• Korean Journal of Acupuncture
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• 제37권4호
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• pp.253-261
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• 2020

Objectives : This study aimed to evaluate adverse outcome associated with acupotomy and compare it with that of acupuncture. Methods : We retrospectively analyzed the chart records of 71 patients who received acupotomy at Daemyung Korean medical clinic from January 7, 2020 to March 6, 2020. We divided the acupotomy treatment area into 10, including the head, hand, chest, knees, shoulders, low back, neck, upper extremities, thighs, and feet. Furthermore, we investigated the adverse effect of acupotomy on those areas after treatment. Data were analyzed using descriptive statistics, and frequency analysis. Results : 'Bruise of specific region' accounted for the largest portion with 29 cases, followed by 24 cases of 'feeling tired and sleepy' and 17 cases of 'itch'. There were 16 cases of 'sustained pain' at the area of treatment, 11 cases of 'fatigue', 5 cases of 'swelling', 5 cases of 'dizziness', 4 cases of 'hematoma'. There were 3 cases of 'vertigo' and 2 cases of 'parathesia' and 'wide bruises', 'headache', 'gastric discomfort', 'bleeding', and 'skin rash' each. There was one case each that experienced 'unclear pronunciation', 'nausea', 'abnormal sweating', 'vomiting' and 'emotional/psychological reactions'. Conclusions : Adverse outcomes associated with acupotomy were mostly 'bruise of specific region', 'feeling tired and sleepy', 'itch', 'sustatained pain', and 'fatigue'. However, no adverse outcome or irreversible damage that have a serious effect on the body were observed.

• Journal of the Korean Wood Science and Technology
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• 제15권2호
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• pp.67-78
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• 1987

This study was designed to investigate the effect of board thickness and ring angle on the characteristics including internal check. ring failure, surface check, end check, collapse, thickness shrinkage and width shrinkage of press-drying. The exprimental materials of 6mm-. 9mm- and 12mm-thick board were taken from heartwood and sapwood of oak (Quercus acutissima Carr.) respectively. And boards were numbered according to position in the log(No. 1 to No. 4 for heartwood :md No. 9 for sapwood). Press-drying was at $145^{\circ}C$ platen temperature and 3.5kg/$Cm^2$ platen pressure. The results of this study were summarized as follows. 1. Drying rates for sapwood materials were greater than those for heartwood materials. And drying rates for thinner materials were greater than those for thicker materials. 2. The thinner boards were. the severer surface checking developed in the heartwood materials, and surface checking for heartwood materials had no tendency in board position for the same thickness. Sapwood materials were completely free from surface checking. 3. End checking for heartwood materials had no tendency in board position. The greater deviation of ring angle from perfectly edge-grained was, the severer and checking developed in the sapwood materials. But end checking did not occur in 6mm-thick sapwood materials. 4. The greater deviation of ring angle from perfectly edge-grained was, the severer end checking developed for heartwood and sapwood materials. As board thickness increased, maternal checking developed more severely for heartwood and sapweed materials. 5. For heartwood materials, ring failure, reduced with increasing deviation of ring angle from perfectly edge-grained except 12mm-thick material and showed no significant difference attributable to board thickness. Sapwood materials were completely free from ring failure. 6. For heartwood and sapwood materials, collapse was slight and showed no significant differences attributable to both board thickness and board position. 7. As deviation of ring angle from perfectly edge-grained increased, shrinkage of board thickness decreased for heartwood and sapwood materials. 8. Shrinkage of board width showed no significant differences attributable to both board thickness and board position for heartwood and sapweed materials.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 동굴
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• 제93호
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• pp.1-11
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• 2009

개방 동굴 내의 안내판은 지형지물에 대한 명칭이나 설명문을 포함되어 있으며, 동굴을 찾는 관광객에게 중요한 정보를 전달하는 매체로서의 역할을 하고 있다. 그러나 실제로 명칭 및 안내문에는 많은 오류를 비롯하여 관람객에게 혼동을 주거나 올바르지 않은 정보를 제공하는 결과를 초래하고 있다. 이러한 정보전달의 매체로서의 중요성을 인식하고 그 문제점을 파악하였다. 첫째, 대부분 동굴 지형의 학술적 명칭보다는 지형지물의 형태에 따른 추상적인 명칭이 부여되고 있다. 둘째, 대부분의 지형지물에 대한 명칭만이 부여되어 학술적 설명문이 미약하여 정보 매체로서의 역할이 부족하다. 셋째, 설명문의 경우, 잘못된 표현이나 오류가 보이며, 학술적으로 논란이 있는 부분을 객관적이지 못한 설명이 되어있다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.630-633
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• 2004

Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and BGA solder joint s failure. The first order Taylor series expansion of the limit state function incorporating with thermal fatigue models is used in order to estimate the failure probability of solder joints under heated condition. A model based on plastic-strain rate such as the Coffin-Manson Fatigue Model is utilized in this study. The effects of random variables such as frequency, maximum temperature, and temperature variations on the failure probability of the BGA solder joint are systematically investigated by using a failure probability model with the first order reliability method(FORM).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.173-175
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• 2005

The effects of PCB Board on the filter characteristics such as insertion loss and transmission characteristics were investigated for the measurement of 5GHz LC filter. Insertion loss measured with PCB Board of Teflon is 0.3 dB lower in comparion with FR-4. The filter characteristics measured in the passband were different from the calculated results. In comparison with the calculated value, the measured value shows that center frequency is 20MHz lower, passband is narrower and insertion loss is larger. The difference of Insertion loss between Teflon and FR-4 increases with increasing measurement frequency.

• 웰빙융합연구
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• 제3권1호
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• pp.1-10
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• 2020

The purpose of this study was to examine the moderating effect of board education diversity on the relationship between ownership concentration and environmental accounting disclosure. The study was driven by stakeholder's theory. The longitudinal research design was adopted in the study. The study targeted 27 listed firms from 2008 to 2017. Panel regression analysis results indicated ownership concentration (β = -.131, ρ<.05) had a negative and significant effect on environmental disclosure in Kenyan firms. However, Board education diversity positively moderated the relationship between ownership concentration (β=.138, ρ<.05) and environmental accounting disclosure. Thus, board education diversity is an enhancing moderator in the relationship between ownership concentration and environmental accounting disclosure. The findings validate stakeholder theory's proposition. The study recommends that firms listed in the NSE ought to diffuse ownership concentration, and their boards should be well educated and experienced to enhance environmental accounting disclosure.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2006년도 추계 학술발표회 논문집
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• pp.853-856
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• 2006

It is known that cement production not only consumes large amount of energy but also contributes substantially to the green house gas emission. Therefore, there is a demand to develope a new technology to produce energy efficient and environmental conscious cements. The most recent, wood wool ceramic board is being applied in various building material field, for example thermal insulating and acoustic absorption material. This paper focused on improvement of the physical properties for wood wool ceramic board applied inorganic polymer binder. As the result of this experiment, what we could obtain better wood wool ceramic board's properties such as density, water contests, water resistance and band strength, was 0.46, $10{\sim}12%$, 1.9% and $40kgf/cm^2$. This result can be applicable to commercial wood wool ceramic board.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2001년도 토목섬유기술위원회 학술세미나 논문집
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• pp.33-44
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• 2001

The generally known vertical drain methods for improvement of soft ground are Sand Drain, Sand Compaction Pile, Plastic Drain Board, and Pack Drain. Recently, Plastic Drain Board method application in soft ground is widely used. In this case study, it is compared with each other vertical drain methods from the results of monitorning and test embankment. The results of the analysis and the study show that Plastic Drain Board method is relatively acceptable as vertical drain method.