• Design & Manufacturing
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• 제15권4호
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• pp.65-71
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• 2021

In the early days of laser invention, it was simply used as a measuring tool, but as lasers became more common, they became an indispensable processing tool in the industry. Short-wavelength lasers are used to make patterns on wafers used in semiconductors depending on the wavelength, such as CO2 laser, YAG laser, green laser, and UV laser. At first, the hole of the PCB board mainly used for electronic parts was not thin and the hole size was large, so a mechanical drill was used. However, in order to realize product miniaturization and high integration, small hole processing lasers have become essential, and pattern exposure for small hole sizes has become essential. This paper intends to analyze the characteristics through patterns by exposing the PCB substrate through DMD and polygon scanner, which are different optical systems. Since the optical systems are different, the size of the patterns was made the same, and exposure was performed under the optimal conditions for each system. Pattern characteristics were analyzed through a 3D profiler. As a result of the analysis, there was no significant difference in line width between the two systems. However, it was confirmed that dmd had better pattern precision and polygon scanner had better productivity.

• 한국생산제조학회지
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• 제25권3호
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• pp.230-236
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• 2016

This research attempted simplifications to the LED street light for price competitiveness. The street light was simplified by replacing the SMPS with an IC driver on the PCB using an AC-type LED. The optical element that shape of a line-shaped lens covered LED crowded. Thus, this study aims to improve LED efficiency by using the minimum optical system. In order to satisfy the M3 regulation of street lighting at grade, the lens was divided into two parts depending on the forward direction of the light. Further, the changes in the number of LEDs located on part 1 and part 2 of the lens were analyzed. Through simulation, we determined the proper light distribution that meets M3 regulation of street lighting.

• 제어로봇시스템학회논문지
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• 제16권7호
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• pp.695-702
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• 2010

This paper presents an image alignment algorithm for application of AOI (Automatic Optical Inspection) based on SIFT. Since the correspondences result using SIFT descriptor have many wrong points for aligning, this paper modified and classified those points by five measures called the CCFMR (Cascade Classifier for False Matching Reduction) After reduced the false matching, rotation and translation are estimated by point selection method. Experimental results show that the proposed method has fewer fail matching in comparison to commercial software MIL 8.0, and specially, less than twice with the well-controlled environment’s data sets (such as AOI system). The rotation and translation accuracy is robust than MIL in the noise data sets, but the errors are higher than in a rotation variation data sets although that also meaningful result in the practical system. In addition to, the computational time consumed by the proposed method is four times shorter than that by MIL which increases linearly according to noise.

• International Journal of Precision Engineering and Manufacturing
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• 제4권1호
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• pp.23-29
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• 2003

Stencil is used normally as a mask for solder pasting on pad of a printed circuit board (PCB). The objective of this study is to develop a stencil cutting system and determine the optimal conditions to make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse duration on the cut edge quality were investigated. In order to analyze the cut surface characteristics (roughness, kerfwidth, dross) optical microscopy, SEM microscopy and roughness measurements were used. As a result, the optimal conditions of cutting process parameters were determined, and the practical feasibility of the proposed system was also examined by using a commercial Gerber file for PCB stencil manufacturing.

• 조명전기설비학회논문지
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• 제23권8호
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• pp.8-13
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• 2009

LED 광원 기술의 발전과 더불어 응용분야도 다양하게 넓어지고 있다. 이중 본 논문에서는 액정 후면 배광 장치와 같이 고성능의 광원이 요구되는 응용제품에 적합한 광원을 제작하였다. 논문에서 제안한 광원은 금속산화물 절연층을 이용하여 LED chip에서 발생한 열을 효율적으로 외부로 전달하는 구조를 적용하였으며 패키지 구조가 아닌 chip과의 접촉면에 반사컵 구조를 적용하여 배광 분포 제어와 광자 재흡수 특성을 개선하였다.

• 한국재료학회지
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• 제19권3호
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• pp.151-155
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• 2009

Micro-scale copper bumps for build-up PCB were electroplated using a pulse-reverse method. The effects of the current density, pulse-reverse ratio and brightener concentration of the electroplating process were investigated and optimized for suitable performance. The electroplated micro-bumps were characterized using various analytical tools, including an optical microscope, a scanning electron microscope and an atomic force microscope. Surface analysis results showed that the electroplating uniformity was viable in a current density range of 1.4-3.0 A/$dm^2$ at a pulse-reverse ratio of 1. To investigate the brightener concentration on the electroplating properties, the current density value was fixed at 3.0 A/$dm^2$ as a dense microstructure was achieved at this current density. The brightener concentration was varied from 0.05 to 0.3 ml/L to study the effect of the concentration. The optimum concentration for micro-bump electroplating was found to be 0.05 ml/L based on the examination of the electroplating properties of the bump shape, roughness and grain size.

• 한국콘텐츠학회논문지
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• 제6권6호
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• pp.1-8
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• 2006

본 연구에서는 인쇄회로기판을 위한 자동 광학 검사시스템에서 핵심적인 기능인 보정 데이타 산출을 위한 기하학적 특징 기반 방법을 제안하였다. 현재 적용되고 있는 자동 광학 검사 시스템에서는 보정데이타 산출을 위해 작업자가 직접 수작업으로 모델을 설정하고 있고, 검사영상에 기하학적인 변화가 있는 경우 비검사영역이 생기는 등 문제가 발생되고 있다. 이는 검사 작업의 신뢰성에 영향을 미치게 됨은 물론 검사 처리 시간을 지연시키는 요인이 된다. 제안된 방법은 주어진 PCB 영상으로부터 기하학적인 모양이 적합한 모델을 자동으로 선정할 수 있고, 기하학적인 모델 매칭 기법을 통해 신뢰성 있는 보정데이타를 산출할 수 있다. 제안된 방법의 사용으로 검사 시스템을 보다 편리하게 사용할 수 있고, 수작업에 의한 모델설정으로 발생되는 불필요한 시간을 절약할 수 있다. 또한, 기하학적인 변화량에 관계없이 보정데이타 산출이 가능하고, 잘못된 모델 선정 등 부정확한 보정데이터의 사용시 발생되는 문제점을 해결할 수 있는 장점을 갖는다.

• 대한기계학회논문집A
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• 제36권2호
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• pp.217-221
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• 2012

노트북용 액정 모듈 내부의 광학 시트(Optical Sheet) 변형에 기인한 시인성 품질 불량을 개선하기 위한 기초 연구의 일환으로 변형 유발의 요인인 온도 및 습도의 영향을 분석할 수 있는 측정 시스템이 필요하였다. 액정 모듈 내부에는 0.5mm 미만의 미세한 공기 층이 존재하는데, 이 공간으로 외부의 습한 공기가 내부로 확산되는 것으로 추정된다. 이러한 현상을 규명하기 위하여 초소형 온도 및 습도 센서를 실장한 초박형 센서 PCB 를 액정 모듈 내부에 삽입하여 실시간으로 온/습도 변화를 측정 및 분석하였으며, 향후 변형 거동 시뮬레이션 및 구조 설계 시 필요한 기초 데이터로 활용하고자 한다.

• ETRI Journal
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• 제35권1호
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• pp.1-6
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• 2013

In this paper, we present an implemented serial 40-Gb/s receiver optical subassembly (ROSA) module by employing a proposed TO-CAN package and flexible printed circuit board (FPCB). The TO-CAN package employs an L-shaped metal support to provide a straight line signal path between the TO-CAN package and the FPCB. In addition, the FPCB incorporates a signal line with an open stub to alleviate signal distortion owing to an impedance mismatch generated from the soldering pad attached to the main circuit board. The receiver sensitivity of the ROSA module measures below -9 dBm for 40 Gb/s at an extinction ratio of 7 dB and a bit error rate of $10^{-12}$.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2003년도 춘계학술대회논문집
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• pp.979-984
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• 2003

A Dynamic vibration absorber(DVA) is developed to reduce the excessive vibration of an optical disk drive(ODD) originated from the deriving range of an wobble disk and unbalanced disk. We design the material properties and shapes of the DVA by simulating Frequency response function(FRF) such as target frequency, mass of the DVA, stiffness of damper, damping coefficient, shape and dimension, analyze dynamic characteristics and provide its design guide line for suppressing the vibration of an optical disk derive. To examine the performance of the DVA, the vibration of the feeding system with DVA and without DAA are measured by using a three-axis accelerometer, PCB derive and Pulse analyzer. The result show that the proposed DVA reduces the vibration of wide range in ODD.