• Journal of Advanced Marine Engineering and Technology
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• v.28 no.1
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• pp.46-55
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• 2004

Thermal characteristics of the various cooling methods in electronic equipment are studied numerically. A common chip cooling system is modeled as a parallel channel with protruding heat sources. A two-dimensional model has been developed for the numerical analysis of compressible. viscous. laminar flow. and conjugate heat transfer between parallel plates with uniform block heat sources. The finite volume method is used to solve this problem. The assembly consists of two channels formed by two covers and one printed circuit board that is assumed to have three uniform heat source blocks. Various cooling methods are considered to find out the efficient cooling method in a given geometry and heat sources. The velocity and the temperature fields. the local temperature distribution along the surface of blocks. and the maximum temperature in each block are obtained. The results are compared to examine the thermal characteristics of the different cooling methods both quantitatively and qualitatively.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.11
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• pp.1637-1644
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• 2003

Stereoscopic particle image velocimetry is a measurement technique to acquire three dimensional velocity field by two cameras. With a laser sheet illumination, the third velocity component can be deduced from out-of$.$plane velocity components using a stereoscopic matching method. Most industrial fluid flows are three dimensional turbulent flows, so it is necessary to use the stereoscopic PIV measurement method. However the existing stereoscopic PIV system seems hard to use since it is very expensive and complex. In this study we have developed a Miniature Stereo-PIV(MSPIV) system based on the concept of the Miniature PIV system which we have already developed. In this paper, we address the design and some primitive experimental results of the Miniature Stereo-PIV system. The Miniature Stereo-PIV system features relatively modest performances, but is considerably smaller, cheaper and easy to handle. The proposed Miniature Stereo-PIV system uses two one-chip-only CMOS cameras with digital output. Only two other chips are needed, one for a buffer memory and one for an interfacing logic that controls the system. Images are transferred to a personal computer (PC) via its standard parallel port. No extra hardware is required (in particular, no frame grabber board is needed).

• Proceedings of the KSME Conference
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• 2002.08a
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• pp.517-520
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• 2002

Stereoscopic particle image velocimetry is a measurement technique to acquire of three dimensional velocity field by two cameras. With a laser sheet illumination, the third velocity component can be deduced by out-of-plane velocity components using a stereoscopic matching method. Industrial fluid flows are almost three dimensional turbulent flows, so it is necessary to use the stereoscopic PIV measurement method. However the existing stereoscopic PIV system seems hard to use since it is very expensive and complex. In this study we have developed a Stereoscopic Miniature PIV(MPIV) system based on the concept of the Miniature PIV system which we have already developed. In this paper, we address the design and some first experimental results of the stereoscopic PIV system. The Stereoscopic MPIV system features relatively modest performances, but is considerably smaller, cheaper and easy to handle. The proposed Stereoscopic MPIV system uses two one-chip-only CMOS cameras with digital output. Only two other chips are needed, one for a buffer memory and one for an interfacing logic that controls the system. Images are transferred to a personal computer (PC) via its standard parallel port. No extra hardware is required (in particular, no frame grabber board is needed).

• Journal of Mechanical Science and Technology
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• v.15 no.12
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• pp.1775-1783
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• 2001

For two decades, there has been an active research to enhance the performances of Particle Image Velocimetry (PIV) systems. However, the resulting systems are somewhat very costly, cumbersome and delicate. In this paper, we address the design and some first experimental results of a PIV system belonging to the opposite paradigm. The Miniature PIV or MPIV system feature relatively modest performances, but is considerably smaller (out MPIV could hold in dia. 40 mm$\times$120 mm), cheaper (out MPIV total cost is less than $500) and easy to handle. Potential applications include industrial velocity sensors. The proposed MPIV system uses a one-chip-only CMOS camera with digital output. Only two other chips are needed, one for a buffer memory and one for an interfacing logic that controls the system. Images are transferred to a personal computer (PC or laptop) via its standard parallel port. No extra hardware is required (in particular, no frame grabber board is needed). In our first MPIV prototype presented in this paper, the strobe lighting is generated by a cheap 5 mW laser pointer diode. Experimental results are presented and discussed.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.35-41
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• 2016

Ceramic-metal based high power LED array package was developed via thick film LTCC technology using a glass-ceramic insulation layer and a silver conductor patterns directly printed on the aluminum heat sink substrate. The thermal resistance measurement using thermal transient tester revealed that ceramic-metal base LED package exhibited a superior heat dissipation property to compare with the previously known packaging method such as FR-4 based MCPCB. A prototype LED package sub-module with 50 watts power rating was fabricated using a ceramic-metal base chip-on-a board technology with minimized camber deformation during heat treatment by using partially covered glass-ceramic insulation layer design onto the aluminum heat spread substrate. This modified circuit design resulted in a camber-free packaging substrate and an enhanced heat transfer property compared with conventional MCPCB package. In addition, the partially covered design provided a material cost reduction compared with the fully covered one.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.28 no.7
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• pp.1-12
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• 2014

This paper is proposed to design the new heat-sink apparatus for improving the heat transfer characteristics in the power LED chip, and results of the operation characteristics were discussed. The core design is that the soldering through-hole on the FR-4 PCB board is formed to the effective heat transfer. That is directly filled with Ag-nano materials, which shows the high thermal conductivity. The heat transfer medium consisting of Ag-nano materials is classified into two structures. Mediums are called as the heat slug and the multi-pin in this work. The heat of the high temperature generated from the LED chip was directly transferred to the heat slug of the one large size. And the accumulated heat from the heat slug was quickly dissipated by the medium of the multi-pin, which is the same body with the heat slug. This multi-pin was designed for the multi-dissipation of heat by increasing the surface areas with a little pins. Subsequently, the speed of the heat transfer with this new heat-sink apparatus is three times faster than the conventional heat-sink. Therefore, the efficiency of the illuminating light will be improved by adapting this new heat-sink apparatus in the large area's LED.

• Journal of the Korea Society of Computer and Information
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• v.12 no.4
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• pp.249-256
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• 2007

AIn this paper, a new desist of LDI controller IC for general purpose is proposed for driving the LDI(LCD Driver Interface) controller in $4{\sim}9$ inches sized portable small-medium TFT-LCD(Thin Film Transistor addressed -Liquid Crystal Display) panel module. The designed LDI controller was verified on the FPGA(Reld Programmable Gate Array) test board, and was made the interactive operation with the commercial TFT-LCD panel successfully. The purpose of design is that it is standardized the LDI controller's operation by one LDI controller for driving all TFT-LCD panel without classifying the panel vendor, and size. The main advantage for new general-purpose LDI controller is the usage for the desist of all panel's SoG(System on a Glass) module because of the design for the standard operation. And in the previous method, it used each LDI controller for every LCD vendor, and panel size, but because a new one can drive all portable small-medium sized panel, it results in reduction of LDI controller supply price, and manufacturing cost of AV(Audio Video) board and panel. In the near future, the development of SoG IC(Integrated Circuit) for manufacturing more excellent functional TFT-LCD panel module is necessary. As a result of this research, the TFT-LCD panel can make more small size, and light weight, and it results in an upturn of domestic company's share in the world market. With the suggested theory in this paper, it expects to be made use of a basic data for developing and manufacturing for the SoG chip of TFT-LCD panel module.

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.24 no.4
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• pp.1-9
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• 2010

An LED driving and control circuit has been developed. The LED driver has a new PWM circuit for current control of LED columns with dimming, current and thermal control, and communication functions. The PWM circuit is composed of two ring oscillator and one counter which can be constructed using basic digital logic components. In addition, it has the functions of remote control mode such as ON, OFF, emergency and power saving modes by the serial communication. The PWM generator and control circuit have been designed and fabricated 0.35[${\mu}m$] Magnachip/Hynix digital IC fabrication process. The LED driving and control board using the developed chip is fabricated and tested successfully.

• International Commerce and Information Review
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• v.8 no.4
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• pp.71-88
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• 2006

This article want to discuss on comparative research between CHIPS and Fedwire as the cross-border payment systems which America have and use at present. CHIPS is a New York-based automated private-sector clearing facility for large-dollar transfers. It is a central switch communication and settlement system whose 53 participating banks exchange same-day payment messages over dedicated communication lines linking each one to the CHIPS central computer. On January 22, 2001, CHIPS introduced immediate finality for payment released from the CHIPS queue. Unlike the Fedwire system, The CHIPS system is not a real-time gross settlement system. Instead, CHIPS is hybrid system that uses a computer program to select payment order in a queue for release to the receiving bank. CHIPS are governed by CHIPS Rules and Administrative Procedures. Fedwire system is a nationwide electronic fund-transfer system facilitating same-day transfers throughout the United States. It is a gross settlement system providing immediate credit to the receiving bank's master account. Communicating between a Federal Reserve Bank and Fedwire users can be either on-line or off-line. Fedwire transfers are governed by Subpart B of Regulation J, issued by the Federal Reserve Board, which incorporates U.C.C. Article 4A but preempts or supersedes any of its inconsistent provisions.