Design of A$1_2$ $O_3$ substrate for the increasing fracture toughness
(A$1_2$ $O_3$ 기판 재료의 $K_{IC}$ 증가를 위한 재료 설계)
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- Proceedings of the International Microelectronics And Packaging Society Conference
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- 2002.11a
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- pp.177-179
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- 2002