under Ar gas flow 250 sccm (standard cubic centimeter per minute) in this experiment. The OH radical density of buffer solution such as PBS has also been investigated and measured to be value of about $2.18{\times}1016cm-3$ by the ultraviolet optical absorption spectroscopy.

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Fault Detection of Plasma Etching Processes with OES and Impedance at CCP Etcher

  • Choi, Sang-Hyuk;Jang, Hae-Gyu;Chae, Hee-Yeop
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.257-257
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    • 2012
  • Fault detection was carried out in a etcher of capacitive coupled plasma with OES (Optical Emission Spectroscopy) and impedance by VI probe that are widely used for process control and monitoring at semiconductor industry. The experiment was operated at conventional Ar and Fluorocarbon plasma with variable change such as pressure and addition of N2 and O2 to assume atmospheric leak, RF power and pressure that are highly possible to impact wafer yield during wafer process, in order to observe OES and VI Probe signals. The sensitivity change on OES and Impedance by VI probe was analyzed by statistical method including PCA to determine healthy of process. The main goal of this study is to find feasibility and limitation of OES and Impedances for fault detection by shift of plasma characteristics and to enhance capability of fault detection using PCA.

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PECVD Chamber Cleaning End Point Detection (EPD) Using Optical Emission Spectroscopy Data

  • Lee, Ho Jae;Seo, Dongsun;Hong, Sang Jeen;May, Gary S.
    • Transactions on Electrical and Electronic Materials
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    • v.14 no.5
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    • pp.254-257
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    • 2013
  • In-situ optical emission spectroscopy (OES) is employed for PECVD chamber monitoring. OES is used as an addon sensor to monitoring and cleaning end point detection (EPD). On monitoring plasma chemistry using OES, the process gas and by-product gas are simultaneously monitored. Principal component analysis (PCA) enhances the capability of end point detection using OES data. Through chamber cleaning monitoring using OES, cleaning time is reduced by 53%, in general. Therefore, the gas usage of fluorine is also reduced, so satisfying Green Fab challenge in semiconductor manufacturing.

Real time monitoring of plasma processing equipment using optical emission spectroscopy and neural network (광반사분광기와 신경망을 이용한 플라즈마 공정장비의 실시간 감시)

  • Kim, Dae-Hyun;Kim, Byung-Whan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.369-369
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    • 2010
  • 소자제조 공정의 질과 생산성을 향상시키기 위하여 플라즈마 감시가 필요하다. 본 연구에서는 광반사분광기(Optical Emission Spectroscopy)를 이용하여 소스전력의 변화에 따른 플라즈마 상태 데이터를 수집하였다. 수집된 데이터를 이용한 시계열 신경망 감시 모델을 개발하였으며, 개발된 모델과 CUSUM(Cumulative Sum Control Chart)를 결합하여 플라즈마의 이상 상태를 실시간으로 감시하는 기법을 개발하였다. 매우 우수한 감시 성능을 확인할 수 있었다.

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Non-Invasive Plasma Monitoring Tools and Multivariate Analysis Techniques for Sensitivity Improvement

  • Jang, Haegyu;Lee, Hak-Seung;Lee, Honyoung;Chae, Heeyeop
    • Applied Science and Convergence Technology
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    • v.23 no.6
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    • pp.328-339
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    • 2014
  • In this article, plasma monitoring tools and mulivariate analysis techniques were reviewed. Optical emission spectroscopy was reviewed for a chemical composition analysis tool and RF V-I probe for a physical analysis tool for plasma monitoring. Multivariate analysis techniques are discussed to the sensitivity improvement. Principal component analysis (PCA) is one of the widely adopted multivariate analysis techniques and its application to end-point detection of plasma etching process is discussed.