• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.242-243
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• 2015

Fault detection using optical emission spectra with modified K-means cluster analysis and principal component anal ysis are demonstrated for inductive coupl ed pl asma cl eaning processes. The optical emission spectra from optical emission spectroscopy (OES) are used for measurement. Furthermore, Principal component analysis and K-means cluster analysis algorithm is modified and applied to real-time detection and sensitivity enhancement for fluorocarbon cleaning processes. The proposed techniques show clear improvement of sensitivity and significant noise reduction when they are compared with single wavelength signals measured by OES. These techniques are expected to be applied to various plasma monitoring applications including fault detections as well as chamber cleaning endpoint detection.

• Bulletin of the Korean Chemical Society
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• v.35 no.1
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• pp.69-75
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• 2014

Accurate analysis of fly ash particles is not trivial because of complex nature in physical and chemical properties. SPLITT fractionation (SF) was employed to fractionate the fly ash particles into subpopulations in large quantities. Then the SF-fractions were analyzed by the steric mode of sedimentation field-flow fractionation (Sd/StFFF) for size analysis. The SF-fractions were also analyzed by ICP-OES. The results showed that the fly ash is mainly composed of Fe, Ca, Mg and Mn. No particular trends were observed between the particle size and the concentrations of Fe, Ca, Mg, while Mn, Cu and Zn were in higher concentrations in smaller particles. Sample preparation procedures were established, where the fly ash particles were sieved to remove large contaminants, and then washed with acetone to remove organics on the surface of particles. The sample preparation and analysis methods developed in this study could be applied to other environmental particles.

• Journal of the Korean Applied Science and Technology
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• v.21 no.4
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• pp.320-326
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• 2004

We have extracted the natural pine-needles to use ethanol in solvent, and could obtain the refined oil component from pine-needles extract. We have tested the antimicrobial effect from microbe experiment and analyzed with ICP/OES, GC/MS. we could obtain the next conclusion from the result of this experiment. In the first result of this experiment we could know that in case of increasing concentration of pine-needles, the number of microbe decreased more and more. Also we could know that the refined oil component of pine-needles appeared the sterilization effect of S-aureus and E-coli after 96hrs and 120hrs. So we could know that the refined oil component of appeared effect to microbe. In the second result of this experiment we could know that inorganic materials of Ca, Mg, V, Mn etcs from pine-needles detected to ICP/OES analysis and the aromatic compounds from refined oil component of pine-needles was certificated to GC/MS analysis.

• Proceedings of the KIEE Conference
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• 2007.10a
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• pp.403-404
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• 2007

소자 수율을 향상시키기 위해서는 웨이퍼 전체에 걸쳐 플라즈마 공정특성이 균일하게 분포되어야 한다. 본 연구에서는 Actinomeric 광 반사분광기 (Otical Emission Spectroscopy) 정보를 이용하여 식각률 비균일도에 대한 모델을 개발하였다. 제안된 기법은 Oxide 식각공정에서 수집한 데이터에 적용하였으며, 체계적인 모델링을 위해 공정데이터는 통계적 실험계획 법을 적용하여 수집되었다. 신경망의 예측성능은 유전자 알고리즘을 이용해서 증진시켰다. OES의 차수를 줄이기 위해 주인자 분석을 세 종류의 분산(100, 99, 98%)에 대해서 적용하였다. 개발된 모델은 발표된 이전의 모델에 비해 17% 증진된 예측성능을 보였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.10
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• pp.804-808
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• 1998

The inductively coupled plasma(ICP) etching of platinum with BCl$_3$/Cl$_2$ gas chemistry has been studied. X-ray photoelectron spectroscopy (XPS) was used to investigate the chemical binding states of the etched surface. The plasma characteristics was extracted from optical emission spectroscopy (OES) and a single Langmuir probe. In this case of Pt etching using BCl$_3$/Cl$_2$ gas chemistries, the result of OES and Langmuir probe showed the increase of Cl radicals and ion current densities in the plasmas with increasing Cl$_2$ gas ratio. At the same time, XPS results indicated that the intensities of Pt 4f decreased with increasing Cl$_2$ gas ratio. The decrease of Pt 4f intensities implies the increase of residue layer thickness on the etched Pt surface.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2002.11a
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• pp.130-136
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• 2002

Device makers want to make higher density chips as devices shrink, especially WSix poly stack down is one of the key issues. However, EPD (End Point Detection) time delay was happened in DPS+ poly chamber which is a barrier to achieve device shrink because EPD time delay killed test pattern and next generation device. To investigate the EPD time delay, a test was done with patterned wafers. This experimental was carried out combined with OES(Optical Emission Spectroscopy) and SEM (Scanning Electron Microscopy). OES was used to find corrected wavelength in WSix stack down gate etching. SEM was used to confirm WSix gate profile and gate oxide damage. Through the experiment, a new wavelength (252nm) line of plasma is selected for DPS+ chamber to call correct EPD in WSix stack down gate etching for current device and next generation device.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.209-212
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• 2001

Polyimide(PI) films have been considered as the interlayer dielectric materials due to low dielectric constant, low water absorption, high gap-fill and planarization capability. The PI film was etched with using inductively coupled plasma (ICP). The etching characteristics such as etch rate and selectivity were evaluated to gas mixing ratio. High etch rate was 8300$\AA$/min and vertical profile was approximately acquired 90$^{\circ}$ at CF$_4$/(CF$_4$+O$_2$) of 0.2. The selectivies of polyimide to PR and SiO$_2$ were 1.2, 5.9, respectively. The etching profiles of PI films with an aluminum pattern were measured by a scanning electron microscope (SEM). The chemical states on the PI film surface were investigated by x-ray photoelectron spectroscopy (XPS). Radical densities of oxygen and fluorine in different gas mixing ratio of 07CF4 were investigated by optical emission spectrometer (OES).

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1380-1381
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• 2006

본 연구는 MgO 박막을 유도 결합 플라즈마를 이용하여, $CF_4/Ar$ 가스 혼합비로 식각하였고, RF 전력, DC-bais 전압과 Process Pressure를 변경하면서 실험하였다. 빛 방출 분석(optical emission spectroscopy, OES)을 이용하여, 플라즈마 진단과 식각 특성과의 관계를 분석하였다. OES 결과로부터 $CF_4$ 첨가비를 50%까지는 증가시킴에 따라 식각률이 증가하였고, 그 후에 Ar 이온이 감소함으로써 식각률이 감소하였다. MgO 박막의 최고 식각률은 50%의 $CF_4/(CF_{4}+Ar)$에서 700 W의 RF 전력, -150 V의 DC-bias 전압, 반응로 압력은 15 mTorr, 기판 온도는 $30^{\circ}C$로 고정시켰을 때 29nm/min이었다. 이 조건에서 MgO 박막과 $SiO_2$의 선택비는 0.06 이었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.123.2-123.2
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• 2013

Etching endpoint detection with plasma impedance monitoring (PIM) is demonstrated for small area dielectric layers inductive coupled plasma etching. The endpoint is determined by the impedance harmonic signals variation from the I-V monitoring system. Measuring plasma impedance has been examined as a relatively simple method of detecting variations in plasma and surface conditions without contamination at low cost. Cluster analysis algorithm is modified and applied to real-time endpoint detection for sensitivity enhancement in this work. For verification, the detected endpoint by PIM and real-time cluster analysis is compared with widely used optical emission spectroscopy (OES) signals. The proposed technique shows clear improvement of sensitivity with significant noise reduction when it is compared with OES signals. This technique is expected to be applied to various plasma monitoring applications including fault detections as well as end point detection.

• Analytical Science and Technology
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• v.12 no.5
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• pp.447-459
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• 1999

A study was conducted to compare three analytical methods for determination of hexavalent chromium in the welding fume. Precision and accuracy arc documented for colorimetric, ion chromatographic, and inductively coupled plasma-optical emission spectroscopic method. Evidence is presented that welding fume can affect the oxidation of trivalent chromium. A simple sonication extraction method, proposed in this study, instead of hot alkaline extraction has the advantage of minimizing the potential for chromium oxidation.