• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.7
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• pp.328-334
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• 2002

The DNA chips are devices associating the specific recognition properties of two DNA single strands through hybridization process with the performances of the microtechnology. In the literature, the "Gene chip" or "DNA chip" terminology is employed in a wide way and includes macroarrays and microarrays. Standard definitions are not yet clearly exposed. Generally, the difference between macro and microarray concerns the number of active areas and their size, Macroarrays correspond to devices containing some tens spots of 500$\mu$m or larger in diameter. microarrays concern devices containing thousnads spots of size less than 500$\mu$m. The key technical parameters for evaluating microarray-manufacturing technologies include microarray density and design, biochemical composition and versatility, repreducibility, throughput, quality, cost and ease of prototyping. Here we report, a new method in which minute particles are arranged in a random fashion on a chip pattern using random fluidic self-assembly (RFSA) method by hydrophobic interaction. We intend to improve the stability of the particles at the time of arrangement by establishing a wall on the chip pattern, besides distinction of an individual particle is enabled by giving a tag structure. This study demonstrates the fabrication of a chip pattern, immobilization of DNA to the particles and arrangement of the minute particle groups on the chip pattern by hydrophobic interaction.ophobic interaction.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.188-195
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• 2004

In this paper, we fabricated fluidic devices like micro-channel, pump, mixer and particular gas separator with the technology of stereolithouaphy using RP(rapid-prototyping). The fabricated fluidic devices are expected to be applied to develop Lab-on-a chip type liquid analyzer. Stereolithography technology seems effective for fabricating MEMS(Micro Electro Mechanical System) with complicated structure because it makes three dimensional fabrication possible but, exclusive devices are needed to be developed fur fabricating even more microscopic MEMS structure.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.1-6
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• 2017

As the performance and density of IC devices increase, especially the clock frequency increases, power grid network integrity problems become more challenging. To resolve these power integrity problems, the use of passive devices such as resistor, inductor, and capacitor is very important. To manage the power integrity with little noise or ripple, decoupling capacitors are essential in electronic packaging. The decoupling capacitors are classified into voltage regulator capacitor, board capacitor, package capacitor, and on-chip capacitor. For next generation packaging technologies such as 3D packaging or wafer level packaging on-chip MIM decoupling capacitor is the key element for power distribution and delivery management. This paper reviews the use and necessity of on-chip decoupling capacitor.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.41-47
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• 2011

Currently, there is widespread adoption of silicon-based technologies for the implementation of radio frequency (RF) integrated passive devices (IPDs) because of their low-cost, small footprint and high performance. Also, the need for high speed data transmission and reception coupled with the ever increasing demand for mobility in consumer devices has generated a great interest in low cost devices with smaller form-factors. The UWB BPF makes use of lumped IPD technology on a silicon substrate CSMP (Chip Scale Module Package). In this paper, this filter shows 2.0 dB insertion loss and 15 dB return loss from 7.0 GHz to 9.0 GHz. To the best of our knowledge, the UWB band-pass-filter developed in this paper has the smallest size ($1.4\;mm{\times}1.2\;mm{\times}0.40\;mm$) while achieving equivalent electrical performance.

• Journal of Information Processing Systems
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• v.17 no.1
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• pp.191-202
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• 2021

In an Internet of Things (IoT)-configured system, each device executes on-chip software. Recent IoT devices require fast execution time of complex services, such as analyzing a large amount of data, while maintaining low-power computation. As service complexity increases, the service requires high-performance computing and more space for embedded space. However, the low performance of IoT edge devices and their small memory size can hinder the complex and diverse operations of IoT services. In this paper, we propose a remote on-demand software code execution unit using the cloudification of on-chip code memory to accelerate the program execution of an IoT edge device with a low-performance processor. We propose a simulation approach to distribute remote code executed on the server side and on the edge side according to the program's computational and communicational needs. Our on-demand remote code execution unit simulation platform, which includes an instruction set simulator based on 16-bit ARM Thumb instruction set architecture, successfully emulates the architectural behavior of on-chip flash memory, enabling embedded devices to accelerate and execute software using remote execution code in the IoT environment.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.20 no.12
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• pp.1264-1271
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• 2009

In this paper, the chip slot antenna which is used for mobile devices and designed for multi-band is proposed. The proposed antenna is comprised of a chip antenna(10 mm$\times$20 mm$\times$1.27 mm) and a system circuit board(30 mm$\times$60 mm$\times$0.8 mm). The chip slot antenna is mounted on the system circuit board and the end of F-type strip line which is patterned on the chip antenna is connected by a via with a ground plane of the system circuit board. So, a chip antenna radiates effectively the energy by transition between a microstrip line of the system circuit board and a open slot structure of the chip antenna. In the results of proposed antenna, impedance bandwidth of 3:1 VSWR(-6 dB return loss) is 1.98 GHz(1.61~3.59 GHz) and 0.8 GHz(5.2~6 GHz). So, it can cover multi-band of DCS, PCS, UMTS, WLAN. The proposed antenna can be applied to mobile devices.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.51-51
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• 2012

There is a growing interest in innovative chemical synthesis in microreactors owing to high efficiency, selectivity, and yield. In microfluidic systems, the low-volume spatial and temporal control of reactants and products offers a novel method for chemical manipulation and product generation. Glass, silicon, poly(dimethylsiloxane) (PDMS), and plastics have been used for the fabrication of miniaturized devices. However, these materials are not the best due to either of low chemical durability or expensive fabrication costs. In our group, we have recently addressed the demand for economical resistant materials that can be used for easy fabrication of microfluidic systems with reliable durability. We have suggested the use of various specialty polymers such as silicon-based inorganic polymers and fluoropolymer, flexible polyimide (PI) films that have not been used for microfluidic devices, although they have been used for other areas. And inexpensive lithography techniques were used to fabricate Lab-on-a-Chip type of microreactors with differently devised microchannel design. These microreactors were demonstrated for various synthetic reactions: liquid, liquid-gas organic chemical reactions in heterogeneous catalytic processes, syntheses of polymer and non-trivial inorganic materials. The microreactors were inert, and withstand even harsh conditions, including hydrothermal reaction. In addition, various built-in microstructures inside the microchannels, for example Pd decorated peptide nanowires, definitely enhance the uniqueness and performance of microreactors. These user-friendly Lab-on-a-Chip devices are useful alternatives for chemist and chemical engineer to conventional chemical tools such as glass.

• 한국생물공학회:학술대회논문집
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• 2005.04a
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• pp.18-18
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• 2005

Photoinduced electron transport process in nature such as photoelectric conversion and long-range electron transfer in photosynthetic organisms are known to occur not only very efficiently but also unidirectionally through the functional groups of biomolecules. The basic principles in the development of new functional devices can be inspired from the biological systems such as molecular recognition, electron transfer chain, or photosynthetic reaction center. By mimicking the organization of the biological system, molecular electronic devices can be realized $artificially^{1)}$. The nano-fabrication technology of biomolecules was applied to the development of nano-protein chip for simultaneously analyzing many kinds of proteins as a rapid tool for proteome research. The results showed that the self-assembled protein layer had an influence on the sensitivity of the fabricated bio-surface to the target molecules, which would give us a way to fabricate the nano-protein chip with high sensitivity. The results implicate that the biosurface fabrication using self-assembled protein molecules could be successfully applied to the construction of nanoscale bio-photodiode and nano-protein chip based on electrical detection.

• Journal of Biomedical Engineering Research
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• v.36 no.5
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• pp.169-176
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• 2015

Implantable closed-loop epilepsy controllers require ideally both accurate epileptic seizure detection and low power consumption. On-chip oscillators can be used in implantable devices because they consume less power than other oscillators such as crystal oscillators. In this study, we investigated the tolerable error range of a lower power on-chip oscillator without losing the accuracy of seizure detection. We used 24 ictal and 14 interictal intracranial electroencephalographic segments recorded from epilepsy surgery patients. The performance variations with respect to oscillator frequency errors were estimated in terms of specificity, modified sensitivity, and detection timing difference of seizure onset using Generic Osorio Frei Algorithm. The frequency errors of on-chip oscillators were set at ${\pm}10%$ as the worst case. Our results showed that an oscillator error of ${\pm}10%$ affected both specificity and modified sensitivity by less than 3%. In addition, seizure onsets were detected with errors earlier or later than without errors and the average detection timing difference varied within less than 0.5 s range. The results suggest that on-chip oscillators could be useful for low-power implantable devices without error compensation circuitry requiring significant additional power. These findings could help the design of closed-loop systems with a seizure detector and automated stimulators for intractable epilepsy patients.

• Electronics and Telecommunications Trends
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• v.32 no.6
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• pp.8-16
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• 2017

In this paper, we review studies attempting to triumph over the limitation of Si-based semiconductor technologies through a heterogeneous integration of high mobility compound semiconductors on a Si substrate, and the co-integration of electronic and/or optical devices. Many studies have been conducted on the heterogeneous integration of various materials to overcome the Si semiconductor performance and obtain multi-purpose functional devices. On the other hand, many research groups have invented device fusion technologies of electrical and optical devices on a Si substrate. They have co-integrated Si-based CMOS and InGaAs-based optical devices, and Ge-based electrical and optical devices. In addition, chip and wafer bonding techniques through TSV and TOV have been introduced for the co-integration of electrical and optical devices. Such intensive studies will continue to overcome the device-scaling limitation and short-channel effects of a MOS transistor that Si devices have faced using a heterogeneous integration of Si and a high mobility compound semiconductor on the same chip and/or wafer.