• Title/Summary/Keyword: On-chip inductor

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Effect of B-Bi-Zn Addition on the Permeabilities of Hexagonal-ferrite (B-Bi-Zn 첨가가 hexagonal-ferrite 특성에 미치는 영향)

  • 정승우;백승철;김성수;최우성
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.07a
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    • pp.204-207
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    • 2000
  • In this paper, we have studied the effect of doped with B-Bi-Zn on properties (microstructure, density, shrinkage, permeability as a function of frequency, etc.) of hexagonal-ferrite for high frequency chip-inductor material about several GHz. The permeability were analyzed by impedance analyzer(100 kHz~40 MHz) and network analyzer(30 MHz~3 GHZ). As a result of the characteristics, the B-Bi-Zn glass ceramic was used to lower the sintering temperature for additive as a function of frequency from 100 kHz to 1.8 GHz showed constant tends. The maximum imaginary value of complex permeability was observed near the resonance frequency of 2 GHz.

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Maximum Current Estimation Method for the Backup of Current Sensor Faults

  • Kim, Jae-Yeon;Park, Si-Hyun;Suh, Young-Suk
    • Journal of information and communication convergence engineering
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    • v.18 no.3
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    • pp.201-206
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    • 2020
  • This paper presents a new method for controlling the current of lighting LEDs without current sensors. This method can be used as backup against LED current sensor faults. LED lighting requires a circuit with a constant current in order to maintain the same brightness when the ambient temperature changes. Therefore, we propose a new current estimation method to provide backup in case of current sensor faults based on the calculation of the inductor current. In the fabricated circuit, the average current changes from 144.03 mA to 155.97 mA when the ambient temperature changes from 0℃ to 60℃. The application of this study can enable the fabrication of a driving IC for LEDs in the form of a single chip without sensing resistors. This is expected to reduce the complexity of the peripheral circuit and enable precise feedback control.

Design of a 2.4GHz 2 stage Low Noise Amplifier for RF Front-End In a 0.35${\mu}{\textrm}{m}$ CMOS Technology

  • Kwon, Kisung;Hwang, Youngseung;Jung, Woong
    • Proceedings of the Korea Electromagnetic Engineering Society Conference
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    • 2002.11a
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    • pp.11-15
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    • 2002
  • 3 V, 2.46GHz Low Noise Amplifier (LNA) have been designed for standard 0.35$\mu\textrm{m}$ CMOS process with one poly and four metal layers. This design includes on-chip biasing, matching network and multilayer spiral inductors. The single-ended amplifier provides a forward gain of 20.5dB with a noise figure 3.35dB, and an IIP3 of -6dBm while drawing 59mW total Power consumption

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Planar Fashionable Circuit Board Technology and Its Applications

  • Lee, Seul-Ki;Kim, Bin-Hee;Yoo, Hoi-Jun
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.9 no.3
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    • pp.174-180
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    • 2009
  • A new flexible electronics technology, named P-FCB (Planar Fashionable Circuit Board), is introduced. P-FCB is a circuit board technology implemented on the plain fabric patch for wearable electronics applications. In this paper, the manufacturing of P-FCB, and its electrical characteristics such as sheet resistance, maximum current density, and frequency characteristics are reported. The fabrication methods and their electrical characteristics of passive devices such as resistor, capacitor, and inductor in P-FCB are discussed. In addition, how to integrate silicon chip directly to the fabric for the flexible electronics system are described. Finally, examples of P-FCB applications will be presented.

Design and Fabrication of a Phase Shifter RFIC using a Tunable Multi-layer Dielectric

  • Lee, Young Chul
    • Journal of Korea Society of Industrial Information Systems
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    • v.19 no.2
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    • pp.45-49
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    • 2014
  • In this work, a phase shifter radio-frequency integrated chip (RFIC) using a simple all-pass network is presented. As a tuning element of the phase shifter RFIC, tunable capacitors with a multi-layer dielectric of a para-/ferro-/para-electrics using a high tunable BST ferroelectric and a low-loss BZN paraelectric thin film were utilized. In order to evaluate and analyze the fabricated phase shifter RFIC, the same elements such as an inductor and capacitor integrated into it are also fabricated and tested. The designed phase shifter RFIC was fabricated on a quartz substrate in the size of $1.16{\times}1.21mm^2$. As the test results, the maximum phase difference of $350^{\circ}$ is obtained at 15 V and its tuning frequency bandwidth is 90 MHz from 2.72 to 2.81GHz.

An InGaP/GaAs HBT Based Differential Colpitts VCO with Low Phase Noise

  • Shrestha, Bhanu;Kim, Nam-Young
    • Journal of electromagnetic engineering and science
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    • v.7 no.2
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    • pp.64-68
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    • 2007
  • An InGaP/GaAs HBT based differential Colpitts voltage control oscillator(VCO) is presented in this paper. In the VCO core, two switching transistors are introduced to steer the core bias current to save power. An LC tank with an inductor quality factor(Q) of 11.4 is used to generate oscillation frequency. It has a superior phase noise characteristics of -130.12 dBc/Hz and -105.3 at 1 MHz and 100 kHz frequency offsets respectively from the carrier frequency(1.566 GHz) when supplied with a control voltage of 0 volt. It dissipates output power of -5.3 dBm. Two pairs of on-chip base collector (BC) diodes are used in the tank circuit to increase the VCO tuning range(168 MHz). This VCO occupies the area of $1.070{\times}0.90mm^2$ including buffer and pads.

Design of Super-regenerative Oscillator for Ultra Low Power Receiver Implementation (극소전력 수신기 구현을 위한 Super-regenerative Oscillator 설계)

  • Kim, Jeong-Hoon;Kim, Jung-Jin;Kim, Eung-Ju;Park, Ta-Jun
    • Proceedings of the IEEK Conference
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    • 2006.06a
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    • pp.625-626
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    • 2006
  • An Ultra low power super-regenerative oscillator was implemented with on-chip inductor and quench signal generator. The super-regenerative oscillator detects the signal level as low as -70dBm while consuming only 0.48mA at 1.5V supply voltage. These results indicate that the super-regenerative oscillator can be outstanding candidate the simple, ultra low power receiver design.

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A Study on a Meander line employing Periodic Patterned Ground Structure on GaAs MMIC (GaAs MMIC 상에서 주기적 접지구조를 가지는 미앤더 선로에 관한 연구)

  • Jung, Bo-Ra;Yun, Young
    • Journal of Advanced Marine Engineering and Technology
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    • v.34 no.2
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    • pp.325-331
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    • 2010
  • In this study, highly miniaturized short-wavelength meander line employing eriodically patterned ground structure (PPGS) was developed for application to miniaturized on-chip passive component on GaAs MMIC (monolithic microwave integrated circuit). The meander line employing PPGS showed shorter wavelength and slow-wave characteristic compared with conventional meander line. The wavelength of the meander line employing PPGS structure was 17 % of the conventional meander line on GaAs MMIC. Due to its slow-wave structure, the meander line employing PPGS exhibited large propagation constant than conventional meander line, which resulted in larger phase shift and shunt inductance value. Above results indicate that the meander line employing PPGS is a promising candidate for application to a development of miniaturized on-chip RF components as well as inductor with a high inductance value on GaAs MMIC.

Inductor-less 6~18 GHz 7-Bit 28 dB Variable Attenuator Using 0.18 μm CMOS Technology (0.18 μm CMOS 기반 인덕터를 사용하지 않는 6~18 GHz 7-Bit 28 dB 가변 신호 감쇠기)

  • Na, Yun-Sik;Lee, Sanghoon;Kim, Jaeduk;Lee, Wangyoung;Lee, Changhoon;Lee, Sungho;Seo, Munkyo;Lee, Sung Chul
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.27 no.1
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    • pp.60-68
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    • 2016
  • This paper presents a 6~18 GHz 7-bit digital-controlled attenuator. The proposed attenuator is based on switched-T architecture, but no inductor is used for minimum chip size. The designed attenuator was fabricated using $0.18{\mu}m$ CMOS process, and characterized using on-wafer testing setup. The resolution(minimum attenuation step) and the maximum attenuation range of the attenuator were measured to be 0.22 dB and 28 dB, respectively. The measured RMS attenuation error and the RMS phase error for 6~18 GHz were less than 0.26 dB and $3.2^{\circ}$, respectively. The reference state insertion loss was less than 12.4 dB at 6~18 GHz. The measured input and output return losses were better than 9.4 dB over all frequencies and attenuation states. The chip size is $0.11mm^2$ excluding pads.