• Journal of the Korean Society for Precision Engineering
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• v.20 no.6
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• pp.96-104
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• 2003

This paper presents the measurement and correction method of PCB alignment errors for PCB screen printer. Electronic equipment is getting smaller and yet must satisfy high performance standard. Therefore, there is a great demand for PCB with high density. However conventional PCB screen printer doesn't have enough accuracy to accommodate the demand for high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because the alignment errors of PCB occur when it is loaded to the screen printer. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors with high-accuracy. An automatic optical inspection part measures the PCB alignment errors using machine vision, and the high-accuracy 3-axis stage makes correction for these errors. This system used two CCD cameras to get images of two fiducial marks of PCB. The centers of fiducial marks are obtained by using moment, gradient method. The first method is calculating the centroid by using first moment of blob, and the latter method is calculating the center of the circle whose equation is obtained by curve-fitting the boundaries of fiducial mark. The operating system used to implement the whole set-up is carried in Window 98 (or NT) environment. Finally we implemented this system to PCB screen printer.

• Optical Science and Technology
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• v.9 no.3
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• pp.14-22
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• 2005

• Polymer Science and Technology
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• v.21 no.1
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• pp.3-9
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• 2010

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.24 no.12
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• pp.57-63
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• 2010

The efficiency of LED package is increasing by applying the high power, and a existing lighting is changing as the LED lighting. However, many problems have appeared by heat. Therefore, in order to solve thermal problems, LED lighting is designing in several ways, but the advantages of LED lighting is fading due to increase the prices and volumes. In this study, we try to improve the thermal performance by formation of via holes. The junction temperature and thermal resistance in the FR4-PCB with via-holes of 0.6[mm] was excellent in experiment and FR4-PCB with Via-holes of 0.6[mm] was excellent in simulation without solder. Further, the thermal resistance and the optical properties can be improved through a formation of via-holes.

• Proceedings of the KIEE Conference
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• 2006.07a
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• pp.609-610
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• 2006

As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

• Proceedings of the KIEE Conference
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• 2006.07d
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• pp.2241-2242
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• 2006

As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

• International Journal of Control, Automation, and Systems
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• v.4 no.1
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• pp.96-104
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• 2006

We propose a path planning method to improve the productivity of AOI (automated optical inspection) machines in PCB (printed circuit board) assembly lines. The path-planning problem is the optimization problem of finding inspection clusters and the visiting sequence of cameras to minimize the overall working time. A unified method is newly proposed to determine the inspection clusters and visiting sequence simultaneously. We apply a hybrid genetic algorithm to solve the highly complicated optimization problem. Comparative simulation results are presented to verify the usefulness of the proposed method.

• Proceedings of the KIEE Conference
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• 2006.07b
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• pp.1275-1276
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• 2006

As developing the information society, Lighting Emitted diode(LED) which is light source for illumination of next generation is attracted public attention. LED have many problem as narrow light view angle, high price, drift phenomenon of color coordinate, high heating problem for lower power, lower weight and small size. So, many researches have continued in a illumination as LED module type. in this problem, heating problem is very important and difficult and that is caused in decreasing phenomenon of brightness and drift phenomenon of color coordinate. so the problem of heating is urgent question for illumination of LED. In this paper, structural design of PCB changed as two type for solving the heating problem. also the properties of heating is analysed and optical properties is measured with heating image camera and spectrometer according to change in this design.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.109.2-109
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• 2001

In the PCB assembly lines, as components become more complex and smaller, the conventional inspection method using traditional ICT and function test show their limitations in application. The automatic optical inspection(AOI) gradually becomes the alternative in the PCB assembly line. In Particular, the PCB inspection machines need more reliable and flexible object recognition algorithms for high inspection accuracy. The conventional AOI machines use the algorithmic approaches such as template matching, Fourier analysis, edge analysis, geometric feature recognition or optical character recognition (OCR), which mostly require much of teaching time and expertise of human operators. To solve this problem, in this paper, a statistical learning based part recognition method is proposed. The performance of the ...

• Journal of KSNVE
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• v.8 no.4
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• pp.643-653
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• 1998

The sub-resonance modes can be easily excited by the assembling tolerance in the asymmetric type optical pick-up actuators, compared with the symmetric type. In this paper, we propose the novel method for reducing the vibration due to the sub-resonance modes whose amplitude can be decreased by adding the damper and increasing the flexibility of holder PCB. Using the finite element method, the change of mode shapes is investigated as the shape of holder PCB is modified. Experimental results support that the propopsed method reduces remarkably the vibration of sub-resonance modes of the optical pick-up actuator.