• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.366-367
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• 2006

Carbon nanotubes (CNTs) have attracted remarkable attention as reinforcement for composites owing to their outstanding mechanical properties. The CNT/Cu nanocomposite is fabricated by a novel fabrication process named molecular level process. The novel process for fabricating CNT/Cu composite powders involves suspending CNTs in a solvent by surface functionalization, mixing Cu ions with CNT suspension, drying, calcination and reduction. The molecular level process produces CNT/Cu composite powders whereby the CNTs are homogeneously implanted within Cu powders. The mechanical properties of CNT/Cu nanocomposite, consolidated by spark plasma sintering of CNT/Cu composite powders, shows about 3 times higher strength and 2 times higher Young's modulus than those of Cu matrix.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.1
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• pp.20-30
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• 2001

A 1.8V $650{\;}\textrm{mm}^2$ 4Gb DRAM having $0.10{\;}\mu\textrm{m}^2$ cell size has been successfully developed using 0.11 $\mu\textrm{m}$DRAM technology. Considering manufactur-ability, we have focused on developing patterning technology using KrF lithography that makes $0.11{\;}\mu\textrm{m}$ DRAM technology possible. Furthermore, we developed novel DRAM technologies, which will have strong influence on the future DRAM integration. These are novel oxide gap-filling, W-bit line with stud contact for borderless metal contact, line-type storage node self-aligned contact (SAC), mechanically stable metal-insulator-silicon (MIS) capacitor and CVD Al process for metal inter-connections. In addition, 80 nm array transistor and sub-80 nm memory cell contact are also developed for high functional yield as well as chip performance. Many issues which large sized chip often faces are solved by novel design approaches such as skew minimizing technique, gain control pre-sensing scheme and bit line calibration scheme.

• The Journal of the Korea Contents Association
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• v.17 no.11
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• pp.501-514
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• 2017

The 1920s 'cinema-novel' is composed of various media effects based on cinematic imagination, and it is designed to constantly evoke the image of the film during the reading process. This article focuses on 'cinema-novel' as an example of an unprecedented genre experiment. It is because the process of formation and development of this unique genre is filled with contemporary characteristics of the 1920s art that strived to create a content suitable for the modern art medium.

• 한국정보디스플레이학회:학술대회논문집
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• 2000.01a
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• pp.9-10
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• 2000

The wide viewing angle and fast response time characteristics of negative dielectric anisotropy nematic liquid crystal (NLC) using a novel vertical-alignment (VA) - 1/4 ${\pi}$ cell mode on a homeotropic alignment layer were investigated. Good voltage-transmittance curves and low driving voltage using the novel VA - 1/4 ${\pi}$ cell mode without a negative compensation film were obtained. The iso-viewing angle characteristics of NLC using the novel VA - 1/4 ${\pi}$ cell mode without a negative compensation film can be achieved. The fast response time of 24.4 ms in NLC was successfully measured. The iso-viewing angle, fast response time, and low driving voltage characteristics using the novel VA - 1/4 ${\pi}$ cell mode can be achieved.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.3
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• pp.269-275
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• 2014

Conventional machining technologies such as a milling process have limitations in accuracy to fabricate microstructures. Deep X-ray lithography using the synchrotron radiation is a promising micromachining process with an excellent accuracy, whereas there are difficulties in the fabrication of multi-layered structures. Therefore, it is mainly used for fabricating simple mono-layered microstructures with a high aspect ratio. In this study, a novel technology for fabricating multi-layered microstructures is proposed by combining two processes. In advance, an X-ray resist material is cut and machined into various shapes and heights by the micro milling process. Subsequent X-ray irradiation process facilitates the fabrication of multi-layered microstructures. The proposed technology can overcome the limitation of the pattern accuracy in conventional milling process and the difficulty of the multi-layered machining in x-ray process. The usefulness of the proposed technology is demonstrated in this study by applying the technique in the realization of various multi-layered microstructures.

• ETRI Journal
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• v.37 no.2
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• pp.387-394
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• 2015

A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.

• ETRI Journal
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• v.34 no.5
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• pp.706-712
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• 2012

In previous work, novel maskless bumping and no-flow underfill technologies for three-dimensional (3D) integrated circuit (IC) integration were developed. The bumping material, solder bump maker (SBM) composed of resin and solder powder, is designed to form low-volume solder bumps on a through silicon via (TSV) chip for the 3D IC integration through the conventional reflow process. To obtain the optimized volume of solder bumps using the SBM, the effect of the volumetric mixing ratio of resin and solder powder is studied in this paper. A no-flow underfill material named "fluxing underfill" is proposed for a simplified stacking process for the 3D IC integration. It can remove the oxide layer on solder bumps like flux and play a role of an underfill after the stacking process. The bumping process and the stacking process using the SBM and the fluxing underfill, respectively, for the TSV chips are carefully designed so that two-tier stacked TSV chips are sucessfully stacked.

• Proceedings of the Korean Environmental Health Society Conference
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• 2005.06a
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• pp.394-398
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• 2005

This study aimed to develop a novel anaerobic two-stage process converting food waste to $H_2$ and $CH_2$. The anaerobic two-stage process was devised by combining hydrogen fermentation with methane fermentation. At the high loading rate of 12.3 kg $Vs/m^3/d$, it could remove 72.5%of VS and convert $VS_{removed}$ to $H_2$ (28.2%) and $CH_4$ (69.9%) on COD basis in 8 days.

• 한국생물공학회:학술대회논문집
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• 2002.04a
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• pp.423-426
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• 2002

A novel process for $H_2S$ gas treatment has been introduced, based on the combined action of a chemical absorption step and a biological step involving the biocatalytic activity of the bacterium Thiobacillus ferrooxidans. The aim of this study is the development of a process for $H_2S$ elimination from gas streams based on that chemical/biological method. The immobilized biomass reactor/chemical adsorption system is suitable for application of the removal of $H_2S$. A double stage reactor was used for the experimental work. The removal efficiencies of over 99% were observed in the range of inlet $H_2S$ concentration from 200 to 1,000ppm. The novel process showed the stable elimination efficiencies of over 95% under the retention time range from 20 to 40sec at the 1,000ppm of $H_2S$ inlet concentration.

• Laser Solutions
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• v.12 no.4
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• pp.17-25
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• 2009

The surface cleaning method based on the laser-induced breakdown (LIB) of gas and subsequent plasma and shock wave generation can remove small particles from solid surfaces. In the laser shock cleaning (LSC) process, a high-power laser pulse induces optical breakdown of the ambient gas above the solid surface covered with contaminant particles. The subsequently created shock wave followed by a high-speed flow stream detaches the particles. In this work, a novel surface cleaning process using laser-induced breakdown of liquid is introduced and demonstrated. LIB of a micro liquid jet increases the shock wave intensity and thus removes smaller particle than the conventional LSC method. Experiments demonstrate that the cleaning force and cleaning efficiency are also increased significantly by this method.